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Synthesis and characterisation of a nano-silver soldering paste obtained by NaBH4 reduction in presence of PVP

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Purpose: In this work, a new synthesis has been investigated to obtain a nano-silver soldering paste capable of sintering at low temperature. Design/methodology/approach: The nano-silver soldering paste has been obtained by chemical reduction, with sodium borohydride (NaBH4) in presence of polyvinylpyrrolidone (PVP). The paste has been used for bonding two Cu plates. The Cu-Ag-Cu joint was obtained by sintering the nano-silver paste at a temperature ranging from 200°C to 400°C, in air, under a normal load of 5 MPa. The shear strength of the joints has been measured. Findings: The Ag particles obtained by this method are spherical, with an average size of 100 nm which allow sintering at low temperature. A sintering temperature of 250°C is sufficient for bonding two copper plates and the paste with an Ag/PVP weight ratio of 2.45 offers the best results. However, a maximum shear strength of 51 N is measured which is lower than the literature reference for large Cu chips bonding. Research limitations/implications: Other Ag/PVP ratio should be investigated in order to minimise the presence of impurities introduced by the reactant. Investigations concerning the Cu surface treatment, for improving the shear strength of the bond, should also be realised. Practical implications: The nano-silver soldering paste cannot be applied, yet, in electronic industry. Further improvements are required. Originality/value: The synthesis of nano-silver soldering paste by chemical reduction with NaBH4 in presence of PVP can be realised in one-step, at room temperature, which is important to minimise the synthesis costs.
Rocznik
Strony
237--242
Opis fizyczny
Bibliogr. 22 poz.
Twórcy
autor
  • Powder and Composite Materials Department, Institute of Non Ferrous Metals, ul. Sowińskiego 5, 44-100 Gliwice, Poland
autor
  • Processing of Metals and Alloys Department, Institute of Non Ferrous Metals, ul. Sowińskiego 5, 44-100 Gliwice, Poland
  • Processing of Metals and Alloys Department, Institute of Non Ferrous Metals, ul. Sowińskiego 5, 44-100 Gliwice, Poland
autor
  • Powder and Composite Materials Department, Institute of Non Ferrous Metals, ul. Sowińskiego 5, 44-100 Gliwice, Poland
Bibliografia
  • [1] K.S. Siow, Mechanical properties of nano-silver joints as die attach materials, Journal of Alloys and Compounds 514 (2012) 6-19.
  • [2] C. Buttay, A. Masson, J. Li, M. Johnson, M. Lazar, C. Raynaud, H. Morel, Die attach of power devices using silver sintering - bonding process optimization and characterization, Proceedings of the High Temperature Electronics Network HiTEN 2011, Oxford, 2011, 1-7.
  • [3] G. Zeng, S. McDonald, K. Nogita, Development of high-temperature solders: Review, Microelectronics Reliability 52 (2012) 1306-1322.
  • [4] H. Schwarzbauer, Method of securing electronic components to a substrate, US4810672 A, 1989.
  • [5] Z. Zhang, L. Guo-Quan, Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow, Electronics Packaging Manufacturing, IEEE Transactions 25 (2002) 279-283.
  • [6] M. Maruyama, R. Matsubayashi, H. Iwakuro, S. Isoda, T. Komatsu, Silver nanosintering: a lead-free alternative to soldering, Applied Physics A 93 (2008) 467-470.
  • [7] P. Peng, A. Hu, H. Huang, A.P. Gerlich, B. Zhao, Y.N. Zhou, Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging, Journal of Materials Chemistry 22 (2012) 12997-13001.
  • [8] P. Peng, A. Hu, B. Zhao, A. Gerlich, Y.N. Zhou, Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding, Journal of Materials Science 47 (2012) 6801-6811.
  • [9] J. Yan, G. Zou, A.-p. Wu, J. Ren, J. Yan, A. Hu, Y. Zhou, Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging, Scripta Materialia 66 (2012) 582-585.
  • [10] Z. Pešina, V. Vykoukal, M. Palcut, J. Sopoušek, Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles, Electronic Materials Letters 10 (2014) 293-298.
  • [11] Y. Mei, G. Chen, Y. Cao, X. Li, D. Han, X. Chen, Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging, Journal of Electronic Materials 42 (2013) 1209-1218.
  • [12] K. Tan, K. Cheong, Advances of Ag, Cu, and Ag-Cu alloy nanoparticles synthesized via chemical reduction route, Journal of Nanoparticle Research 15 (2013) 1-29.
  • [13] H. Alarifi, A. Hu, M. Yavuz, Y.N. Zhou, Silver Nanoparticle Paste for Low-Temperature Bonding of Copper, Journal of Electronic Materials 40 (2011) 1394-1402.
  • [14] Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, E. Ide, Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior, Materials Transactions 49 (2008) 1537-1545.
  • [15] K. Park, D. Seo, J. Lee, Conductivity of silver paste prepared from nanoparticles, Colloids and Surfaces A Physicochemical and Engineering Aspects 313-314 (2008) 351-354.
  • [16] Y. Sun, Y. Xia, Triangular nanoplates of silver: synthesis, characterization, and use as sacrificial templates for generating triangular nanorings of gold, Advanced Materials 15 (2003) 695-699.
  • [17] S.L.C. Hsu, R.T. Wu, Preparation of silver nanoparticle with different particle sizes for low - temperature sintering, Proceedings of the International Conference on Nanotechnology and Biosensors IACSIT, Hong Kong, 2010, 55-58.
  • [18] Z. Zhang, B. Zhao, L. Hu, PVP Protective Mechanism of Ultrafine Silver Powder Synthesized by Chemical Reduction Processes, Journal of Solid State Chemistry 121 (1996) 105-110.
  • [19] Y. Jianfeng, Z. Guisheng, W. Aiping, R. Jialie, Y. Jiuchun, H. Anming, L. Lei, Y.N. Zhou, Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application, Journal of Physics: Conference Series 379 (2012) 012024.
  • [20] S.A. Vorobyova, A.I. Lesnikovich, N.S. Sobal, Preparation of silver nanoparticles by interphase reduction, Colloids and Surfaces A: Physicochemical and Engineering Aspects 152 (1999) 375-379.
  • [21] L.V.F. De, A. Garbar, A. Kiselev, E. Matzner, V. Rosenband, C. Sokolinsky, Low sintering temperatures conductive nano-inks and a method for producing the same, Patent No. WO2004005413A1 (2004).
  • [22] L. Navarro, X. Perpiñà, M. Vellvehi, X. Jordà, Silver nano-particles sintering process for the die-attach of power devices for high temperature applications, Ingeniería Mecánica Tecnología y Desarrollo 4 (2012) 97-102.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-d7425dcd-58eb-48f5-a3f1-284913cb8248
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