On 3D anticrack problem of thermoelectroelasticity

• Autorzy: Kaczyński A.

Identyfikatory

DOI

10.2478/ama-2018-0018

• Języki publikacji: EN

Abstrakty

EN

A solution is presented for the static problem of thermoelectroelasticity involving a transversely isotropic space with a heat-insulated rigid sheet-like inclusion (anticrack) located in the isotropy plane. It is assumed that far from this defect the body is in a uniform heat flow perpendicular to the inclusion plane. Besides, considered is the case where the electric potential on the anticrack faces is equal to zero. Accurate results are obtained by constructing suitable potential solutions and reducing the thermoelectromechanical problem to its thermomechanical counterpart. The governing boundary integral equation for a planar anticrack of arbitrary shape is obtained in terms of a normal stress discontinuity. As an illustration, a closed-form solution is given and discussed for a circular rigid inclusion.

Słowa kluczowe

EN

thermoelectroelasticity; heat flow; anticrack; singular integral equation; thermal stress singularities

• Wydawca: Oficyna Wydawnicza Politechniki Białostockiej
• Czasopismo: Acta Mechanica et Automatica
• Rocznik: 2018
• Tom: Vol. 12, no. 2
• Strony: 109--114
• Opis fizyczny: Bibliogr. 12 poz., rys.

Twórcy

autor

Kaczyński A.

• Faculty of Mathematics and Information Science, Warsaw University of Technology, Koszykowa 75, 00-662 Warsaw

Bibliografia

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