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The effect of phase transformations induced in the surface layer of alumina ceramics during its direct joining with copper activated with oxygen or titanium on the mechanical strength of the ceramic/copper joints was examined. The materials used in the experiments were an alumina single crystal, alumina ceramics (97.5 wt% Al2O3), the cermet mixtures: Cu-Cu2O with 10-50 wt% of Cu2O, copper with 5 wt% of Ti, and copper with 5 wt% of Ti and 10 wt% of Ag. The microstructure of the transition layer was examined by the X-ray diffraction method (XRD), scanning electron microscopy method (SEM) and energy dispersive x-ray spectroscopy (EDX). The mechanical strength of the joints was measured using the three-point bending method. The amount of oxygen optimal for the joining process was determined. It has been demonstrated that the cohesion of the joints depends not only on the formation of the individual phases but also, or even primarily, on the microstructure of the transition layer formed between them.
Słowa kluczowe
Rocznik
Tom
Strony
23--32
Opis fizyczny
Bibliogr. 19 poz., rys., tab., wykr.
Twórcy
autor
- Institute of Electronic Materials Technology, 133 Wolczynska St., 01-919 Warsaw, Poland
autor
- Institute of Electronic Materials Technology, 133 Wolczynska St., 01-919 Warsaw, Poland
autor
- Institute of Electronic Materials Technology, 133 Wolczynska St., 01-919 Warsaw, Poland
autor
- Institute of Electronic Materials Technology, 133 Wolczynska St., 01-919 Warsaw, Poland
Bibliografia
- [1] J.A. Fernie, R.A.L. Drew, and K.M. Knowles, “Joining of engineering ceramics”, Int. Materials Reviews 54 (5), 283-331 (2009).
- [2] M. Barlak, J. Piekoszewski, J. Stanislawski, Z. Werner, K. Borkowska, M.Chmielewski, B. Sartowska, M. Miskiewicz, W. Starosta, L. Walis, and J. Jagielski, “The effect of intense plasma pulse pre-treatment on wettability in ceramic-copper system”, Fusion Engineering and Design 82 (15-24), 2524-2530 (2007).
- [3] L. Salbut, M. Kujawinska, M. Jozwik, and D. Golanski, “Investigation of ceramic-to-metal joint properties by hybrid moire interferometry/FEM analysis”, Proc. Society of Photo-Optical Instrumentation Engineers (SPIE) 3745, 298-306 (1999).
- [4] K. Wojciechowski, R. Zybala, and R. Mania, “High temperature CoSb3 - Cu junctions”, Microelectronics Reliability 51, 1198-1202 (2011).
- [5] J. Zimmerman, Z. Lindemann, D. Golański, T. Chmielewski, and W. Włosiński, “Modeling residual stresses generated in Ti coatings thermally sprayed on Al2O3 substrates”, Bull. Pol. Ac.: Tech. 61 (2), 515-526 (2013).
- [6] K. Pietrzak, D. Kalinski, and M. Chmielewski, “Interlayer of Al2O3-Cr functionally graded material for reduction of thermal stresses in alumina - heat resisting steel joints”, J. Eur. Ceramic Society 27 (2-3), 1281-1286 (2007).
- [7] A. Krajewski, W. Włosinski, T. Chmielewski, and P. Kolodziejczak, “Ultrasonic-vibration assisted arc-welding of aluminum alloys”, Bull. Pol. Ac.” Tech. 60 (4), 841-852 (2012).
- [8] M. Chmielewski and W. Weglewski, “Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials”, Bull. Pol. Ac.: Tech. 61 (2), 507-514 (2013).
- [9] L. Jian-Guo, “Wetting of ceramic materials by liquid silicon, aluminium and metallic melts and other reactive elements. A review”, Ceramics International 20, 391-412 (1994).
- [10] A.P. Tomsia and R.E. Loehman, “Bonding and interfacial reactions in ceramics for microelectric packaging”, Fourth Euro- Ceramics 9, 11-18 (1995).
- [11] R. Voytovych, F. Robaut, and N. Eustathopoulos, “The relation between wetting and interfacial chemistry in the CuAgTi/alumina system”, Acta Materialia 54, 2205-2214 (2006).
- [12] M. Książek, B. Mikułowski, N. Sobczak, W. Radziwiłł, and M. Radecka, “Influence of SnO2 layer coated on an aluminium oxide substrate on wettability and strength of the connection in the Cu/Al2O3 system”, Ceramika/Ceramics 91, 677-684 (2005), (in Polish).
- [13] L. Stobierski, Carbon Ceramics, AGH, Cracow, 2005.
- [14] G.P. Kelkar and A.H. Carim, “Synthesis, properties and ternary phase stability of M6X compounds in the TiCuO system”, J. American Ceramic Society 76 (7), 1818-1820 (1993).
- [15] W. Olesinska, M. Pawłowska, D. Kalinski, and M. Chmielewski, Reactive metallic layers produced on AlN, Si3N4 and SiC ceramics, J. Materials Science: Materials in Electronics 15, 813-817 (2004).
- [16] W. Olesinska, D. Kalinski, M. Chmielewski, R. Diduszko, and W.K. Włosinski, “Influence of titanium on the formation of a “barier” layer during joining on AlN ceramic with copper by the CDB technique”, J. Materials Science: Materials in Electronics 17, 781-788 (2006).
- [17] M. Barlak, W. Olesinska, J. Piekoszewski, M. Chmielewski, J. Jagielski, D. Kalinski, Z. Werner, and W. Szymczyk, “Ion implanted nanolayers in AlN for direct bonding with copper”, Solid State Phenomena 99-100, 231-234 (2004).
- [18] M. Barlak, W. Olesinska, J. Piekoszewski, M. Chmielewski, J. Jagielski, D. Kalinski, Z. Werner, and B. Sartowska, “Ion implantation as a pre-treatment method of AlN substrate for direct bonding with copper”, Vacuum 78 (2-4) 205-209 (2005).
- [19] M. Barlak, W. Olesinska, J. Piekoszewski, Z. Werner, M. Chmielewski, J. Jagielski, D. Kalinski, B. Sartowska, and K. Borkowska: “Ion beam modification of ceramic component prior to formation of AlN-Cu joints by direct bonding process”, Surface & Coatings Technology 201, 8317-8321 (2007).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-d382e29f-9fbd-4c18-a967-61a9fcba9729