Impact of processing parameters on the LTCC channels geometry

• Autorzy: Macioszczyk J. , Malecha K. , Stafiniak A. , Golonka L. J.

Identyfikatory

DOI

10.1515/msp-2015-0104

• Języki publikacji: EN

Abstrakty

EN

A great advantage of Low Temperature Co-fired Ceramics (LTCC) yields the possibility of channel and air cavity fabrication. Such empty spaces have numerous applications, for example, in microfluidics, microwave techniques and integrated packaging. However, improper geometry of these structures can degrade the performance of the final device. The processing parameters recommended by the LTCC tape supplier are relevant for the production of multilayer circuits but not surface embedded channels and/or cavities. Thus, it is important to examine which factors of the fabrication process are the most significant. In our study, special attention has been paid to the geometric performance of the channel structure resulting from the applied processing parameters. Laser cutting parameters were checked to obtain the structures with great fidelity. The impact of an isostatic lamination on the quality of the final structure was analyzed. The influence of pressure and temperature of the lamination process on the channel geometry and tape shrinkage were examined. The performed experiments showed that some improvements in channel/cavity geometry may be achieved by optimizing the processing procedures. The microscopic observations combined with the Analysis of Variance (ANOVA) showed which combinations of the processing parameters are the best for achieving a channel/cavity structure with the desired geometry.

Słowa kluczowe

EN

LTCC; channel fabrication; laser machining; lamination; DoE

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2015
• Tom: Vol. 33, No. 4
• Strony: 816--825
• Opis fizyczny: Bibliogr. 20 poz., rys., tab.

Twórcy

autor

Macioszczyk J.

• Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland

autor

Malecha K.

• Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland

autor

Stafiniak A.

• Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland

autor

Golonka L. J.

• Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland

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