Effects Of Process Parameters On Cu Powder Synthesis Yield And Particle Size In A Wet-Chemical Process

• Autorzy: Shin Y. M. , Lee J. H.

Identyfikatory

DOI

10.1515/amm-2015-0107

Warianty tytułu

PL

Wpływ parametrów procesu na wydajność syntezy proszku Cu i wielkości cząstek w procesie mokrym chemicznym

• Języki publikacji: EN

Abstrakty

EN

This study presents a simple wet-chemical process to prepare several micron-size Cu powders. Moreover, changes in powder synthesis yield and particle size are examined with different solvents, synthesis temperatures, and amounts of reducing agent during the synthesis. As a reducing agent and capping agent, L-ascorbic acid and polyvinyl pyrrolidone were used, respectively. The yields in distilled water or an ethylene glycol (EG)/distilled water mixture were higher than that in EG alone, and the yield increased with increasing temperature owing to a lower Δ Gred value. Increasing the L-ascorbic acid concentration also increased the yield. The Cu powder synthesized in 3 h at 90°C in distilled water with 272.8 mM of L-ascorbic acid showed the lowest average particle size of 2.52 μm, indicating mechanisms of short burst nucleation and reduced growth via the increased reduction rate of Cu ions. It is estimated that the nucleation step was nearly completed within 10 min in this system. The Cu powders synthesized in an ethylene glycol/distilled water mixture presented an average particle size of 3.76 μm and the highest yield of 87.9%.

Słowa kluczowe

EN

wet-chemical process; micron-size Cu powder; Synthesis yield; particle size; gibbs free energy difference

PL

proszek Cu; proces chemiczny mokry; wydajność syntezy; rozmiar cząsteczki; różnica energii swobodnej Gibbsa

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2015
• Tom: Vol. 60, iss. 2B
• Strony: 1247--1250
• Opis fizyczny: Bibliogr. 20 poz., rys.

Twórcy

autor

Shin Y. M.

• Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul 139-743, Korea

autor

Lee J. H.

• Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul 139-743, Korea

Bibliografia

• [1] S. Wu, Mater. Lett. 61, 1125 (2007).
• [2] F. Fievet, F. Fievet-Vincent, J. P. Lagier, B. Dumont, M. Figlarz, J. Mater. Chem. 3, 627 (1993).
• [3] A. Sinha, B.P. Sharma, Mater. Res. Bull. 37, 407 (2002).
• [4] Y.-S. Lin, S.-S. Chiu, Polym. Eng. Sci. 44, 2019 (2004).
• [5] D. S. Jung, H. M. Lee, Y. C. Kang, S. B. Park, J. Colloid Interface Sci. 364, 574 (2011).
• [6] X. Xu, X. Luo, H. Zhuang, W. Li, B. Zhang, Mater. Lett. 57, 3987 (2003).
• [7] J. Zhao, D. M. Zhang, J. Zhao, J. Solid State Chem. 184, 2339 (2011).
• [8] S.-S. Chee, J.-H. Lee, J. Mater. Chem. C 2, 5372 (2014).
• [9] N. Cabrera, N.F. Mott, Rep. Prog. Phys. 12, 164 (1949).
• [10] A. Muzikansky, P. Nanikashvili, J. Grinblat, D. Zitoun, J. Phys. Chem. C, 117, 3093 (2013).
• [11] M. Grouchko, A. Kamyshny, S. Magdassi, J. Mater. Chem. 117, 3057 (2009).
• [12] P. Dixit, C. W. Tan, L. Xu, N. Lin, J. Miao, J. H. L. Pang, P. Backus, R. Preisser, J. Micromech. Microeng. 17, 1078 (2007).
• [13] J.-N. Hwang, M.-J. Lee, H.-J. Kim, I.-H. Oh, K.-A. Lee, J. Kor. Powd. Met. Inst. 19, 348 (2012).
• [14] D.-W. Park, H.-S. Kim, Y.-S. Kwon, K.-K. Cho, S.-G. Lim, I.-S. Ahn, J. Kor. Powd. Met. Inst. 19, 117 (2012).
• [15] B.K. Park, S. Jeong, D. Kim, J. Moon, S. Lim, J.S. Kim, J. Colloid Interface Sci. 311, 417 (2007).
• [16] T. Ishizaki, R. Watanabe, J. Mater. Chem. 22, 25198 (2012).
• [17] C. Wu, B. P. Mosher, T. Zeng, J. Nanoparticle Res. 8, 965 (2006).
• [18] D. Larcher, R. Patrice, J. Solid State Chem. 154, 405 (2000).
• [19] V. K. LaMer, R. H. Dinegar, J. Am. Chem. Soc. 72, 4847 (1950).
• [20] V. K. LaMer, Ind. Eng. Chem. 44, 1270 (1952).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę.