Selected chemical substances detection using dual-band thermal imaging camera with microbolometer infrared focal plane array detectors

• Autorzy: Ligienza A. , Bieszczad G. , Gogler S.
• Języki publikacji: EN

Abstrakty

EN

Main notion of this paper is presenting the possibility of applying microbolometer FPAs in detection and visualization of far infrared sub-bands (LWIR 8-12 µm), as a cheaper alternative to cooled detectors. Specifically designed and built device consists of infrared optics, custom made beamsplitter with desired spectral characteristic, two microbolometer infrared FPA detectors, data acquisition and processing software for substance detection.

Słowa kluczowe

EN

infrared spectroscopy; microbolometer FPA; image processing

• Wydawca: Wydawnictwo PAK
• Czasopismo: Measurement Automation Monitoring
• Rocznik: 2017
• Tom: Vol. 63, No. 2
• Strony: 69--72
• Opis fizyczny: Bibliogr. 9 poz., fot., rys., wykr., wzory

Twórcy

autor

Ligienza A.

• Institute of Optoelectronics, Military University of Technology, 2 Gen. S. Kalickiego Str., Warsaw, Poland

autor

Bieszczad G.

• Institute of Optoelectronics, Military University of Technology, 2 Gen. S. Kalickiego Str., Warsaw, Poland

autor

Gogler S.

• Institute of Optoelectronics, Military University of Technology, 2 Gen. S. Kalickiego Str., Warsaw, Poland

Bibliografia

• [1] Więcek Bogusław, De Mey Gilbert: Termowizja w podczerwieni. Podstawy i zastosowania. Publ. House PAK, Ed. 1st, ISBN: 83-926319-7-2.
• [2] Tissot J. L., Fieque B., Trouilleau C., Robert P., Crastes A., Minassian C., Legras O.: First demonstration of 640×480 uncooled amorphous silicon IRFPA with 25 µm pixel-pitch, Proc. SPIE 6206, 2006.
• [3] Bieszczad G., Kastek M.: Measurement of Thermal Behavior of Detector Array Surface with the Use of Microscopic Thermal Camera. Metrology and Measurement Systems 18(4):679-690, January 2011.
• [4] Bieszczad G., Kastek M: Measurement of Thermal Behavior of Detector Array Surface with the Use of Microscopic Thermal Camera. Metrology and Measurement Systems 18(4):679-690, January 2011.
• [5] Orżanowski, T. & Madura, H.: Opto-Electron. Rev. (2010) 18: 91. doi:10.2478/s11772-009-0024-9
• [6] Bieszczad G.: SoC-FPGA embedded system for real-time thermal image processing. 23rd International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2016, 2016, Article No. 7529788, Pages 469-473.
• [7] Matsuya Y., Uchimura K., Iwata A., Kobayashi T., Ishikawa M., Yoshitome T.: A 16-bit oversampling A-to-D conversion technology using triple-integration noise shaping. IEEE Journal of Solid-State Circuits, Volume 22 Issue 6.
• [8] http://webbook.nist.gov/chemistry/.
• [9] Bieszczad G., Sosnowski T., Madura H., Kastek M., Firmanty K.: The calibration stand for thermal camera module with infrared focal plane array. SPIE Security and Defense Orlando 2010 7660-140, 2010 r.

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017).