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Warianty tytułu
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Abstrakty
The substitution of ecologically "hazardous" materials with acceptable substitutes in thick-film ceramic interconnection module is possible with the lead-free soldering technology and with the new emerging "ecological friendly" thick-film pastes. But using the new materials requires research and estimation of the reliability of new "green" ceramic modules as compared with "conventional" ones. As a case study we designed a thick-film ceramic module which was produced using "ecological friendly" as well as "conventional" materials. Modules were aged under accelerated conditions such as temperature cycling and humidity testing.
Wydawca
Czasopismo
Rocznik
Tom
Strony
104--112
Opis fizyczny
Bibliogr. 4 poz., rys., tab., wykr.
Twórcy
autor
autor
autor
autor
autor
autor
autor
autor
autor
- HIPOT-R&D, d.o.o., Trubarjeva 7, SI-8310 Sentjernej, Slovenia, darko.belavic@ijs.si
Bibliografia
- [1] Eveloy W., Ganesam S., Fukuda Y., Wu J., Pecht M. G.: WEEE, RoHS, and what you must do to get ready for lead-free electronics, Informacije MIDEM, vol. 35, nr 4, 2005, pp. 196-212.
- [2] Harper C. A.: Handbook of Thick Film Hybrid Microelectronics, McGraw-Hill, New York, 1974
- [3] Lau J. H., Wong C.P., Lee N-C. Lee S. W. R.: Electronics manufacturing with lead-free, halogen free and conductive-adhesive material, McGraw-Hill, New York, 2003
- [4] Buchthorpe A. C., Cocker J., Garreau-Iles L., Greenhill D., Parr R., Sweeney T.: Lead-free solutions for ceramic modules, Proc 4th European Microelectronics and Packaging Symposium EMPS 2006, Terme Catez, Slovenia, May 2006, pp. 115-120.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-PWA3-0025-0011