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Considerations on SiC MOSFET TSEP-based junction temperature measurement routines in practical use

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Warianty tytułu
PL
Praktyczne wykorzystanie metod pomiaru temperatury złącza tranzystora SiC MOSFET w oparciu o parametry elektryczne
Języki publikacji
EN
Abstrakty
EN
Despite being discussed in multiple papers, practical implementation of TSEP-based junction temperature measurement method for SiC MOSFETs causes significant challenges, especially when used in real-life power converters. Challenges which are not usually considered in conference nor journal pares are related to applicability, repeatability and accuracy, especially in comparison to other well-established techniques. To fill this gap in the state of the art, various test routines for junction temperature estimation based on SiC MOSFET on-state channel resistance measurement were compared.
PL
Pomimo omawiania tematu pomiaru temperatury złącza tranzystorów SiC MOSFET w oparciu o ich parametry elektryczne w wielu artykułach, pomiar ten dalej nastręcza wielu trudności - w szczególności przy wykorzystaniu w rzeczywistych przekształtnikach energoelektronicznych. Wyzwania, które z reguły są pomijane w artykułach badawczych dotyczą wykonywalności, powtarzalności i dokładności pomiaru, w szczególności przy porównianiu do innych dobrze znanych metod pomiaru. Aby wypełnić tę lukę, porównano różne sposoby estymacji temperatury złącza w oparciu o pomiar rezystancji kanału tranzystora SiC MOSFET.
Słowa kluczowe
Rocznik
Strony
31--37
Opis fizyczny
Bibliogr. 23 poz., rys., tab.
Twórcy
  • Research and Development Department TRUMPF Huettinger Sp. z o. o. ul. Marecka 47 05-220 Zielonka, Poland
  • Research and Development Department TRUMPF Huettinger Sp. z o. o. ul. Marecka 47 05-220 Zielonka, Poland
  • Research and Development Department TRUMPF Huettinger Sp. z o. o. ul. Marecka 47 05-220 Zielonka, Poland
autor
  • Research and Development Department TRUMPF Huettinger Sp. z o. o. ul. Marecka 47 05-220 Zielonka, Poland
Bibliografia
  • [1] Ying Zhang, Luhong Xie, Yuxing Yan, Yushan Zhao, Yongzhang Huang, and Erping Deng. Investigation on vsd(t) and vds,on(t) methods for cascode gan device junction temperature measurement. In 2023 IEEE 6th International Electrical and Energy Conference (CIEEC), pages 3095–3098, 2023.
  • [2] E. R. Motto and J. F. Donlon. Igbt module with user accessible on-chip current and temperature sensors. In 2012 Twenty Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC), pages 176–181, Feb 2012.
  • [3] Konrad Markowski, Juliusz Bojarczuk, Piotr Araszkiewicz, Jakub Ciftci, Adam Ignaciuk, and Michał G ˛aska. High temperature measurement with low cost, vcsel-based, interrogation system using femtosecond bragg gratings. Sensors, 22(24), 2022.
  • [4] Konrad Markowski, Juliusz Bojarczuk, Piotr Araszkiewicz, Robert Cybulski, Michal Gaska, and Arkadiusz Golaszewski. Analysis of the performance of wdm-cdm bragg grating interrogation system with high-contrast grating vcsel. Journal of Light wave Technology, 41(9):2892–2903, 2023.
  • [5] Haoze Luo, Junjie Mao, Chengmin Li, Francesco Iannuzzo, Wuhua Li, and Xiangning He. Online junction temperature and current simultaneous extraction for sic mosfets with electrolu minescence effect. IEEE Transactions on Power Electronics, 37(1):21–25, 2022.
  • [6] A. Griffo, J. Wang, K. Colombage, and T. Kamel. Real-time measurement of temperature sensitive electrical parameters in sic power mosfets. IEEE Transactions on Industrial Electronics, 65(3):2663–2671, March 2018.
  • [7] Dan Zheng, Yuhui Kang, Han Cao, Xiaoguang Chai, Tao Fan, and Puqi Ning. Monitoring of sic mosfet junction temperature with on-state voltage at high currents. Chinese Journal of Electrical Engineering, 6(3):1–7, 2020.
  • [8] Fumiki Kato, Shinji Sato, Kenichi Koui, Hidekazu Tanisawa, Hiroshi Hozoji, and Hiroshi Yamaguchi. Study of gate bias voltage for preventing threshold shift of sic–mosfet body diode during transient temperature measurements. In 2019 International Conference on Electronics Packaging (ICEP), pages 88–91, 2019.
  • [9] Jose Ortiz Gonzalez and Olayiwola Alatise. Bias temperature instability and junction temperature measurement using electrical parameters in sic power mosfets. IEEE Transactions on Industry Applications, 57(2):1664–1676, 2021.
  • [10] B. Shi, S. Feng, L. Shi, D. Shi, Y. Zhang, and H. Zhu. Junction temperature measurement method for power mosfets using turn-on delay of impulse signal. IEEE Transactions on Power Electronics, 33(6):5274–5282, June 2018.
  • [11] H. Kuhn and A. Mertens. On-line junction temperature measurement of igbts based on temperature sensitive electrical parameters. In 2009 13th European Conference on Power Electronics and Applications, pages 1–10, Sep. 2009.
  • [12] N. Baker, S. Munk-Nielsen, F. Iannuzzo, and M. Liserre. Online junction temperature measurement using peak gate current. In 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), pages 1270–1275, March 2015.
  • [13] T. Hunger and R. Bayerer. Extended reliability of substrate solder joints in power modules. In 2009 13th European Conference on Power Electronics and Applications, pages 1–8, Sep. 2009.
  • [14] Sebastian Baba, Marek Jasinski, and Marcin Zelechowski. Temperature measurement of rf power amplifier. In 2020 19th International Power Electronics and Motion Control Conference, pages 1–1, 2021.
  • [15] T. Krone, L. Dang Hung, M. Jung, and A. Mertens. On-line semiconductor switching loss measurement system for an advanced condition monitoring concept. In 2016 18th European Conference on Power Electronics and Applications (EPE’16 ECCE Europe), pages 1–10, Sep. 2016.
  • [16] Julian Weimer, Dominik Koch, and Ingmar Kallfass. Accuracy study of calorimetric switching loss energy measurements for wide bandgap power transistors. In 2021 23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe), pages P.1–P.9, 2021.
  • [17] L. Li, P. Ning, D. Zhang, and X. Wen. An exploration of thermo sensitive electrical parameters to estimate the junction temperature of silicon carbide mosfet. In 2017 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific), pages 1–5, Aug 2017.
  • [18] J. Ortiz Gonzalez and O. Alatise. Challenges of junction temperature sensing in sic power mosfets. In 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia), pages 891–898, 2019.
  • [19] J. Kuprat, C. H. Van der Broeck, M. Andresen, S. Kalker, R. W. De Doncker, and M. Liserre. Research on active thermal control: Actual status and future trends special issue commemorating 40 years of wempec, 2021. IEEE Journal of Emerging and Selected Topics in Power Electronics, pages 1–1, 2021.
  • [20] H. Niu and R. D. Lorenz. Real-time junction temperature sensing for silicon carbide mosfet with different gate drive topologies and different operating conditions. IEEE Transactions on Power Electronics, 33(4):3424–3440, April 2018.
  • [21] Thomas Harder. Qualification of power modules for use in power electronics converter units in motor vehicles, May 2021.
  • [22] S. Baba, A. Gieraltowski, M. T. Jasinski, F. Blaabjerg, A. S. Bahman, and M. Zelechowski. Active power cycling test bench for sic power mosfets - principles, design and implementation. IEEE Transactions on Power Electronics, pages 1–1, 2020.
  • [23] S. Baba, M. Zelechowski, and M. Jasinski. Estimation of thermal network models parameters based on particle swarm optimization algorithm. In 2019 IEEE 13th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), pages 1–6, 2019.
Uwagi
Opracowanie rekordu ze środków MNiSW, umowa nr POPUL/SP/0154/2024/02 w ramach programu "Społeczna odpowiedzialność nauki II" - moduł: Popularyzacja nauki i promocja sportu (2025).
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-b01e7c7d-7d1a-4f51-bbd9-59db16d09cb4
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