Multichannel readout system for registration of electronic system temperature response with high temporal resolution

• Autorzy: Janicki M. , Kulesza Z. , Pietrzak P. , Napieralski A.
• Języki publikacji: EN

Abstrakty

EN

This paper presents the design and the practical realization of a measurement system dedicated to fast real-time multichannel registration of electronic system thermal response. The response is registered in parallel channels with a frequency up to 1 MHz- Such a high frequency is required for the thermal identification of electronic systems. The designed circuit is used here for the investigation of a thermal test ASIC. The presented solution can be extended for a different number of measurement channels and adapted for other types of sensors.

Słowa kluczowe

EN

thermal characterization of electronic systems; real time parallel measurement data processing

PL

termiczna charakterystyka systemów elektronicznych; rzeczywisty czas równoległych pomiarów przetwarzania danych

• Wydawca: Lodz University of Technology. Department of Microelectronics and Computer Science
• Czasopismo: International Journal of Microelectronics and Computer Science
• Rocznik: 2010
• Tom: Vol. 1, nr 3
• Strony: 305--310
• Opis fizyczny: Bibliogr. 4 poz.

Twórcy

autor

Janicki M.

autor

Kulesza Z.

autor

Pietrzak P.

autor

Napieralski A.

• Dept. of Microelectronics and Computer Science, Technical University of Lodz, Wólczańska 221/223, 90-924 Łódź, Poland,

Bibliografia

• [1] Z. Benedek, B. Courtois, G. Farkas, E Kollár, A. Poppe, M, Rencz, V Székely, and K. Torki, "A scalable multi-functional thermal test chip family: Design and evaluation," ASME J. Electron. Packag., vol. 123, pp 323-330, Dec. 2001.
• [2] M. Szermer, Z. Kulesza, M. Janicki, and A. Napieralski, "Test ASIC for real time estimation of chip temperature," in Proc. 10th NST1 Nanotechnology Conf. Nanotech, Boston, USA, 2008, vol. 3, pp. 529-532.
• [3] M. Szermer, Z. Kulesza, M. Janicki, and A. Napieralski, "Design of the test ASIC for on-line temperature monitoring and thermal structure analysis," in Proc. 15th Conf. Mixed Design of Integrated Circuits and Systems MIXDES, Poznan, Poland, 2008, pp. 317-320.
• [4] M. Janicki, M. Szermer, S. Klab, Z. Kulesza, A. Napieralski, "Practical study of temperature distribution in a thermal test integrated circuit," in Proc. 15th Workshop on Thermal Investigations of ICs and Systems THERMINIC, Leuven, Belgium, 2009, pp. 136-139.