Design Model and Data Management for 3D IC Development

• Autorzy: Grunewald W. , Hahn K. , Bruck R. R.
• Języki publikacji: EN

Abstrakty

EN

The development of 3D systems is a highly complex procedure. Next to a huge variation of possibilities on how to vertically integrate two or more dies, a lot of aspects regarding cost, design and application specific selection of technology have to be considered. Therefore a design model will be presented, that considers the mutual influence of design and process technology during the integration flow development. The design model has been implemented in a software system. To be able to develop integration flows, complex technology information is needed, which results in the necessity of a data management with usage of a technology database.

Słowa kluczowe

EN

3D integration; data management; design model; process flow

PL

integracja 3D; zarządzanie danymi; projekt modelu; przebieg procesu

• Wydawca: Lodz University of Technology. Department of Microelectronics and Computer Science
• Czasopismo: International Journal of Microelectronics and Computer Science
• Rocznik: 2012
• Tom: Vol. 3, nr 3
• Strony: 88--94
• Opis fizyczny: Bibliogr. 10 poz.

Twórcy

autor

Grunewald W.

autor

Hahn K.

autor

Bruck R. R.

• Institute of Microsystem Engineering, Department of Electrical Engineering and Computer Science, University of Siegen, Holderlinstrasse 3, 57068 Siegen, Germany,

Bibliografia

• [1] P. Marchal et al., “3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot,” Proceedings of the IEEE, vol. 97, 2009.
• [2] P. Emma, E. Kursun, “3D system design: A case for building customized modular systems in 3D,” Interconnect Technology Conference (IITC), 2010.
• [3] P. Garrou, C. Bower and P. Ramm, “Handbook of 3D Integration,” Wiley-VCH, 2008.
• [4] Yole Développement, “Thin wafer handling for 3D TSV,” SEMATECH Workshop SEMICON West, 2011.
• [5] K. Hahn, A. Wagener, J. Popp and R. Brück, “Process management and design for MEMS and microelectronics technologies,” Proceedings of SPIE: Microelectronics: Design, Technology, and Packaging, vol. 5274, 2003.
• [6] D. Velenis, M. Stucchi, E.J. Marinissen, B. Swinnen and E. Beyne, “Impact of 3D design choices on manufactering cost,“ IEEE International Conference on 3D System Integration, 2009.
• [7] X. Dong and Y. Xie, “System-Level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs),” Asia and SouthPacific Design Automation Conference, 2009.
• [8] A. Grünewald, K. Hahn, R. Brück, “Software-based Development of 3D Integration Flows,” 35th International Electronics Manufacturing Technology Conference, 2012, in press.
• [9] PostgreSQL: http://www.postgresql.org/
• [10] XML: http://www.w3.org/XML/