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Elements of cooling systems of power leds

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Wybrane pełne teksty z tego czasopisma
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Języki publikacji
EN
Abstrakty
EN
In the paper the problem of cooling power LEDs is considered. Modern solutions of packages of power LEDs and elements which improve the removal of heat generated in these devices are presented. Especially, much attention is paid to geometrical dimensions of the packages and construction elements of the heat flow path in free and forced cooling systems.
Rocznik
Tom
Strony
119--133
Opis fizyczny
Bibliogr. 45 poz., rys., tab.
Twórcy
autor
  • Gdynia Maritime University Faculty of Marine Electrical Engineering Poland
autor
  • Gdynia Maritime University Faculty of Marine Electrical Engineering Poland
Bibliografia
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  • [17] Górecki K., The Influence of Mutual Thermal Interactions Between Power LEDs on Their Characteristics, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 25–27 Sept 2013, pp. 188–193.
  • [18] Górecki K., Ptak P., The Influence of the Mounting Manner of the Power LEDs on its Thermal and Optical Parameters, Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems MIXDES, 2014, Lublin, pp. 303– 308”.
  • [19] Ptak P., Diody LED mocy, Praca dyplomowa inżynierska, Akademia Morska w Gdyni, Wydział Elektryczny, Gdynia 2009.
  • [20] Diody LED mocy, Elektronika Praktyczna, May 2009, pp. 84–86.
  • [21] Weise S., Zahner Th., Lutz Th., Stich A., Reliability of the DRAGON Product Family, www.osram-os.com.
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  • [24] Anithanbigai P., Shanmugan S., Mutharasu D., Zahner T., Lacey D., Study on Thermal Performance of High Power LED Employing Aluminium Filled Epoxy Composite as Thermal Interface Material, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 2013, pp. 181–187.
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  • [31] Datasheet Luxeon Rebel Plus, www.philipslumileds.com/uploads/380/DS107-pdf
  • [32] Datasheet Luxeon Q, www.philipslumileds.com/uploads/428/DS118-pdf
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  • [35] Ceramic TopLooker for high light output, designed for camera flash application, www.osram-os.com.
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  • [38] Cree Site, www.cree.com
  • [39] Datasheet XLamp XR-E, www.alldatasheet.com/datasheet-pdf/pdf/194318/CREE/ XR-E.html.
  • [40] Datasheet XLamp XM-L2, www.farnell.com/datasheets/1755855.pdf.
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  • [42] Furnival C.R., Thermal and High Current Multilayer Printed Circuit Boards with Thermagon T-lam and Hybrid Boards, Thermagon Inc, Jan 2001.
  • [43] Huber R., Thermal Management of Golden DRAGON LED, www.osram-os.com
  • [44] Sunon Company Site, www.sunon.com
  • [45] Kalinowski C., Aktywne chłodzenie dla LED dużej mocy, Elektronik No. 5, 2013, pp. 96–97.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-d27310c0-71f1-487e-8301-85bfd0268d67
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