Development of the basic acoustic elements models on the base of the VHDL – AMS language for computer-aided design at the schemotechnical level

• Autorzy: Teslyuk V. , Holovatyy A. , Alshawabkeh H. A.
• Języki publikacji: EN

Abstrakty

EN

In this paper the basic acoustic elements models are developed on the base of the VHDL-AMS language. Constructed models are based on the thin plates theory and are intended to be used in computer-aided design at the schematic level of basic acoustic MEMS elements. The results of the models for basic acoustic elements of piezoelectric and electrostatic types investigation are also presented.

Słowa kluczowe

EN

microelectromechanical systems (MEMS); VHDL-AMS model; basic acoustic element; schematic design level

• Wydawca: Polish Academy of Sciences, Branch in Lublin
• Czasopismo: ECONTECHMOD : An International Quarterly Journal on Economics of Technology and Modelling Processes
• Rocznik: 2018
• Tom: Vol. 7, No 2
• Strony: 53--58
• Opis fizyczny: Bibliogr. 33 poz., wykr., wz.

Twórcy

autor

Teslyuk V.

• Department of Computer Aided Design, Lviv Polytechnic National University, Ukraine Lviv, 79013, Ukraine

autor

Holovatyy A.

• Department of Computer Aided Design, Lviv Polytechnic National University, Ukraine Lviv, 79013, Ukraine

autor

Alshawabkeh H. A.

• Faculty of Computer Science and Information Technology, Al-Baha University, Kingdom of Saudi Arabia

Bibliografia

• 1. Allan R. 2003 MEMS Microphone-Amp chips breaks acoustics ground // Electronic Design Online ID #5149.
• 2. Arensman R. 2006 Mini - microphones make big market waves // Electronic Business – 9/1/2006. – Режим доступу: http://www.edn.com/article/CA6365886.html.
• 3. Beus Sh. 2005 MEMS microphone enables better acoustic designs. ECN.
• 4. Beznosyk O., Finogenov O., Ladogubets V., Tchkalov O. 2008 Using circuit design software to simulate microelectromechanical components / Perspective Technologies and Methods in MEMS Design : IV-th Intern. Conf. of Young Scientists (MEMSTECH’2008), 21-24 May 2008, Lviv-Polyana, Ukraine: proc. – Lviv : Publishing House Vezha&Co, 2008. – P. 130–133.
• 5. Bouwstra S., Geijselaers B. 1998 On the resonance frequencies of microbridges // Proc. Transducers ‘91, - San Francisco, CA, USA. – P. 538-542.
• 6. Esteve D., Alderman J., Cane C., Ciurtois B., Glesner M., Napieralski A., Rencz M., Samitier J., Troccaz J., Cinquin P., Dillman J. 1997 Basic research for microsystems integration, CEPADUES-EDITIONS, Toulouse, France, ISBN 2-85428-465-8, – 266 p.
• 7. Horowitz S. B. et al. A. 2008, MEMS acoustic energy harvester // J. of Micromechanics and Microengineering. – Vol. 16. – P. 174–181.
• 8. Huang Ch. 2002, A silicon micromachined microphone for fluid mechanics research // Journal Micromech. Microeng.– November,Vol. 12. – P. 767–774.
• 9. Ikeda T. 1990, Fundamentals of Piezoelectricity // Oxford Science Publications., New York. - 280 p.
• 10. Johansson J. et al. 2006, Ultra-low power transmit/receive ASIC for battery operated ultrasound measurement systems // Sensors and Actuators A: Physical. – January,Vol. 125, Issue 2. – P. 317– 328.
• 11. Lewerenz H. J. 1998, Semicondutor Micromachinihg. Techniques and Industrial Applications // John Wiley & Sons., Vol. 2. - 408 P.
• 12. Lintel H., van de Pol F., Bouwstra S. A. (1988), Piezoelectric Micropump Based on Micromachining of Silicon // Sensors and Actuators. – Vol. 15. – P. 153-160.
• 13. Kamisiński T., Burkot M., Rubacha J., Brawata K. 2009, Study of the effect of the orchestra pit on the acoustics of the Kraków opera hall, Archives of Acoustics 34 (4) , pp. 481-490.
• 14. Keller J. 2006, DARPA approaches industry for ideas for unmanned underwater surveillance technology // Military & Aerospace Electronics., Vol. 17, Issue 1, p. 8.
• 15. Maflin Shaby, and Vimala J. 2012, Design and Analysis of MEMS Pressure Sensor by using ANSYS, 2nd International Conference on Mechanical, Automotive and Materials Engineering (MAME'2012) Oct. 13-14, Bali (Indonesia), p. 132–135.
• 16. MEMS microphone IC heralds new era for sound processing: http://www.electronicproducts.com/Analog_Mixed_Signal_ICs/MEMS_microphone_IC_heralds_new_era_for_sound_processing.aspx?terms=MEMS%20microphone%20IC%20heralds%20new%20era%20for%20sound%20processing.
• 17. Szermer M., Napieralski A., Szaniawski K., Olszacki M., Maj C. 2009, Sensors and actuators in MEMS technologies as the elements of mechatronics, Przeglad Elektrotechniczny, No 9, – p. 279-286.
• 18. Napieralski A., Napieralska M., Szermer M., Maj C. 2012, The evolution of MEMS and modeling methodologies, COMPEL: The International Journal for computation and Mathematics in Electrical and Electronic Engineering, vol. 31, pp. 1458–1469.
• 19. Neumann J. J., Gabriel K. J. 2001, CMOS-MEMS membrane for audio-frequency acoustic actuation/ in Technical Digest of the 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '01), January, Interlaken, Switzerland, pp. 236–239, 2001.
• 20. Peter J. Ashenden, Gregory D. Peterson, Darrell A., Teegarden 2011 The System Designer's Guide to VHDL-AMS: Analog, Mixed-Signal, and Mixed-Technology Modeling // Morgan Kaufmann. - 880 p.
• 21. Pilch A., Kamisiński T., 2011 The effect of geometrical and material modification of sound diffusers on their acoustic parameters., Archives of Acoustics 36 (4) , P. 955-966.
• 22. Rombach P. et al., 2002 The first low voltage, low nose differential silicon microphone, technology development and measurement results. Sensors and actuators A: Physical, Vol. 95 (2-3), - P. 196-201.
• 23. Steffora A.S. 2007, MEMS prolific in consumer electronics // Electronic News.
• 24. Teslyuk V., Hamza Al-Shavabkeh, Pereyma M., Al Omari T. 2007, The formalization of the MEMS automated design process by usage of Petri Networks. Proc.of the IIId International Conference of Young Scientists (MEMSTECH’2007) - Lviv - Polyana, May, 23-26, - P. 133 -134.
• 25. Yu X. Rajamani et al. 2006, Carbon nanotube-based transparent thin film acoustic actuators and sensors. Sensors and Actuators A: Physical. 20 November, Vol. 132, Issue 2, P. 626-631.
• 26. Yu H.et al. 2006, Fabrication of three-dimensional microstructures based on singled-layered SU-8 for labon-chip application // Sensors and Actuators A: Physical. – Vol. 127, Issue 2. – P. 228-234.
• 27. Kireev P.S. 1969, Semiconductor physics. - Мoscov.: “High school” - 590 p. (in Russian).
• 28. Campbell S. A., Lewerenz H. J., 1998, Semiconductor Micromachining, Volume 1, Fundamental Electrochemistry and Physics., February, Wiley. - 332 p.
• 29. Plate №78173 Ukraine (2009), MPK (2013.01) G01R 17/00. Device for resistance measuring / Pukach А.І., Ivantsiv R.-А.D., Teslyuk V.М., Lobur М.V., by Lviv Polytechnic National University. - № u 2012 10529; rep 06.09.2012; publ. 11.03.2013, Vol. №5.
• 30. Plate №73621 Ukraine (2012), MPK (2012.01) G01R 17/00. Device for resistance measuring / Pukach А.І., Ivantsiv R.-А.D., Teslyuk V.М., Lobur М.V., by Lviv Polytechnic National University. - № u 2012 05676; rep 10.05.2012; publ. 25.09.2012, Vol. №18.
• 31. Pysrenko H .S. 1967, Material resistance. Technic Publ, Kyiv., – 791 p. (in Russian).
• 32. Podgorny A. N., Marchenko G. A., Pustynnikov 1980, VI Fundamentals and methods of applied theory of elasticity: Textbook. manual for universities. - Kiev: Vishcha school. Head-out, - 328 p. (in Russian).
• 33. Plate 88405 Ukraine (2008), MPK (2009), G01P 15/125. Device for displacement measuring / Zagaryuk R. V., Ivantsiv R.-A. D., Lobur M. V., by Lviv Polytechnic National University. – № а 2008 03858; rep 27.03.08; publ. 12.10.09, Vol. № 19.

Uwagi

Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2018).