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Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy

Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This paper presents an investigation on corrosion behavior of Sn-1.0Ag-0.5Cu-XAl (X = 0, 0.1, 0.5, 1.0) by means of polarization and electrochemical impedance spectroscopy (EIS) measurements in 3.5 wt.% NaCl solution. The results show that addition of aluminum into SAC105 shifts the corrosion current density and passivation current density towards more positive values. It is also found that with an increase in aluminum concentration in SAC105 solder alloy, the corrosion current density increases and polarization resistance decreases. This suggests that SAC105 with the highest concentration of Al has the lowest corrosion resistance. In this case, the corrosion behavior seems to be attributed to anodic dissolution of aluminum and Sn-matrix.
Słowa kluczowe
Wydawca
Rocznik
Strony
694--701
Opis fizyczny
Bibliogr. 25 poz., rys., tab.
Twórcy
autor
  • Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
autor
  • Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
  • Department of Mechanical Engineering, University of Jeddah, Saudi Arabia
  • Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
Bibliografia
  • [1] MOHANTY U.S., LIN K.L., Appl. Surf. Sci., 252 (2006), 5907.
  • [2] OSORIO W.R., SPINELLI J.E., AFONSO C.R.M., PEIXOTO L.C., GARCIA A., Electrochim. Acta, 56 (2011), 8891.
  • [3] LEONARDO R.G., OSORIO W.R., PEIXOTO L.C., GARCIA A., Mater. Charact., 61 (2010), 212.
  • [4] MOHANTY U.S., LIN K.L., J. Electrochem. Soc., 153 (2006), B319.
  • [5] RAEDER C.H., FELTON L.E., TANZI V.A., KNORR D.B., J. Electron. Mater., 23 (1994), 611.
  • [6] TOMLINSON W.J., COLLIER I., J. Mater.Sci., 22 (1987), 1835.
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  • [8] MCCORMACK M., JIN S., J. Electron. Mater., 23 (1994), 635.
  • [9] SABRI M.F.M., DHAFER A.S., IRFAN A.B., SUHANA M.S., CHE F.X., TADASHI A., Mater. Charact., 78 (2013), 129.
  • [10] XU L., PANG J.H.L., CHE F., J. Electron. Mater., 37 (2008), 880.
  • [11] YOU T., KIM Y., KIM J., LEE J., JUNG B., MOON J., J. Electron. Mater., 38 (2009), 410.
  • [12] LIU W., LEE N.C., JOM, 59 (2007), 26.
  • [13] HUANG B., HWANG H.S., LEE N.C., Proc. Electronic Components and Technology Conf. (IEEE), 2007, 184.
  • [14] BIRZER C., RAKOW B., STEINER R., WALTER J., Proc. Electronics Packaging Technology Conf. (IEEE), 2005, 255.
  • [15] ZHAO X.J., CAERS J.F.J.M., DE VRIES J.W.C., KLOOSTERMAN J., WONG E.H., RAJOO R., Proc. Electronics Packaging Technology Conf. (IEEE), 2006, 174.
  • [16] KIM D., SUH D., MILLARD T., KIM H., KUMAR C., ZHU M., XU Y., Proc. Electronic Components and Technology Conf. (IEEE), 2007, 1614.
  • [17] SUH D., KIM D. W., LIU P., KIM H., WENINGER J.A., KUMAR C.M., PRASAD A., GRIMSLEY B.W., TEJADA H.B., Mater. Sci. Eng., A, (2007), 595.
  • [18] KITTIDACHA W., KANJANAVIKAT A., VATTAANANIYOM K., Proc. Electronics Packaging Technology Conf. (IEEE), 2008, 1074.
  • [19] KARIYA Y., HOSSI T., TERASHIMA S., TANAKA M., OTSUKA M., J. Electron. Mater., 33 (2004), 321.
  • [20] WEI C., LIU Y.C., YU L.M., CHEN H., WANG X., Microelectron. Reliab., 50 (2010), 1142.
  • [21] DHAFER A.S., SABRI M.F.M., IRFAN A.B., SUHANA M.S., CHE F.X., J. Mater. Sci. Mater. El., 23 (2012), 1988.
  • [22] LEE Y.W., KIM I.H., KIM E.S., LEE J.H., MOON J.T., Proc. Electronics Packaging Technology Conf. (IEEE), 2010, 429.
  • [23] STIRRUP B.N., HAMPSON N.A., Surf. Technol., 5 (1977), 429.
  • [24] DROGOWSKA M., MENARD H., BROSSARD L., J. Appl. Electrochem., 21 (1991), 84.
  • [25] PISTORIUS P.C., BURSTEIN G.T., Corros. Sci., 38 (1994), 1525.
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2018).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-b6036500-4b77-4ab7-b5da-357b261318a6
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