Thermal stability of the Cu/Ni multilayer system in X-ray diffraction and scanning microscopy examinations

• Autorzy: Kucharska B. , Kulej E. , Wróbel A.
• Języki publikacji: EN

Abstrakty

EN

The article presents the results of research into the effect of heating on the stability of a Cu/Ni multilayer applied onto a Si(100) substrate by the magnetron sputtering method. The multilayer was heated in a furnace atmosphere in a temperature range of 40–230 °C. The X-ray structural examination by the X-ray diffraction (XRD) and the grazing X-ray incidence diffraction (GIXRD) methods and microscopic observations of the multilayer surface were carried out. Structural changes were found to occur under the influence of heating due to the mutual diffusion of Cu and Ni, resulting in a loss of the multilayer nature of the structure. Early indications of a surface discontinuity of the multilayer, as noticed in microscopic observations and then confirmed by X-ray measurements, were found at a temperature of 220 °C. At higher temperatures, intensive delamination of the multilayer from the silicon substrate followed as a result of thermal stresses caused by a large difference in the thermal expansion coefficients between the multilayer and silicon.

Słowa kluczowe

EN

Cu/Ni multilayer; thermal stability; X-ray technique

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Optica Applicata
• Rocznik: 2012
• Tom: Vol. 42, nr 4
• Strony: 725--736
• Opis fizyczny: Bibliogr. 18 poz., rys., wykr.

Twórcy

autor

Kucharska B.

• Institute of Materials Engineering, Częstochowa University of Technology, Armii Krajowej 19, 42-200 Częstochowa, Poland

autor

Kulej E.

autor

Wróbel A.

Bibliografia

• [1] SCHULLER I.K., KIM S., LEIGHTON C., Magnetic superlattices and multilayers, Journal of Magnetism and Magnetic Materials 200(1–3), 1999, pp. 571–582.
• [2] KANAK J., STOBIECKI T., WIŚNIOWSKI P., GŁADYSZEWSKI G., MAASS W., SZYMAŃSKI B., XRD study of the structure of NiFe/Au and NiFe/Cu superlattices, Journal of Magnetism and Magnetic Materials 239(1–3), 2002, pp. 329–331.
• [3] MIYAKE T., KUME M., YAMAGUCHI K., AMALNERKAR D.P., MINTURA H., Electrodeposition of Cu/Ni–P multilayers by a single bath technique, Thin Solid Films 397(1–2), 2001, pp. 83–89.
• [4] SZELOCH R.F., POSADOWSKI W.M., GOTSZALK T.P., JANUS P., KOWALIW T., Thermal characterization of copper thin films made by means of sputtering, Materials Science-Poland 21(3), 2003, pp. 339–343.
• [5] KUCHARSKA B., KULEJ E., KANAK J., Investigation of the topography of magnetron-deposited Cu/Ni multilayers by X-ray reflectometry and atomic force microscopy, Optica Applicata 39(4), 2009, pp. 881–888.
• [6] DONG CHENG, ZHI JUN YAN, LI YAN, Misfit dislocation network in Cu/Ni multilayers and its behaviors during scratching, Thin Solid Films 515(7–8), 2007, pp. 3698–3703.
• [7] HARISH C. BARSHILIA, RAJAM K.S., Characterization of Cu/Ni multilayer coatings by nanoindentation and atomic force microscopy, Surface and Coatings Technology 155(2–3), 2002, pp. 195–202.
• [8] DUŚ-SITEK M., NABIAŁEK M., GĄGOROWSKA B., Correlation between physical properties of superlattices obtained by means of electrochemical deposition method and ion spraying, Optica Applicata 39(4), 2009, pp. 645–653.
• [9] WEN S.P., ZONG R.L., ZENG F., GU Y.L., GAO Y., PAN F., Thermal stability of microstructure and mechanical properties of Ni/Ru multilayers, Surface and Coatings Technology 202(10), 2008, pp. 2040–2046.
• [10] BEKE D.L., LANGER G.A., KISS-VARGA M., DUDAS A., NEMES P., DARÓCZI L., KEREKES G., ERDÉLYI Z., Thermal stability of amorphous and crystalline multilayers produced by magnetron sputtering, Vacuum 50(3–4), 1998, pp. 373–383.
• [11] WEI-YU CHEN, JENQ-GONG DUH, Thermal stability of sputtered Ni–P and Ni–P–Cr coatings during cycling test and annealing treatment, Surface and Coatings Technology 177–178, 2004, pp. 222–226.
• [12] ARCONADA N., DURÁN A., SUÁREZ S., PORTELA R., CORONADO J.M., SÁNCHEZ B., CASTRO Y., Synthesis and photocatalytic properties of dense and porous TiO2 -anatase thin films prepared by sol–gel, Applied Catalysis B: Environmental 86(1–2), 2009, pp. 1–7.
• [13] TAYLOR G.I., Plastic strain in metals, Journal of the Institute of Metals 62, 1938, p. 307.
• [14] KUCHARSKA B., NITKIEWICZ Z., A low-cost temperature attachment for in-situ measurements in the X-ray diffractometer, Inżynieria Materiałowa 6, 2008, pp. 1072–1075.
• [15] KUCHARSKA B., KULEJ E., X-ray measurement of the Cu/Ni multilayer period, Archives of Metallurgy and Materials 55(1), 2010, pp. 45–51.
• [16] BALOGH Z., CHELLALI M.R., GREIWE G.H., SCHMITZ G., ERDÉLYI Z., Interface sharpening in miscible Ni/Cu multilayers studied by atom probe tomography, Applied Physics Letters 99(18), 2011, article 181902
• [17] CULLITY B.D., Elements of X-Ray Diffractions, 2nd Ed., Addison-Wesley, Massachusetts, 1978.
• [18] HANABUSA T., KUSAKA K., SAKATA O., Residual stress and thermal stress observation in thin copper films, Thin Solid Films 459(1–2), 2004, pp. 245–248.