Influence of aging time and temperature on diffusion of alloyed copper

• Autorzy: Konieczny J. , Rdzawski Z. , Bańbura P. , Preficz B.
• Języki publikacji: EN

Abstrakty

EN

Purpose: The aim of this study is to determine the impact of aging time and temperature on the diffusion process of alloying elements inside alloyed copper CuCr0,7, CuFe2 and CuTi4. Design/methodology/approach: It was assumed the activation energy for diffusion of small interstitial atoms is smaller than for large substitute atoms. To determine the influence of aging time and temperature on diffusion of alloying elements in binary copper-based alloys CuCr0,7, CuFe2 and CuTi4 it has been necessary to develop a suitable mathematical model. It has been shown that with the increase of time t, the diffusion pathway L is increased, but the impact of time is not as large as the effect forced by altering temperature. In general, multiple increase of time is equivalent to increasing the temperature by a few degrees. Findings: The model should be used to estimate the average atom pathway of chromium, iron or titanium in copper matrix, caused by diffusion, and the diffusion path into the grain boundary without adsorption as a function of time and temperature aging Research limitations/implications: The model should be used to calculate the influence of temperature and time of aging on the atoms diffusion pathway of the alloying elements in the selected alloyed copper types. Practical implications: The results allow to calculate the average atom pathway L (with reasonable error level) for which the diffused atoms achieve the amount of free energy required to overcome the energetic barrier, on the basis of a combination of heat treatment parameters. Originality/value: This paper presents the impact of the aging temperature on diffusion in the alloyed copper CuCr0.7, CuFe2 and CuTi4.

Słowa kluczowe

EN

diffusion; computational material science; alloyed copper; heat treatment

PL

dyfuzja; komputerowa nauka o materiałach; miedź wysokostopowa; obróbka cieplna

• Wydawca: International OCSCO World Press
• Czasopismo: Journal of Achievements in Materials and Manufacturing Engineering
• Rocznik: 2015
• Tom: Vol. 73, nr 1
• Strony: 27--35
• Opis fizyczny: Bibliogr. 23 poz., rys., tab.

Twórcy

autor

Konieczny J.

• Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland

autor

Rdzawski Z.

• Institute of Non-Ferrous Metals, ul. Sowińskiego 5a, 44-100 Gliwice, Poland

autor

Bańbura P.

• Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland

autor

Preficz B.

• Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland
• Institute of Polymer Materials and Dyes Engineering, ul. Chorzowska 50A, 44-100 Gliwice, Poland

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