Substitution of ecologically hazardous substances in thick-film ceramic interconnection modules

• Autorzy: Belavic D. , Rocak D. , Hrovat M. , Fajfar-Plut J. , Pavlic J. , Macek S. , Drozd Z. , McGill I. , Bukat K.
• Języki publikacji: EN

Abstrakty

EN

The substitution of ecologically "hazardous" materials with acceptable substitutes in thick-film ceramic interconnection module is possible with the lead-free soldering technology and with the new emerging "ecological friendly" thick-film pastes. But using the new materials requires research and estimation of the reliability of new "green" ceramic modules as compared with "conventional" ones. As a case study we designed a thick-film ceramic module which was produced using "ecological friendly" as well as "conventional" materials. Modules were aged under accelerated conditions such as temperature cycling and humidity testing.

Słowa kluczowe

EN

microelectronics; ecologically hazardous substances; ceramic modules

PL

mikroelektronika; substancja niebezpieczna; substytut; moduły ceramiczne

• Wydawca: Przemysłowy Instytut Elektroniki
• Czasopismo: Prace Przemysłowego Instytutu Elektroniki
• Rocznik: 2006
• Tom: nr 153
• Strony: 104--112
• Opis fizyczny: Bibliogr. 4 poz., rys., tab., wykr.

Twórcy

autor

Belavic D.

autor

Rocak D.

autor

Hrovat M.

autor

Fajfar-Plut J.

autor

Pavlic J.

autor

Macek S.

autor

Drozd Z.

autor

McGill I.

autor

Bukat K.

• HIPOT-R&D, d.o.o., Trubarjeva 7, SI-8310 Sentjernej, Slovenia,

Bibliografia

• [1] Eveloy W., Ganesam S., Fukuda Y., Wu J., Pecht M. G.: WEEE, RoHS, and what you must do to get ready for lead-free electronics, Informacije MIDEM, vol. 35, nr 4, 2005, pp. 196-212.
• [2] Harper C. A.: Handbook of Thick Film Hybrid Microelectronics, McGraw-Hill, New York, 1974
• [3] Lau J. H., Wong C.P., Lee N-C. Lee S. W. R.: Electronics manufacturing with lead-free, halogen free and conductive-adhesive material, McGraw-Hill, New York, 2003
• [4] Buchthorpe A. C., Cocker J., Garreau-Iles L., Greenhill D., Parr R., Sweeney T.: Lead-free solutions for ceramic modules, Proc 4th European Microelectronics and Packaging Symposium EMPS 2006, Terme Catez, Slovenia, May 2006, pp. 115-120.