Controlling technology of Sn whisker in welding of electronics lead

• Autorzy: Kubouchi T , Kamiya O , Sakakida T , Chida M , Nishikawa S
• Języki publikacji: EN

Abstrakty

EN

This paper describes development for preventive technology of Sn whisker in welding of aluminum electrolytic condenser lead. Sn whisker is the crystal of tin and the length of Sn whisker is from several μm to several mm. Sn whisker has been causes for failure in electric device occasionally. The lead of aluminum electrolytic condense is composed of Sn and Cu plated Fe wire (named CP wire) and Al wire by Percussion welding. From observation, Sn whisker occurred from Al-Sn alloy area in welding point. We considered exclusion Sn from welding point. In this experiment, we used Sn plated-less CP wire with mold in welding. This mold is addition to chucking unit of welding machine. We obtained good shape and sufficient bonding strength by this method. There is no Sn whisker on the welding point after accelerated test during 4000hr.

Słowa kluczowe

EN

Sn whisker; percussion welding; CP wire; tensile strength; Sn plated; mold welding; lead welding

• Wydawca: International OCSCO World Press
• Czasopismo: Journal of Achievements in Materials and Manufacturing Engineering
• Rocznik: 2012
• Tom: Vol. 55, nr 2
• Strony: 727--733
• Opis fizyczny: Bibliogr. 4 poz., rys.

Twórcy

autor

Kubouchi T

• Department of products R&D, Nippon Chemi-con corporation, Tokyo, Japan

autor

Kamiya O

• AKITA University, Akita, Japan

autor

Sakakida T

• AKITA University, Akita, Japan

autor

Chida M

• AKITA University, Akita, Japan

autor

Nishikawa S

• NEW CENTRAL corporation, Tokyo, Japan

Bibliografia

• [1] O. Kamiya, S. Morikawa, T.kubouchi, Sn-Whisker formation in micro bonding, Proceeding of the International Conference on Materials Engineering for Resources, Akita, 2005.
• [2] K. Murakami, M. Hino, Y. Mitooka, T. Kanadani, Mechanism fordevelopment of nodules and whiskers on tin plated films joints in aluminum electrolytic capacitors, Science and Industry 85/9 (2011) 398-406.
• [3] S. Aono, Resistance welding technology and application, Study of Machine 27/11(1975) 1333-1337.
• [4] T. Kubouchi, O. Kamiya, Microstructure of bonding interface and influence of Sn plate in welding of lead for aluminum electrolytic condenser, International Journal of the Society of Materials Engineering for Resources 23/1 (2010) 13-18.