Przegląd metod pomiaru szczelności elementów elektronicznych

• Autorzy: Kubicki M.
• Języki publikacji: PL

Abstrakty

PL

Artykuł przedstawia przegląd metod pomiaru szczelności elementów elektronicznych zawartych w standardach przemysłowych oraz przedstawianych w literaturze alternatywnych metod pomiaru.

EN

The article present review of methods for hermeticity testing of electronic components included in the industrial standards and alternative methods presented in the literature.

Słowa kluczowe

PL

metody pomiaru szczelności; elementy elektroniczne

EN

hermeticity testing methods; electronic components

• Wydawca: Wydawnictwo Uczelniane Politechniki Koszalińskiej
• Czasopismo: Zeszyty Naukowe Wydziału Elektroniki i Informatyki Politechniki Koszalińskiej
• Rocznik: 2012
• Tom: Nr 4
• Strony: 67--82
• Opis fizyczny: Bibliogr. 26 poz., tab., wykr., rys.

Twórcy

autor

Kubicki M.

• Katedra Podstaw Elektroniki Wydział Elektroniki i Informatyki Politechnika Koszalińska ul. Śniadeckich 2, 74-453 Koszalin

Bibliografia

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• 2. Wong C.P., Fang T., Fundamentals of Microsystems Packaging, Chapter 15: Fundamentals of Sealing and Encapsulation, McGraw-Hill, 2004
• 3. Military Standard MIL-STD-202G, Method 112E, Seal, U.S. Department of Defense, 2003
• 4. Military Standard MIL-STD-750D, Method 1071.6, Hermetic Seal, U.S. Department of Defense, 1995
• 5. Military Standard MIL-STD-883H, Method 1014.13, Seal, U.S. Department of Defense, 2010
• 6. Polska norma PN-EN 60068-2-17, Badania Środowiskowe, Próby. Próba Q: Szczelność, Polski Komiter Normalizacyjny, 2001
• 7. JEDEC Standard, JESD22-A1-9-A, Hermeticity, JEDEC Solid State Technology Association, 2001
• 8. Lellouchi D., Dhennin J., Lafontan X., Veyrie D., Le Neal J. F., Pressecq F., A new method for the hermeticity testing of wafer-level packaging, Journal of Micromechanics and Microengineering Vol. 20, No. 2, 2010
• 9. Veyrie D., Roux J., Pressecq F., Tetelin A., Pellet C., A new method to assess the hermeticity of mems micro-packages, Proceedings of the 5th ESA Round table on micro/nano technologies for space, Noordwijk, Netherlands, 2005
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• 17. Rank H., M ler-Fiedler R., Wittler, O., Reichl H., Hermeticity of eutectic bond layers for sensor packages on wafer-level, Electronic System-Integration Technology Conference (ESTC), Berlin, Germany, 2010
• 18. Grange H., Danel J.S., Feldis H., Desloges B., Jousseaume V., Licitra C., Manquat P.B., Grosgeorges P., Fassi, B., Sbiaa Z., Robert P., A new method for hermeticity measurements using porous ultra low k dielectrics for sub-ppm moisture detection, Solid-State Sensors, Actuators and Microsystems Conference, Denver, USA, 2009
• 19. Cheng, Y.T., Liwei Lin, Najafi, K., Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding, The Thirteenth Annual International Conference on Micro Electro Mechanical Systems, Miyazaki, Japan, 2000
• 20. Margomenos A., Katehi L.P.B., Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS, IEEE Transactions on Microwave Theory and Techniques, Vol. 52, Issue 6, 2004
• 21. Seigneur F., Maeder T, J. Jacot J., Laser soldered packaging hermeticity measurement using metallic conductor resistance, XXX International Conference of IMAPS Poland Chapter, Kraków, 2005
• 22. Vass-Varnai A., Rencz, M., Package hermeticity testing with thermal transient measurements, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Nice, France, 2008
• 23. Roesch W.J., Peterson S., Poe A., Brockett S., Mahon S., Bruckner J., Assessing Circuit Hermeticity by Electrolysis, GaAs Mantech Conference, Washington DC, USA, 2000
• 24. Maliński M., Determination of air-tightness of the packagings of electronic devices by the thermoacoustic method, Archives of Acoustics, Vol. 30, No. 3, 2005
• 25. Maliński M., Application of a Thermoacoustic Method for the Determination of Air-Tightness of the Packagings of Electronic Devices, Acta Acustica United with Acustica, Vol. 91, No. 2, 2005
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