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Physical separation route for printed circuit boards

Autorzy
Treść / Zawartość
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Recently, the consumption of electrical and electronic equipment (EEE) has increased with the advanced technology. A wide range of components made of metals, plastics and other substances are contained in EEE. Electronic waste (e-waste) is easily demounted and separated by manually methods; however, printed circuit board (PCB) which is one the most common components of e-waste need to be recycled with economic and environmental technologies. In this paper, employing physical separation methods to ground waste PCB, an eco-friendly, simple and environmental process for separation of valuable metals was designed and proposed. A heavy fraction with 40.8% Cu, 350 ppm Au and 475 ppm Ag content at recovery of 95.4% Cu, 77.7% Au and 65.1% Ag was obtained from a feed assaying 12% Cu, 130 ppm Au and 200 ppm Ag using shaking table separator. Cu grade was increased from 52.4% to 73.9% with the recovery over 92% by dry magnetic separator and copper alloys were separated from the waste matrix with 98% Cu recovery using electrostatic separator.
Słowa kluczowe
Rocznik
Strony
554--566
Opis fizyczny
Bibliogr. 30 poz., rys., tab.
Twórcy
autor
  • Istanbul Technical University, Mineral Processing Engineering Department, Recycling, Separation and Purification Research Group, 34469, Maslak, Istanbul, Turkey
autor
  • Istanbul Technical University, Mineral Processing Engineering Department, Recycling, Separation and Purification Research Group, 34469, Maslak, Istanbul, Turkey
Bibliografia
  • CUI, J., FORSSBERG, E., 2003. Mechanical recycling of waste electric and electronic equipment: a review, Journal of Hazardous Materials. 99, 243-263.
  • CUI, J., ZHANG, L., 2008. Metallurgical recovery of metals from electronic waste: a review, Journal of Hazardous Materials. 158, 228-256.
  • DAS, A., VIDYADHAR, A., MEHROTRA, S.P., 2009. A novel flowsheet for the recovery of metal values from waste printed circuit boards, Resources, Conservation and Recycling. 53, 464-469.
  • DIAO, Z., ZHAO, Y., CHEN, B., DUAN, C., SONG, S., 2013. ReaxFF reactive force field for molecular dynamics simulations of epoxy resin thermal decomposition with model compound, Journal of Analytical and Applied Pyrolysis. 104, 618-624.
  • DUAN, H.; HOU, K.; LI, J.; ZHU, X., 2011. Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns, Journal of Environmental Management. 92, 392-399.
  • DUAN, C.L., DIAO, Z.J., ZHAO, Y.M, HUANG, W., 2015. Liberation of valuable materials in waste printed circuit boards by high-voltage electrical pulses, Minerals Engineering. 70: 170-177.
  • ESWARAIAH, C., KAVITHA, T., VIDYASAGAR, S., NARAYANAN, S.S., 2008. Classification of metals and plastics from printed circuit boards (PCB) using air classifier, Chemical Engineering and Processing. 47: 565-576.
  • GHOSHA, B., GHOSHA, M.K., PARHIC, P., MUKHERJEEA, P.S., MISHRAA, B.K., 2015. Waste printed circuit boards recycling: an extensive assessment of current status, Journal of Cleaner Production. 94, 5-19.
  • GOOSEY, M., KELLNER, R., 2003. Recycling technologies for the treatment of end of life printed circuit boards (PCBs). Circuit World, 29, 33-37.
  • GUO, J., RAO, Q., XU, Z., 2008. Application of glass non-metals of waste printed circuit boards to produce phenolic moulding compound, Journal of Hazardous Materials. 53, 728-734.
  • HOFFMANN, J.E., 1992. Recovering precious metals from electronic scrap, The Journal of The Minerals, Metals & Materials Society. 44, 43-48.
  • JHA, M.K., LEE, J.C., KUMARI, A., CHOUBEY, P.K., KUMAR, V., JEONG, J., 2011. Pressure leaching of metals from waste printed circuit boards using sulphuric acid, The Journal of The Minerals, Metals & Materials Society. 63, 29-32.
  • KELLY, E.G., SPOTTISWOOD, D.J., 1982. Introduction to Mineral Processing, Wiley- Interscience.
  • KOYANAKA, S., OHYA, H., LEE, J.C., IWATA, H., ENDOH, S., 1999. Impact milling of printed circuit board wastes for resources recycling and evaluation of the liberation using heavy medium separation, Journal of the Society of Powder Technology Japan 36, 479-483.
  • LEE, C.H., CHANG, C.T., FAN, K.S., CHANG, T.C., 2004. An overview of recycling and treatment of scrap computers, Journal of Hazardous Materials. 114, 93-100.
  • LI, J., SHRIVASTAVA, P., GAO, Z., ZHANG, H.C., 2004. Printed circuit board recycling: a state of the art survey, IEEE Transactions on Electronics Packaging Manufacturing. 27, 33-42.
  • LI, J., LU, H., GUO, J., XU, Z., ZHOU, Y., 2007. Recycle technology for recovering resources and products from waste printed circuit boards. Environmental Science and Technology. 41, 1995-2000.
  • LI, J., XU, Z., ZHOU, Y.H., 2007b. Application of corona discharge and electrostatic force to separate metals and nonmetals from crushed particles of waste printed circuit boards, Journal of Electrostatics. 65, 233-238.
  • LI, J., DUAN, H., YU, K., LIU, L., WANG, S., 2010. Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmosphere, Resources, Conservation and Recycling. 54, 810–815.
  • MENAD, N., BJÖRKMAN, B., ALLAIN, E.G., 1998. Combustion of plastics contained in electric and electronic scrap, Resources, Conservation and Recycling. 24, 65-85.
  • MECUCCI, A., SCOTT, K., 2005. Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards, Journal of Chemical Technology and Biotechnology. 77, 449-457.
  • MIANQIANG, X., GUOQING, Y., JIA, L., ZHENMING, X., 2012. Electrostatic separation for recycling conductors, semiconductors, and nonconductors from electronic waste, Environmental Science & Technology. 46, 10556-10563.
  • PILONE, D., KELSALL, G.H., 2003. Metal recovery from electronic scrap by leaching and electrowinning, Hydrometallurgy 2003: Proceedings of the 5th International Symposium, Vancouver, Canada, 1565–1575.
  • SARVAR, M., SALARIRAD, M.M., SHABANI, M.A., 2015. Characterization and mechanical separation of metals from computer printed circuit boards (PCBs) based on mineral processing methods, Waste Management. 45, 246-257.
  • OISHI, T., KOYAMA, K., ALAM, S., TANAKA, M., LEE, J.C., 2007. Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate of chloride solutions, Hydrometallurgy. 89, 82-88.
  • TENÓRIO, J.A.S., 2005. Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap, Waste Management. 25, 67-74.
  • VEIT, H.M., DIEHL, T.R., SALAMI, A.P., RODRIGUES, J.S., BERNARDES, A.M., WILLS, B.A., NAPIER-MUNN, T., NAPIER-MUNN, B.A.W., 2006. Gravity Concentration. In: Wills’ Mineral Processing Technology, seventh ed., Butterworth- Heinemann, Oxford, 225-245.
  • ZHOU, Y., QIU, K., 2010. A new technology for recycling materials from waste printed circuit boards, Journal of Hazardous Materials. 175, 823-828.
  • ZHANG, S., FORSSBERG, E., 1997. Mechanical separation-oriented characterization of electronic scrap, Resources, Conservation and Recycling. 21, 247-269.
  • ZHANG, S., FORSSBERG, E., 1999. Intelligent liberation and classification of electronic scrap, Powder Technology. 105, 295-301.
Uwagi
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-b091ede9-ade5-4b17-b17e-5106eb37c6ee
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