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Low-cost IR system for thermal characterization of electronic devices

Autorzy
Treść / Zawartość
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
In this article, a Low-cost measurement Infra-Red (IR) system for dynamic thermal testing of electronic devices is described. The element is powered by a step-function current and simultaneously temperature is measured by a fast single-detector IR head. The thermal impedance Zth(jω) is calculated using the Laplace transform and the Foster network is to get thermal time constants distribution.
Wydawca
Rocznik
Strony
103--107
Opis fizyczny
Bibliogr. 14 poz., rys., tab., wykr., wzory
Twórcy
autor
  • Lodz University of Technology, Institute of Electronics 90-924 Łódź, Wólczańska 211/215 St.
autor
  • Lodz University of Technology, Institute of Electronics 90-924 Łódź, Wólczańska 211/215 St.
Bibliografia
  • [1] EIA/JEDEC standard: Integrated Circuits Thermal Measurement Method – Electrical Test Method (Single Semiconductor Device). Electronic Industries Alliance Engineering Department, no. 51-1, pp. 1-27, 1995.
  • [2] Székely V.: Identification of RC networks by deconvolution: chances and limits. IEEE Transactions on Circuits and Systems, vol. 45, issue: 3, pp. 244-258, 1998.
  • [3] T3Ster® Measurement Control Tool User and Reference Guide, Software Version 1.3, 2014.
  • [4] Infrared detectors Room Temperature and TE-Cooled. [07.05.2019]. Available: https://www.boselec.com/wp-content/uploads/Linear/Vigo/ VigoLiterature/BEC-Vigo-IR-Detector-Catalog-03-08-19.pdf
  • [5] https://vigo.com.pl/
  • [6] Spartan-6 FPGA Data Sheet: DC and switching Characteristics. [07.05.2019]. Available: https://www.xilinx.com/support/ documentation/data_sheets/ds162.pdf
  • [7] Future technology Devices International Ltd 232H Single Channel Hi-Speed USB to Multipurpose UART/FIFO C. [07.05.2019]. Available: https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf
  • [8] PIC18F2420/2520/4420/4520 Data Sheet. [07.05.2019]. Available: https://ww1.microchip.com/downloads/en/devicedoc/39631a.pdf
  • [9] Precision Infrared Calibrator Technical Guide. [09.05.2019]. Available: https://dam-assets.fluke.com/s3fs-public/418xrgeng 0000.pdf?oZvWEhydwboTAhlpyEtYzPebYgqGqUwF
  • [10] Kawka P., De Mey G., Vermeersh B.: Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance. IEEE Transactions on Components and Packaging Technologies, vol. 30, no. 4, pp. 660-665, 2007.
  • [11] De Mey G., Vermeersch B., Kawka P.: Thermal impedance simulations of electronic packages. Proceedings of the 12th international conference on mixed design and integrated circuits and systems (MIXDES 2005). Krakow, Poland, p. 267–9, 2005.
  • [12] Chatziathanasiou V., Chatzipanagiotou P., Papagiannopoulus I., De Mey G., Więcek B.: Dynamic thermal analysis of underground medium power cables using thermal impedance, time constant distribution and structure function. Applied Thermal Engineering, vol. 60, pp. 256-260, 2013.
  • [13] Strakowska M, Chatzipanagiotou P., De Mey G., Chatziathanasiou V., Więcek B., Novel software for medical and technical Thermal Object Identification (TOI) using dynamic temperature measurements by fast IR cameras, 14th Quantitative InfraRed Thermography Conference, QIRT 2018, June 25-29, 2018, Berlin, DOI: 10.21611/qirt.2018.053 http://qirt.gel.ulaval.ca/archives/qirt2018/papers/053.pdf
  • [14] https://www.comsol.com/
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-cd8d672f-dfaa-4bbd-992b-6ceea8644248
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