Sn-Pd-Ni Electroplating on Bi₂Te₃-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface

• Autorzy: Kang Seok Jun , Bae Sung Hwa , Son Injoon

Identyfikatory

DOI

10.24425/amm.2021.136406

• Języki publikacji: EN

Abstrakty

EN

The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi₂Te₃-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi₂Te₃-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi₂Te₃-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi₂Te₃ TE. This process of electroplating Sn/Pd/Ni onto the Bi₂Te₃ TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.

Słowa kluczowe

EN

tin electroplating; thermoelectric module; thermocompression bonding; Bi2Te3; direct bonding

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2021
• Tom: Vol. 66, iss. 4
• Strony: 963--966
• Opis fizyczny: Bibliogr. 17 poz., fot., rys.

Twórcy

autor

Kang Seok Jun

• Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea

• https://orcid.org/0000-0001-8704-0029

autor

Bae Sung Hwa

• Kyushu University, Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan

• https://orcid.org/0000-0003-4096-3197

autor

Son Injoon

• Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea

• https://orcid.org/0000-0002-2282-8007

Bibliografia

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Uwagi

Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2021).