Inverse heat transfer problems in electronics

• Autorzy: Janicki M.
• Języki publikacji: EN

Abstrakty

EN

This dissertation discusses selected topics related to the thermal modelling of electronic systems. After a short introduction, the author presents in the first chapter the mathematical model describing the heat transfer processes occurring in such systems and formulates the heat equation determining the temperature distribution in a structure. Then, different methods of solving the equation, both numerical and analytical ones, are discussed. Particular attention is paid to the analytical method based on the Green's function approach, in which a solution is found for three-dimensional, non-homogenous, multi-layered structures. This solution method constitutes the original contribution of the author. A separate section of this chapter is devoted to the compact thermal modelling of electronic systems. There, except for the presentation of the standard methodology leading to the creation of boundary condition independent models, the author proposes its own approach based on the network identification by deconvolution method, producing thermal models in the form of the Cauer RC ladder network. The remaining three chapters are devoted to the description of the inverse heat transfer problems. First, these problems and their existing solution methods are briefly characterised. The following chapter presents an overview of various model parameter estimation techniques. In particular, the problem of estimating the temperature dependence of the heat transfer coefficient value is discussed. The estimation is performed by the coupling of a direct analytical thermal solver with an inverse derivative-free algorithm. The final chapter of this dissertation discusses various function estimation techniques. In particular, it illustrates the inverse problem consisting in real time estimation of power dissipated in heat sources based on remote temperature measurements. First, the author discusses in detail the problem of the optimal choice of sensor locations for a given heat source configuration. Finally, an original digital filter implementation of the sequential function specification method is proposed. This filter was used for the estimation of dissipated power in a real integrated circuit.

PL

Niniejsza rozprawa omawia wybrane zagadnienia dotyczące modelowania termicznego systemów elektronicznych. Po krótkim wstępie, autor przedstawia w pierwszym rozdziale model matematyczny opisujący procesy wymiany ciepła zachodzące w ciałach stałych formułując jednocześnie równanie różniczkowe cząstkowe przewodnictwa cieplnego opisujące pole temperatury. Kolejno autor dokonuje krótkiego przeglądu dostępnych metod numerycznych i analitycznych rozwiązywania tego równania. Szczególną uwagę autor poświęca analitycznej metodzie wykorzystującej funkcje Greena podając rozwiązanie równania dla trójwymiarowej, niejednorodnej struktury warstwowej. Rozwiązanie to stanowi oryginalny, własny wkład autora. Oddzielny podrozdział pracy poświęcony jest tzw. kompaktowym modelom termicznym systemów elektronicznych. Oprócz standardowej metodologii tworzenia niezależnych od warunków brzegowych modeli termicznych, omówiono w nim zaproponowaną przez autora technikę tworzenia kompaktowych modeli termicznych opartą na metodzie identyfikacji systemu poprzez rozplot jego odpowiedzi termicznej na wymuszenie skokiem jednostkowym. Zaproponowana metoda pozwala na otrzymanie kompaktowych modeli termicznych w postaci drabinek RC o niewielkiej liczbie elementów. Kolejne trzy rozdziały monografii poświęcone są odwrotnym problemom cieplnym. Pierwszy z nich przedstawia zwięzłą charakterystykę tego typu problemów oraz omawia stosowane obecnie metody ich rozwiązywania. Następny rozdział zawiera krótki przegląd metod estymacji parametrów modeli. W szczególności autor zajmuje się problemem szacowania lokalnej wartości współczynnika wymiany ciepła w zależności od temperatury powierzchni. Autor wykorzystuje do tego celu bezgradientowy algorytm do rozwiązywania problemów odwrotnych sprzężony z symulatorem termicznych. Ostatni rozdział prezentuje różnego rodzaju algorytmy odwrotne służące do estymacji funkcji. W szczególności autor zajmuje się szacowaniem w czasie rzeczywistym mocy rozpraszanej w źródłach ciepła na podstawie pomiarów z odległych czujników temperatury. Autor omawia problematykę optymalnego, dla danej konfiguracji źródeł ciepła, wyboru położenia czujników. Na zakończenie przedstawia własną zmodyfikowaną wersję sekwencyjnego algorytmu współczynników wrażliwości zaimplementowanego w postaci filtru cyfrowego, który to został wykorzystany do szacowania mocy w rzeczywistym układzie scalonym.

Słowa kluczowe

EN

thermal modelling; electronic systems modelling; inverse heat transfer

PL

modelowanie termiczne; modelowanie systemów elektronicznych; odwrotny przepływ ciepła

• Wydawca: Wydawnictwo Politechniki Łódzkiej
• Czasopismo: Zeszyty Naukowe. Rozprawy Naukowe / Politechnika Łódzka
• Rocznik: 2012
• Tom: Z. 418
• Strony: 1--158
• Opis fizyczny: Bibliogr. 240 poz.

Twórcy

autor

Janicki M.

• Katedra Mikroelektroniki i Technik Informatycznych Politechniki Łódzkiej

Bibliografia

• Publications with author's contribution
• [A-1] Janicki M., Zubert M., Wójciak W., Orlikowski M., and Napieralski A.: Estimation of IC temperature solving inverse problem. In Proc. 4th Intl. Workshop MIXDES, Poznań, Poland, 12-14 June 1997, pp. 253-257.
• [A-2] Janicki M., Zubert M., Napieralski A.: Application of inverse heat conduction problem solution with error correction to estimation of IC temperature. In Proc. 3rd Intl. Workshop THERMINIC, 21-23 September 1997, Cannes, France, pp. 17-22.
• [A-3] Napieralski A., Furmańczyk M., Pacholik J., Jabłoński G., Wójciak W., Napieralska M., Grecki M., Ciota Z., Ati A.A., Janicki M., Orlikowski M., Zubert M.: The Tulsoft approach. In book: "Basic Research for Microsystems Integration," CEPADUES-EDITIONS, Toulouse, France, 1997, pp. 124-136.
• [A-4] Janicki M., Zubert M., Wójciak W., Orlikowski M., and Napieralski A.: Application of inverse problems to IC temperature estimation. In book "Mixed Design of Integrated Circuits and Systems," Kluwer AP, 1998, pp. 55-60.
• [A-5] Janicki M., Soraghan J., and Napieralski A.: Strategy for optimisation of heat sources and temperature sensors position in integrated circuits. In Proc. 5th Intl. Conference MIXDES, Lodz, Poland, 18-20 June 1998, pp. 209-212.
• [A-6] Janicki M., Soraghan J., Napieralski A., Zubert M.: Application of adaptive filters to integrated circuit temperature estimation from noisy temperature sensor measurements. In Proc. 5th Intl. Conference MIXDES, Łódź, Poland, 18-20 June 1998, pp. 183-188.
• [A-7] Janicki M., Zubert M., Napieralski A.: Application of inverse heat conduction methods in temperature monitoring of integrated circuits. Sensors and Actuators: A Physical, vol. 71, pp. 51-57, 1998.
• [A-8] Janicki M., and Napieralski A.: 3D thermal simulation of hybrid circuits based on analytical solution of heat conduction equation. In Proc. of 5th Intl. Conference CADSM, Slavsko, Ukraine, 1-6 February 1999, pp. 11-12.
• [A-9] Janicki M., Napieralski A., Fedasyuk D., Petrov D.: Comparison of the thermal simulation results for the hybrid circuit test structure. In Proc. 6th Intl. Conference MIXDES, Kraków, Poland, 17-19 June 1999, pp. 301-303.
• [A-10] Janicki M., Napieralski A.: Considerations on accuracy of analytical thermal models of electronic circuits. In Proc. 6th Intl. Conference MIXDES, Kraków, Poland, 17-19 June 1999, pp. 305-308.
• [A-11] Wojciak W., Napieralski A., Zubert M., and Janicki M.: Thermal monitoring in integrated power electronics - new concept. In Proc. 7th European Conference EPE, September 8-10, 1997, Trondheim, Norway, vol. 3, pp. 269-271.
• [A-12] Janicki M., Napieralski A.: Integrated circuit temperature estimation using QR-RLS adaptive Algorithm. In Proc. 3rd Intl. Conference ECS, Bratislava, Slovakia, 6-8 September 1999, pp. 73-76.
• [A-13] Janicki M.: Thermal modelling of semiconductor structures with special consideration of inverse problem methods for parameter estimation. PhD Thesis, Politechnika Łódzka, Łódź, 1999.
• [A-14] Janicki M., Zubert M., and Napieralski A.: Application of inverse problem algorithms for integrated circuit temperature estimation. Microelectronics Journal, vol. 30, November 1999, pp. 1099-1107.
• [A-15] Janicki M., Napieralski A.: Temperature monitoring of electronic circuits based on analytical thermal model. In Proc. of 22nd Intl. Conf. MIEL, Nis, Yugoslavia, 14-17 May 2000, pp. 581-584.
• [A-16] Janicki M., Napieralski A., Fedasyuk D., and Petrov D.: Thermal modelling of hybrid circuits: simulation method comparison. Microelectronics Reliability, vol. 40, 2000, pp. 541-546.
• [A-17] Janicki M., Kawka P., De Mey G., and Napieralski A.: IGBT hybrid module thermal measurements and simulations. In Proc. of 8th Intl. Conference MIXDES, Zakopane, Poland, 21-23 June 2001, pp. 249-252.
• [A-18] Janicki M., Kawka P., Leon O., De Mey G., and Napieralski A.: Investigation of circuit forced convection air cooling in low speed wind tunnel. In Proc. 7th Intl. Workshop THERMINIC, 24-27 September 2001, Paris, France, pp. 79-82.
• [A-19] Janicki M., and Napieralski A.: Inverse heat conduction problems in electronic circuits. In Proc. of 9th Intl. Conf. MIXDES, 20-22 June 2002, Wrocław, Poland, pp. 385-388.
• [A-20] Janicki M., Napieralski A.: Analytical transient solution of heat equation with variable heat transfer coefficient. In Proc. of 8th Intl. Workshop THERMINIC, 1-4 October 2002, Madrid, Spain, pp. 235-240.
• [A-21] Janicki M., De Mey G., Napieralski A.: Application of Green's functions for analysis of transient thermal states in electronic circuits. Microelectronics Journal, Vol. 33, 2002, pp. 733-738.
• [A-22] Janicki M., De Mey G., Napieralski A.: Transient thermal analysis of multi-layered structures using Green's functions. Microelectronics Reliability, vol. 42 2002, pp. 1059-1064.
• [A-23] Janicki M., Napieralski A.: Transient thermal simulations of power integrated circuits using analytical solution of the heat equation. In Proc. of 10th European Conference EPE, 2-4 Sept. 2003, Toulouse, France, DS3.3-142.
• [A-24] Janicki M., Daniel M., Szermer M., and Napieralski A.: Ion sensitive field effect transistor modelling for multidomain simulation purposes. Microelectronics Journal, vol. 35, 2004, pp. 831-840.
• [A-25] Daniel M., Janicki M., Wroblewski W., Dybko A., Brzozka Z., Napieralski: Ion selective transistor modelling for behavioural simulations. Water Science and Technology, vol. 50, 2004, pp. 115-123.
• [A-26] Janicki M., De Mey G., Napieralski A.: Transient thermal simulation of a power hybrid module using an analytical solution of the heat equation. In Proc. 11th Intl. Workshop THERMINIC, 27-30 September 2005, Belgirate, Lake Maggiore, Italy, pp. 11-16.
• [A-27] Janicki M., Napieralski A.: Parametric thermal analyses of electronic circuits with Green's functions'. In Proc. of 13th Intl. Conference MIXDES, 22-24 June 2006, Gdynia, Poland, pp. 437-440.
• [A-28] Banaszczyk J., De Mey G., Janicki M., Napieralski A., Vermeersch B., and Kawka P.: Dynamic thermal analysis of a power amplifier. In Proc. of 12th Intl. Workshop THERMINIC, 27-29 September 2006, Nice, France, pp. 128-132.
• [A-29] Janicki M., De Mey G., Napieralski A.: Thermal analysis of layered electronic circuits with Green's functions. Microelectronics Journal, vol. 38, February 2007, pp. 177-184.
• [A-30] Kaminski M., Janicki M., and Napieralski A.: Application of RC equivalent networks to modelling of nonlinear thermal phenomena. In Proc. of 14th Intl. Conference MIXDES, 21-23 June 2007, Ciechocinek, Poland, pp. 357-362.
• [A-31] Banaszczyk J., Janicki M., Vermeersch B., De Mey G., and Napieralski A.: Application of advanced thermal analysis method for investigation of internal package structure. In Proc. of 14th Intl. Conference MIXDES, 21-23 June 2007, Ciechocinek, Poland, pp. 553-558.
• [A-32] Janicki M., Banaszczyk J., De Mey G., Kaminski M., Vermeersch B., Napieralski A.: Application of structure functions for investigation of forced air cooling. In Proc. of 13th Intl. Workshop THERMINIC, 17-19 September 2007, Budapest, Hungary, pp. 2-5.
• [A-33] Kamiński M., Janicki M., Napieralski A. Modelowanie nieliniowych zjawisk termicznych w układach elektronicznych z wykorzystaniem programu SPICE (Modelling of nonlinear thermal phenomena in electronic circuits with SPICE). Elektronika, Nr. 10, 2007, pp.7-12.
• [A-34] Janicki M., Pietrzak P., Vermeersch B., Banaszczyk J., Kaminski M., De Mey G., and Napieralski A.: Determining thermal simulation data from transient measurements. In Proc. 24th IEEE SEMI-THERM, March 16-20, 2008, San Jose, USA, pp. 200-204.
• [A-35] Janicki M., Napieralski A.: Real time temperature estimation of heat sources in integrated circuits with remote temperature sensors. Journal of Physics: Conf. Series, vol. 124, 2008, 012027, 11 pages.
• [A-36] Szermer M., Kulesza Z., Janicki M., Napieralski A.: Test ASIC for real time estimation of chip temperature. In Proc. of NSTI Nanotech 1-5 June, 2008 Boston, MA, USA, vol. 3, pp. 529-532.
• [A-37] Szermer M., Kulesza Z., Janicki M., Napieralski A.: Design of the test ASIC for on-line temperature monitoring and thermal structure analysis. In Proc. of 15th Intl. Conference MIXDES, 19-21 June 2008, Poznan, Poland, pp. 317-320.
• [A-38] Janicki M., Kindermann S., Napieralski A.: Investigation of circuit thermal models based on the transient thermal response spectra. In Proc. of 15th Intl. Conf. MIXDES, 19-21 June 2008, Poznan, Poland, pp. 337-342.
• [A-39] Janicki M., Banaszczyk J., De Mey G., Kaminski M., Vermeersch B., and Napieralski A.: Assessment of die attach quality by analysis of circuit thermal response spectrum. In Proc. 14th Intl. Workshop THERMINIC, 24-26 September 2008, Rome, Italy, pp. 43-46.
• [A-40] Janicki M., Kindermann S., Pietrzak P., Napieralski A.: Estimation of local temperature dependent heat transfer coefficient for thermal analysis of electronic circuits, Journal of Physics: Conf. Series, vol. 135, 2008, 012053, 8 pages.
• [A-41] Janicki M., Szermer M., Pietrzak P., Napieralski A.: Real time temperature monitoring of ICs with boundary temperature scan. In Proc. 25th IEEE SEMI-THERM, March 15-19, 2009, San Jose, USA, pp. 146-150.
• [A-42] Janicki M., Kulesza Z., Szermer M., and Napieralski A.: Digital filter implementation of function specification inverse algorithm. In Proc. of 16th Intl. Conference MIXDES, 25-27 June 2009, Lodz, Poland, pp. 347-350.
• [A-43] Janicki M., Szermer M., Klab S., Kulesza Z., Napieralski A.: Practical study of temperature distribution in a thermal test integrated circuit. In Proc. 15th Intl. Workshop THERMINIC, 7-9 October 2009, Leuven, Belgium, pp. 136-139.
• [A-44] Janicki M., Banaszczyk J., De Mey G., Kaminski M., Vermeersch B., Napieralski A.: Dynamic thermal modelling of a power integrated circuit with the application of structure functions. Microelectronics Journal, vol. 40, 2009, pp. 1135-1149.
• [A-45] Kindermann S., and Janicki M.: The heat transform and its use in thermal identification problems for electronic circuits. Electronic Transactions Numerical Analysis, vol. 35, 2009, pp. 164-184.
• [A-46] Janicki M., and Kindermann S.: Recovering temperature dependence of heat transfer coefficient in electronic circuits. Inverse Problems Science Engineering, vol. 17, 2009, pp. 1129-1142.
• [A-47] Janicki M., Collet J., Louri A., Napieralski A.: Hot spots and core-to-core thermal coupling in future multicore architectures. In Proc. 26th IEEE SEMI-THERM, February 21-25, 2010, Santa Clara, USA, pp. 205-210.
• [A-48] Szermer M., Janicki M., Pietrzak P., Kulesza Z., Napieralski A.: PTAT sensor for chip overheat protection. In Proc. 26th IEEE SEMI-THERM, February 21-25, 2010, Santa Clara, USA, pp. 176-179.
• [A-49] Janicki M., Kulesza Z., Pietrzak P., and Napieralski A.: Multichannel system for real time registration of electronic circuit temperature response. In Proc. of 17th Intl. Conference MIXDES, 24-26 June 2010, Wroclaw, Poland, pp. 357-360.
• [A-50] Janicki M., Kulesza Z., Napieralski A.: Distributed network of remote sensors for real time prediction of hot spot temperature values. In Proc. of 9th Conference IEEE Sensors, November 1-4, 2010, pp. 656-659.
• [A-51] Janicki M., Kulesza Z., Pietrzak P., and Napieralski A.: Multichannel readout system for registration of electronic system temperature response with high temporal resolution. International Journal Microelectronics & Computer Science, vol. 1, 2010, pp. 305-310.
• [A-52] Janicki M., Kulesza Z., Torzewicz T., and Napieralski A.: Automated stand for thermal characterization of electronic package. In Proc. 27th IEEE SEMI-THERM, March 21-24, 2011, San Jose, USA.
• [A-53] Janicki M., Zubert M., Napieralski A.: Generation of reduced thermal models of electronic systems from transient thermal response. Proc. 12th Intl. Conference EuroSimE, 18-20 April 2011, Linz, Austria, DOI: 10.1109/ESIME.2011.5765808.
• [A-54] Janicki J., Kulesza Z., Napieralski A.: Accelerated detection of rapid heat flux changes in real time remote prediction of heat source temperature. In Proc. 7th Intl. Conference ICIPE, Orlando, USA, 4-6 May 2011, pp. 126-131.
• [A-55] Janicki M., Banaszczyk J., Vermeersch B., De Mey G., and Napieralski A.: Generation of reduced thermal models of electronic systems from time constant spectra of transient temperature responses. Microelectronics Reliability, vol. 51, 2011, pp. 1351-1355.
• [A-56] Janicki M., Kulesza Z., Torzewicz T., Napieralski A.: Active control of circuit cooling conditions for transient thermal measurement purposes. In Proc. 17th Intl. Workshop THERMINIC, 27-29 September 2011, Paris, France, pp. 215-218.
• Other publications
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