The aberrations of the AC thermal characteristics in the presence of solder defects in mltilayer microelectronic structures

• Autorzy: Gnidzińska K.
• Języki publikacji: EN

Abstrakty

EN

In this paper, the multilayer microelectronic structures have been modeled using AC thermal modeling approach. The influence of defects in solder layers on the thermal parameters of the structures has been investigated. It has been presented how an aberration in a solder layer that may result e.g. from the manufacturing flaw, can significantly affect the thermal characteristics of the structure thus aggravating the conditions of the heat transfer. The phenomena have been described in the qualitative and quantitative way. Furthermore, the applicability of the proposed modeling method for the purpose of determining the optimal frequency range in non-destructive device testing technique - lock-in thermography - has been demonstrated.

Słowa kluczowe

EN

AC thermal modeling; nondestructive testing; thermal impedance; heat transfer

PL

modelowanie termiczne prądu przemiennego; badania nieniszczące; opór cieplny; wymiana ciepła

• Wydawca: Lodz University of Technology. Department of Microelectronics and Computer Science
• Czasopismo: International Journal of Microelectronics and Computer Science
• Rocznik: 2011
• Tom: Vol. 2, nr 4
• Strony: 156--159
• Opis fizyczny: Bibliogr. 7 poz.

Twórcy

autor

Gnidzińska K.

• Department of Microelectronics and Computer Science, Technical University of Lodz, ul. Wolczanska 221/223, 90-924 Lodz,

Bibliografia

• [1] Vermeersch Bjorn, De Mey Gilbert: Thermal impedance plots of micro-scaled devices. Microelectronics Reliability 46 (2006) 174-177
• [2] Gralewicz Grzegorz, Owczarek Grzegorz, Więcek Bogustaw: Investigatilons of Single and Multilayer Structures Using Lock-In Thermography - Possible Applications, International Journal of Occupational Safety and Ergonomics (JOSE) 2005, Vol. 11, No. 2, 211 -215
• [3] Kawka Piotr, De Mey Gilbert, Vermeersch Bjorn: Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance, Components and Packaging Technologies, IEEE Transactions on , vol 30, no 4, pp.660-665, Dec. 2007
• [4] W. Bai and B. S. Wong, Evaluation of defects in composite plates under convcclivc environments using lock-in thermography, Meas. Sci. Technol. 12 (2001) 142-150
• [5] Homy N. and Lannoy B : Lock-in thermography with a focal plane array, INSTITUTE OF PHYSICS PUBLISHING MEASUREMENT SCIENCE AND TECHNOLOGY 14 (2003) 439-443
• [6] Yunus Cengel: Heat and Mass Transfer: A Practical Approach, ISBN: 9780077366643
• [7] Więcek Bogustaw, De Mey Gilbert: Termowizja w podczerwieni, Podstawy i zastosowania, ISBN: 978-83-926319-7-2