Modified two fields problem approach in simulation of microstripe PIC elements

• Autorzy: Kula S.
• Konferencja: Computer Applications in Electrical Engineering 2013 (15-16.04.2013; Poznań, Polska)
• Języki publikacji: EN

Abstrakty

EN

In this paper Modified Two Fields Problem Approach is presented. This method is based on FIT (Finite Integration Technique), on replacement of 3D (three-dimensional) analysis with 2D analysis and on empirical formulas. The starting point to create this method was desire to reduce order models, to decrease computation time and needed computation power. The proposed method is a hybrid method, which essential element is to use new, empirical formulas of p.u.l. (per unit length) capacitance. The method is applied to compute p.u.l. R (resistance), L (inductance), C (capacitance), G (conductance) and propagation quantities like effective dielectric permittivity ɛeff, attenuation α , characteristic impedance Zo of passive IC (integrated circuits) elements working at high frequency. Usefulness and effectiveness of the method was verified through results comparison with commercial software and with 3D FIT method. Comparison was made on example of Microstripe PIC (Photonic Integrated Circuit) structure.

Słowa kluczowe

EN

PIC; photonic integrated circuit; two fields problem approach; microstripe; M2FPA method

• Wydawca: Wydawnictwo Politechniki Poznańskiej
• Czasopismo: Poznan University of Technology Academic Journals. Electrical Engineering
• Rocznik: 2013
• Tom: No. 76
• Strony: 189--195
• Opis fizyczny: Bibliogr. 6 poz., rys.

Twórcy

autor

Kula S.

• Kazimierz Wielki University in Bydgoszcz

Bibliografia

• [1] Niehof J., Janssen H., Schilders W., Comprehensive High-Accuracy Modeling of Electromagnetic Effects in Complete Nanoscale RF blocks: CHAMELEON RF, Proc. of the IEEE Workshop on Signal Propagation on Interconnects, pp.: 247 - 248, 2006.
• [2] Ştefănescu A., Kula S., On-Chip Interconnects: New Accurate Nominal And Parametrized Models, University POLITEHNICA of Bucharest Scientific Bulletin Journal, Series C: Electrical Engineering and Computer Science, Vol. 72, Iss. 4, pp. 205-218, 2010.
• [3] Kula S., ROMI Code for Extraction of Reduced Interconnect Models, Proc. of the 12th International Student Conference on Electrical Engineering POSTER 2008 in Prague, Czech Republic, May 2008.
• [4] Stellari F., Lacaita A.L., New Formulas of Interconnect Capacitances Based on Results of Conformal Mapping Method, IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 47, NO. 1, JANUARY 2000.
• [5] Kula S., Interconnect Elements Propagation Quantities in PIC, Poznan University of Technology Academic Journals, Series Electrical Engineering, Iss. 70, pp. 83-89, 2012.
• [6] Van de Meijs N., Fokkema J. T., VLSI circuit reconstruction from mask topology, Integration, Vol. 2, pp. 85-119, 1984.