Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and Additives

• Autorzy: Shim Jinyong , Lee Jinhyun , Yoo Bongyoung

Identyfikatory

DOI

10.24425/amm.2021.136372

• Języki publikacji: EN

Abstrakty

EN

Selective deposition was performed on a micrometer trench pattern using a microcontact printing (μCP) process. Alkanethiols required for selective deposition were analyzed according to the carbon chain by linear sweep voltammetry (LSV). According to the LSV analysis, the effect of inhibiting Cu deposition depending on the length of the carbon chain was observed. During the Cu electrodeposition, the trench could be filled without voids by additives (PEG, SPS, JGB) in the plating solution. A μCP process suppressing the deposition of the sample was used for selective Cu electrodeposition. However, there was oxidation and instability of the sample and 1-hexadecanethiol in air. To overcome these problems, the μCP method was performed in a glove box to achieve effective inhibition.

Słowa kluczowe

EN

µCP; selective Cu deposition; RDL; overburden; SAM(alkanethiol); additives

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2021
• Tom: Vol. 66, iss. 3
• Strony: 741--744
• Opis fizyczny: Bibliogr. 15 poz., rys., tab., wykr.

Twórcy

autor

Shim Jinyong

• Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea

• https://orcid.org/0000-0001-6634-9991

autor

Lee Jinhyun

• Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea

• https://orcid.org/0000-0003-3255-9987

autor

Yoo Bongyoung

• Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea

• https://orcid.org/0000-0001-8101-1913

Bibliografia

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Uwagi

1. This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (No. 2015R1A5A1037548) and research was supported by the MOTIE (Ministry of Trade, Industry & Energy (No. 10067804) and KSRC (Korea Semiconductor Research Consortium) support program for the development of the future semiconductor device and work was supported by the Technology Innovation Program (20005011, Development of materials and process technology for highly luminance micro display with 2000 PPI resolution) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea)

2. Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).