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Simplifying High-Density Memory: Exploiting Self-Rectifying Resistive Memory with TiO2/HfO2 Bilayer Devices

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Języki publikacji
EN
Abstrakty
EN
Self-rectifying resistive memory can reduce the complexity of crossbar array architecture for high density memory. It can replace integrated memory and selector with one self-rectifying cell. Such a simple structure can be applied for the vertical resistive memory. Both top and bottom interface between insulating layer and electrodes are crucial to achieve highly self-rectifying memory cell. In this study, bilayer devices composed of HfO2 and TiO2 were fabricated using atomic layer deposition (ALD) for the implementation of self-rectifying memory cells. The physical, chemical, and electrical properties of HfO2 and TiO2 and TiO2/HfO2 sandwiched between Pt and Tin electrodes were investigated. By analyzing the conduction mechanism of bilayer devices, the higher rectification ratio of TiO2/HfO2 stack was due to the difference in height and the number of energy barriers.
Twórcy
autor
  • Seoul National University of Science and Technology, Department of Materials Science and Engineering, Seoul 01811, Korea
autor
  • Seoul National University of Science and Technology, Department of Materials Science and Engineering, Seoul 01811, Korea
  • Seoul National University of Science and Technology, Department of Materials Science and Engineering, Seoul 01811, Korea
Bibliografia
  • [1] S. Choi, Y. Kim, T. van Nguyen, W.H. Jeong, K.S. Min, B.J. Choi, Low-Power Self-Rectifying Memristive Artificial Neural Network for Near Internet-of-Things Sensor Computing. Adv. Electron. Mater. 7 (6), 2100050 (2021). DOI: https://doi.org/10.1002/aelm.202100050
  • [2] Q. Luo, X. Zhang, Y. Hu, T. Gong, X. Xu, P. Yuan, H. Ma, D. Dong, H. Lv, S. Long, Q. Liu, M. Liu, Self-Rectifying and Forming-Free Resistive-Switching Device for Embedded Memory Application. IEEE Electron Device Lett. 39 (5), 664-667 (2018). DOI: https://doi.org/10.1109/LED.2018.2821162
  • [3] H. Ryu, S. Kim, Self-Rectifying Resistive Switching and Short-Term Memory Characteristics in Pt/HfO2/TaOx/TiN Artificial Synaptic Device. Nanomater. 10 (11), 159 (2020). DOI: https://doi.org/10.3390/nano10112159
  • [4] K.V. Pham, T.V. Nguyen, S.B. Tran, H.K. Nam, M.J. Lee, B.J. Choi, S.N. Truong, K.S. Min, Memristor Binarized Neural Networks. J. Semicond. Technol. Sci. 18 (5), 568-577 (2018). DOI: https://doi.org/10.5573/JSTS.2018.18.5.568
  • [5] N.K. Upadhyay, W. Sun, P. Lin, S. Joshi, R. Midya, X. Zhang, Z. Wang, H. Jiang, J.H. Yoon, M. Rao, M. Chi, Q. Xia, J. Yang, A Memristor with Low Switching Current and Voltage for 1S1R Integration and Array Operation. Adv. Electron. Mater. 6, 1901411 (2020). DOI: https://doi.org/10.1002/aelm.201901411
  • [6] Y. Kim, W.H. Jeong, S.B. Tran, H.C. Woo, J. Kim, C.S. Hwang, K.S. Min, B.J. Choi, Memristor crossbar array for binarized neural networks. AIP Adv. 9 (4), 045131 (2019). DOI: https://doi.org/10.1063/1.5092177
  • [7] J.Y. Park, Y.B. Won, M.J. Jeong, B.J. Choi, Structural, Electrical, and Optical Properties of ZnO Films Grown by Atomic Layer Deposition at Low Temperature. Arch. Metall. Mater. 67 (4), 1503-1506 (2022). DOI: https://doi.org/10.24425/amm.2022.141082
  • [8] H.J. Yun, S.Y. Ryu, H.Y. Lee, W.Y. Park, S.G. Kim, B.J. Choi, Multilevel Operation of GdOx-Based Resistive Switching Memory Device Fabricated by Post-Deposition Annealing. Ceram. Inter. 47 (12), 16597-16602 (2019). DOI: https://doi.org/10.1016/j.ceramint.2021.02.231
  • [9] J.H. Yoon, D.E. Kwon, Y.J. Kwon, K.J. Yoon, T.H. Park, X.L. Shao, C.S. Hwang, The Current Limit and Self-Rectification Functionalities in the TiO2/HfO2 Resistive Switching Material System. Nanoscale 9 (33), 11920 (2017). DOI: https://doi.org/10.1039/c7nr0221Sh
  • [10] J.H. Ryu, S. Kim, Artificial Synaptic Characteristics of TiO2/HfO2 Memristor with Self-Rectifying Switching for Brain-Inspired Computing. Chaos Solit. Fractals 140, 110236 (2020). DOI: https://doi.org/10.1016/j.chaos.2020.110236
  • [11] H. Hernandez-Arriaga, E. Lopez-Luna, E. Martinez-Guerra, M.M. Turrubiartes, A.G. Rodriguez, M.A. Vidal, Growth of HfO2/TiO2 Nanolaminates by Atomic Layer Deposition and HfO2-TiO2 by Atomic Partial Layer Deposition. J. Appl. Phys. 121 (6), 064302 (2017). DOI: https://doi.org/10.1063/1.4975676
  • [12] F.C. Chiu, A Review on Conduction Mechanism in Dielectric Films, Adv. Mater. Sci. Eng. 2014, 578168 (2014). DOI: https://doi.org/10.1155/2014/578168
  • [13] Y. Kim, M.S. Kim, H.J. Yun, S.Y. Ryu, B.J. Choi, Effect of growth temperature on AlN thin films fabricated by atomic layer deposition. Ceram. Inter. 44 (14), 17447 (2018). DOI: https://doi.org/10.1016/j.ceramint.2018.06.212
  • [14] S. Choi, A.S. Ansari, H.J. Yun, H. Kim, B. Shong, B.J. Choi, Growth of Al-rich AlGaN thin films by purely thermal atomic layer deposition. J. Alloy Comp. 854, 157186 (2021). DOI: https://doi.org/10.1016/j.jallcom.2020.157186
  • [15] J.H. Yoon, S.J. Song, I.H. Yoo, J.Y. Seok, K.J. Yoon, D.E. Kwon, T.H. Park, C.S. Hwang, Highly Uniform, Electroforming-Free, and Self-Rectifying Resistive Memory in the Pt/Ta2O5/HfO2-x/TiN Structure. Adv. Funct. Mater. 24 (32), 5086-5095 (2014). DOI: https://doi.org/10.1002/adfm.201400064
  • [16] C.W. Hsu, T.H. Hou, M.C. Chen, I.T. Wang, C.L. Lo, Bipolar Ni/TiO2/HfO2/Ni RRAM With Multilevel States and Self-Rectifying Characteristics. IEEE Electron Device Lett. 34 (7), 885-887 (2013). DOI: https://doi.org/10.1109/LED.2013.2264823
  • [17] H. Ma, J. Feng, H. Lv, T. Gao, X. Xu, Q. Luo, T. Gong, P. Yuan, Self-Rectifying Resistive Switching Memory with Ultralow Switching Current in Pt/Ta2O5/HfO2-x/Hf Stack. Nanoscale Res. Lett. 12 (1), 118 (2017). DOI: https://doi.org/10.1186/s11671-071-1905-3
Uwagi
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (Grant No. 2022M3F3A2A01044952).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-d82cfcc6-9ed9-4477-a737-3136df7f346b
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