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Purpose: The aim of this work was to describe deformation behaviour of nanocrystalline copper dispersion-hardened with nanoparticles of tungsten carbide and yttria. Design/methodology/approach: Tests were made with the Cu, Cu-WC and Cu-Y2O3 micro-composites containing up to 3 % of a hardening phase. These were obtained by powder metallurgy techniques, i.e. milling the input powders in the planetary ball mills, compacting and sintering. The mechanical properties (hardness, 0,2 YS, elongation during compression test) and microstructure were examined by the optical, scanning and transmission electron microscopy. Findings: Analysis of the initial nanocrystalline structure of these materials was made, and its evolution during deformation process was investigated with an account of the hardening effect and the changes in the mechanical and plastic properties. Results of this analysis have been discussed based on the existing theories related to hardening of nanocrystalline materials. Research limitations/implications: The powder metallurgy techniques make it possible to obtain copper-based bulk materials by means of milling input powders in the planetary ball, followed by compacting and sintering. Additional operations of hot extrusion are also often used. There is some threat, however, that during high-temperature processing or using these materials at elevated or high temperatures this nanometric structure may become unstable. The studies have shown the importance of “flows” in the consolidated materials such as pores or regions of poor powder particles joining which significantly deteriorate mechanical properties of compacted and sintered powder micro composites. Practical implications: A growing trend to use new copper-based functional materials is observed recently world-wide. Within this group of materials particular attention is drawn to those with nanometric grain size of a copper matrix, which exhibit higher mechanical properties than microcrystalline copper. Originality/value: The paper contributes to the elucidation of deformation behaviour of high-porosity nanocrystalline copper dispersion hardened with tungsten carbide and yttria.
Wydawca
Rocznik
Tom
Strony
153--156
Opis fizyczny
Bibliogr. 12 poz., rys., tab., wykr.
Twórcy
autor
- Division of Materials Processing Technology and Computer Techniques in Materials Science, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland
- Non-Ferrous Metals Institute, ul. Sowińskiego 5, Gliwice, Poland
autor
- Division of Materials Processing Technology and Computer Techniques in Materials Science, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland
- Non-Ferrous Metals Institute, ul. Sowińskiego 5, Gliwice, Poland
Bibliografia
- [1] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure n the copper-based materials, Proceedingsof the 11th International Scientific Conference on Contemporary Achievement In Mechanics, Manufacturingand Materials Science, CAM3S’2005, Gliwice-Zakopane 2005, 909-914.
- [2] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Journal of Materials Processing Technology, in press.
- [3] D.Y. Ying, D.L. Zhang, D.Y, D.L (2000) Processing of Cu-Al2O3 metal matrix nanocomposite materials by using high energy ball milling, Materials Science and Engineering 1(2000)152-156.
- [4] A. Zuniga, Microstructure and mechanical behavior of Cu-based composites reinforced with WC and TiC particles, prepared by spray forming. Proceedings of the Second International Latin American Conference on Powder Technology, Iquacu, Brasil, Nov. 1999.
- [5] N. Wang at al., Effect of grain size on mechanical properties of nanocrystalline materials, Acta metal. Mater 2c(1995) 519-528.
- [6] Y.J. Li, X.H. Zeng, W. Blum, Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu, Acta Materialia 52(2004) 5009-5018.
- [7] R. Suryanarayanan at. al., Plastic deformation of nanocrystalline Cu and Cu-0,2 wt.% B, Materials Science and Engineering A 264(1999) 210-214.
- [8] H. Conrad, Grain size dependence of the plastic deformation kinetics in Cu, Materials Science and Engineering A 341(2003) 216-228.
- [9] K.S. Kumar, H. Van Swygenhoven, S. Suresh, Mechanical behaviour of nanocrystalline metals and alloys, Acta Materialia 51(2003) 5743-5774.
- [10] S.H. Yoo, T.S. Sudarshan, K. Sethuram, at al., Nano Structured Materials 12(1999) 23-28.
- [11] D.V. Kudashov at. Al., Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling, Materials Science and Engineering A 387-379(2004) 768-771.
- [12] U.F. Kocks, Mater. Sci. Eng. m 27(1977) 291.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-c50d8e63-2e72-4bef-9057-327eccd74929