Laserowa modyfikacja właściwości materiałów przewodzących

• Autorzy: Pawlak R.

Warianty tytułu

EN

Laser modification of properties of conducting materials

• Języki publikacji: PL

Abstrakty

PL

W pracy przedstawiono zagadnienie modyfikacji właściwości materiałów przewodzących, ze szczególnym uwzględnieniem konduktywności stałoprądowej, przy wykorzystaniu technologii laserowych, w których oddziarywanie promieniowania z powierzchnią ciała stałego ma charakter termiczny. Zaprezentowano zakres zastosowań laserowych technologii w elektronice i elektrotechnice, w tym problemy wytwarzania elementów przewodzących w laserowych procesach zapisu bezpośredniego. Poddano analizie laserowe procesy modyfikacji właściwości materiałów zachodzące ze zmianą stanu skupienia oraz z wprowadzaniem obcych domieszek. Omówiono zespół najważniejszych zjawisk, towarzyszących oddziaływaniu zogniskowanej wiązki laserowej z ciałami stałymi, charakterystycznych dla tych procesów technologicznych. W poszczególnych przypadkach rozpatrywano możliwość zastosowania laserowych systemów impulsowych lub wykorzystujących wiązkę ciągłą. Dla rozważanych procesów technologicznych określono możliwy zakres modyfikacji konduktywności oraz innych wybranych parametrów materiałów przewodzących, a także zespół niezbędnych parametrów technologicznych. Wiele uwagi poświęcono bardzo efektywnym dla modyfikacji właściwości procesom domieszkowania laserowego, w tym opracowanym przez autora metodom wytwarzania elementów warstwowych o dużej rezystywności oraz mikroobszarów rezystywnych. Wykazano, że ekstremalne skutki oddziaływania koherentnej i monochromatycznej wiązki promieniowania laserowego, w szczególności bardzo duże prędkości nagrzewania, chłodzenia oraz krystalizacji, a także występujący w niektórych procesach dynamiczny ruch masy, mają decydujący wpływ na przebieg i efekty laserowych procesów technologicznych. W zastosowaniu do materiałów przewodzących pozwalają one modyfikować w szerokim zakresie konduktywność oraz inne właściwości istotne dla zastosowań. Przedyskutowano także zmiany konduktywności materiałów przewodzących w laserowych procesach łączenia, ze szczególnym uwzględnieniem mikropołączeń spawanych i lutowanych. Zaprezentowano metodę wyodrębnienia strukturalnego składnika rezystancji połączeń spawanych, wykorzystującą obraz pola elektrycznego w połączeniu modelowym. Wykazano korzystny wpływ lutowania laserowego na zmniejszenie rezystancji połączeń, w wyniku ograniczenia wzrostu wysokorezystywnych związków międzymetalicznych. Analizę wszystkich zagadnień, dotyczących modyfikacji właściwości materiałów przewodzących w laserowych procesach termicznych, potwierdzono wynikami doświadczalnych prac autora. Obejmowały one badania zjawisk, występujących w tych procesach oraz badania właściwości strukturalnych materiałów poddanych laserowej modyfikacji, z wykorzystaniem metod mikroskopii elektronowej, mikroanalizy rentgenowskiej, a także termografii. Zaprezentowano i poddano analizie badania stałoprądowej konduktywności elektrycznej modyfikowanych materiałów przewodzących w zakresie temperatur 77-400K. W poszczególnych przypadkach podano prognozę zastosowania modyfikowanych materiałów.

EN

In the work, the modification of properties of conducting materials by means of laser technologies, in which the interaction with the surface of a solid is of thermal character, with a focus on direct-current conductivity, has been discussed. A range of applications of laser technologies in electronics and electrical engineering, including problems of production of conducting elements in direct writing laser processes, have been presented. Laser processes of modification of material properties occurring along with the change of state and the introduction of foreign elements have been analyzed. The most important phenomena accompanying the interaction of a focused laser beam with solids have been discussed. In individual cases, the possibility to use pulsed laser and continuous laser systems has been considered. For the technological processes under consideration, a possible range of modification of conductivity and other selected parameters of conducting materials, as well as a set of necessary technological parameters have been determined. Much attention has been paid to laser alloying processes, very effective for the modification of properties, including the author's own methods of producing layer elements of a high resistivity and resistive micro-areas. It has been demonstrated that extreme effects of the interaction of a coherent and monochromatic laser radiation beam, and in particular high rates of heating, cooling and crystallization, as well as the dynamic motion of mass occurring in some processes, have a decisive influence on the course and effects of laser technological processes. When used for conducting materials, they allow conductivity and other properties essential for applications to be modified over a wide range. In addition, changes in the conductivity of conducting materials in laser processes of joining, with a special focus on welded and soldered micro-joints have been discussed. A method for separating a structural component of resistance of welded joints, making use of an image of an electric field in a model joint has been presented. A beneficial effect of laser soldering on the decrease in the resistance of joints as a result of limiting the growth in high-resistance intermetallics has been shown. The problems presented have been illustrated with the results of the author's own experimental work on laser modification of conducting materials, structural studies and studies on the properties of the materials modified, with a focus on electrical conductivity. In individual cases, prognoses for the application of modified materials have been given.

Słowa kluczowe

PL

materiały przewodzące; laserowa modyfikacja

EN

conducting materials; laser modification

• Wydawca: Wydawnictwo Politechniki Łódzkiej
• Czasopismo: Zeszyty Naukowe. Rozprawy Naukowe / Politechnika Łódzka
• Rocznik: 2002
• Tom: Z. 305
• Strony: 3--218
• Opis fizyczny: Bibliogr. 493 poz.

Twórcy

autor

Pawlak R.

• Zakład Inżynierii Materiałowej i Systemów Pomiarowych. Instytut Systemów Inżynierii Elektrycznej Politechniki Łódzkiej

Bibliografia

• [1] Ahlers R.J, Hoffmann P., Lindl H., Rothe R. (editors): Laser Materials Processing and Machining, SPIE Proceedings vol. 2246, Bellingham, 1994
• [2] Ahlers R.-J. (ed.): Rapid Prototyping, SPIE Proceedings Vol. 2787, Bellingham, 1996
• [3] Albrecht G.F., Beach R.J., (ed.): Diode Pumping of Average-Power Solid State Lasers, SPIE Proc. vol. 1865 , Bellingham, 1993
• [4] Albright C. (ed.): Laser welding, machining, and materials processing: proceedings of the International Congres on Applications of Lasers and Electro-optics, ICALEO'85, Springer Verlag, 1986
• [5] Anisimow S.I., Imas J.A., Romanow G.S., Chodykow J.W.: Diejstwie izhiczenija bolszoj moszcznosti na mietałły, Nauka, Moskwa, 1970
• [6] Appleton В.R., Celler G.K. (ed.): Laser and Electron-Beam Solid Interactions with Solids. Elsevier North Holland, New York, 1982
• [7] Banas C.M., Whitney G.L. (ed.): The changing frontiers of laser materials processing: proceedings of the 5th International Congress on Applications of Lasers and Electro-optics, ICALEO'86, Springer Verlag, 1987
• [8] Bertolotti M. (ed.): Physical Processes in Laser-Materials Interactions, Proc. of NATO ASI Series В 84, Plenum Publishing Corporation, 1983
• [9] Beyer E., Cantello M., La Rocca A.V., Laude L.D., Olsen F.O., Sepold G. (ed.): Laser Materials Processing: Industrial and Microelectronics, SPIE Proc. Vol. 2207, Bellingham 1994
• [10] Billon J. P., Fabre E.(ed.): Industrial and Scientific Uses of.High-Power Lasers, SPIE Proc. vol.1502, Bellingham, 1991
• [11] Blatt F.: Fizyka zjawisk elektronowych w metalach i półprzewodnikach, PWN W-wa, 1973
• [12] Boyd I.W. (ed.): Laser Processing and Characterization, North Holland, 1992
• [13] Boyd I.W. (ed.): Laser-Assisted Fabrication of Thin Films and Microstructures, SPIE Proc. vol. 2045, Bellingham, 1994
• [14] Braren B. (ed.): Lasers in Microelectronic Manufacturing, SPIE Proc. vol. 1598, Bellingham, 1991
• [15] Braren B., Dubowski J.J., Norton D. (ed.): Laser Ablation in Materials Processing: Fundamentals and Applications, MRS Symp. Proc. vol. 285, MRS, Pittsburg, 1993
• [16] Bruck G. (ed.): Laser materials processing: proceedings of the 7th International Congress on Applications of Lasers and Electrooptics, ICALEO'88, Springer Verlag, 1989
• [17] Brunner T.A., (ed.): Optical/Laser Microlithography VIII, SPIE Proceedings vol. 2440, Bellingham, 1995
• [18] Burakowski T., Wierzchoń T.: Inżynieria warstwy wierzchniej metali, WNT W-wa, 1995
• [19] Curry R.D., (ed.): Novel Applications of Lasers and Pulsed Power, SPIE Proc. Vol. 2374, Bellingham, 1995
• [20] Denney P., Miyamoto I., Mordike B. L. (ed.): ICALEO'93: Laser Materials Processing SPIE Proceedings vol. 2306, Bellingham, 1994
• [21] Dieleman J., Biermann U.K.P., Hess P. (ed.): Photon-Assisted Processing of Surfaces and Thin Films, North-Holland, 1995
• [22] Domański R.: Promieniowanie laserowe - oddziaływanie na ciało stale, WNT W-wa, 1990
• [23] Draper C.W, Mazzoldi P. (ed.): Laser Surface Treatment of Metals, Proc. of NATO ASI Series E 115, Nijhoff Publishers, 1986
• [24] Dubowski Jan J. (ed.): Laser-Induced Thin-Film Processing, SP1E Proceedings vol. 2403, Bellingham, 1995
• [25] Dubowski Jan J., Dyer P.E. (ed.): Laser Applications in Microelectronic and Optoelectronic Manufacturing III, SPIE Proceedings vol. 3274, Bellingham, 1998
• [26] Dubowski Jan J., Helvajian H., Kreutz E. W., Sugioka K. (ed.): Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, SPIE Proceedings vol. 3618, Bellingham, 1999
• [27] Dyos G.T., Farrel T.: Electrical resistivity handbook, Peter Peregrinus Ltd., London 1992
• [28] Farson D., Steen W., Miyamoto I. (ed.): ICALEO'92: Laser materials processing, SPIE Proceedings vol. 1990, Bellingham, 1993
• [29] Ferris S.D., Leamy H.J.,Poate J.M. (ed.): Laser-Solid Interaction and Laser processing - 1978, American Institute of Physics, New York, 1979
• [30] Fogarassy E., Geohegan D., Stuke M. (ed.): Laser Ablation, North Holland, 1996
• [31] Fogarassy E., Lazare S. (ed.): Laser Ablation of Electronic Materials, North Holland, 1992
• [32] Fotakis C., Kalpouzos C., Papazoglou T.G., (ed.): 9th International Symposium on Gas Flow and Chemical Lasers, SPIE Proceedings vol. 1810 , Bellingham, 1993
• [33] Fuller G.E. (editor): Optical Microlitography IX, Proceedings SPIE, Bellingham, vol.2726, 1995
• [34] Gasser A.: Oberflachenbehandlung metallischer Werkstoffe mit C 02 - Laserstrahlung in der fliissigen Phase, RWTH Aachen, 1993 (Dissertation)
• [35] Gibbons J.F., Hess L.D., Sigmon T.W. (editors): Laser and Electron Beam Solid Interactions and Materials Processing, North-Holland, New York - Oxford, 1981
• [36] Grabski M.W.: Istota inżynierii materiałowej, Oficyna Wyd. Polit. Warszawskiej, 1995
• [37] Greer J.A., (ed.): Excimer Lasers: Applications, Beam Delivery Systems, and Laser Design, SPIE Proceedings vol. 1835, Bellingham, 1993
• [38] Grigorianc A.G.: Osnowy łaziemoj obrabotki materialov, Maszinostrojenie, Moskwa 1989
• [39] Kaczmarek F.: Wstęp do fizyki laserów, PWN Warszawa, 1986
• [40] Kochner W„ : Solid State Laser Engineering, Springer Verlag, 1976
• [41] Kossowsky R., Jelinek M., Walter R.F. (ed.): High Power Lasers - Science and Engineering, Proc. of NATO ASI Series 3-7, Kluwer Academie Publishers, 1996
• [42] Kostorz G., Gorynin I., Trefilov V., Kunze H.-D., Gtinter B., Skorokhod B., Troitsky V. (ed.): Materials under extreme conditions and nanophase materials, North - Holland, Amsterdam-London-New York-Tokyo, 1993
• [43] Kostrubiec F.: Nagrzewanie laserowe metalu w procesie wytwarzania elektrycznych połączeń stałych, Zeszyty Naukowe Politechniki Łódzkiej, seria „Rozprawy Naukowe”, nr 47, 1982 (praca habilitacyjna)
• [44] Kusiński J.: Zmiany struktury i własności mechanicznych stali pod wpływem obróbki laserowej, Z. Nauk. AGH, Metalurgia i Odlewnictwo, z. 132, 1989 (praca habilitacyjna)
• [45] Kurz W., Fischer D.J.: Fundamentals of solidification, Trans. Techn. Publications, Switzerland, 1989
• [46] Laude L.D. (ed.): Excimer Lasers, Proc. of NATO ASI Series E 265, Kluwer Acad. Publishers, 1994
• [47] Letardi T., Laude L.D. (ed.): Excimer Lasers and Applications III, SPIE Proc. vol. 1503, 1991
• [48] Linden K.J. (ed): Laser Diode and LED Applications III, SPIE Proc. vol. 3000, Bellingham, 1997
• [49] Linden K.J., Akkapeddi P.R. (ed.): Laser Diodes and Applications II, SPIE Proceedings vol. 2682, Bellingham, 1996
• [50] Little C.E., Sabotinov N.V. (ed.): Pulsed Metal Vapour Lasers, Proc. of NATO ARW Series 1-5, Kluwer Academic Publishers, 1996
• [51] Mak A.A., (ed.): Laser Applications, SPIE Proceedings vol. 2097, Bellingham, 1994
• [52] Massalski T.B. (ed.): Binary alloy phase diagrams, ASM, 1987
• [53] Mazumder J., Conde O., Villar R., Steen W. (ed.): Laser Processing: Surface Treatment and Film Deposition, Proc. of NATO ASI Series E 307, Kluwer Academic Publishers, 1996, Plenum Press, New York, 1965
• [54] Mazzoldi P. (ed.): Modifications Induced by Irradiation in Glasses, North Holland, 1992
• [55] McCay T.D., Matsunawa A., Huegel H. (ed.): ICALEO '94: Laser Materials Processing , SPIE Proc. vol. 2500, Bellingham, 1995
• [56] Meaden G.T.: Electrical resistance of metals Solid State, Gas, Excimer, and Other Advanced Lasers, SPIE Proc. vol. 2889, Bellingham, 1996
• [57] Mei S.S.(ed.): High-Power Lasers: Solid State, Gas, Excimer, and Other Advanced Lasers, SPIE Proceedings Vol. 2889, Bellingham, 1996
• [58] Metzbower E.A., Beyer E., Matsunawa A. (ed.): ICALEO'91: Laser materials processing, SPIE Proc. vol. 1722, Bellingham, 1992
• [59] Migliore L.R., Walker R.W. (ed.): Lasers as Tools for Manufacturing, SPIE Proc. vol. 2062, Bellingham, 1994
• [60] Migliore R.L., Roychoudhuri Ch.S., Schaeffer R.D., Mazumder J., Dubowski Jan J., (ed.): Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, SPIE Proc. vol. 2703, Bellingham, 1996
• [61] Mirkin Ł.J.: Fiziczeskije osnowy obrabotki materiałów tuczami laziera, Izdatielstwo Moskowskowo Universiteta, 1975
• [62] Misaelides P. (ed.): Application of Particle and Laser Beams in Materials Technology, Proc. of NATO ASI Series E 283, Kluwer Academic Publishers, 1995
• [63] More R.M. (ed.): Laser Interactions with Atoms, Solids, and Plasmas, Proc. of ASI NATO Series В 327, Plenum Publishing Corporation, 1994
• [64] Morton L., El-Kareh A.B. (ed.): Electron Beam and Laser Beam Technology (Advances in Electronics and Electron Physics), Academic Press, New York, 1968
• [65] Nastasi M., Harriott L.R., Herbots N., Averback R.S.(ed.): Beam-Solid Interactions: Fundamentals and Applications, MRS Symp. Proc. vol. 279, MRS, Pittsburg, 1993
• [66] Nissim Y.I., Katz A., Rubloff G.W. (ed.): Integrated Processing for Micro-and Optoelectronics, North-Holland, 1994
• [67] Nowicki M.: Lasery w technologii elektronowej, WNT Warszawa, 1978
• [68] Osborne M.R., Sayegh G. (ed.): High-Power Lasers: Applications and Emerging Applications, SPIE Proc. vol. 2789, Bellingham, 1996
• [69] Paja A.: Przewodnictwo elektryczne stopów amorficznych, Zeszyty Naukowe AGH, seria Fizyka, nr 25, 1991 (praca habilitacyjna).
• [70] Panchenko V.Y., Golubev (ed.): Fifth International Conference on Industrial Lasers and Laser Applications ’95, SPIE Proc. vol. 2713, Bellingham, 1996
• [71] Pauleau Y. (ed.): Materials and Processes for Surface and Interface Engineering, Proc. of NATO ASI Series E 290, Kluwer Academic Publishers, 1995
• [72] Pauleau Y.M., В ата P.B. (ed.): Protective Coatings and Thin Films: Synthesis, Characterization and Applications, Proc. of NATO ARW Series 3-21, Kluwer Academic Publishers, 1996
• [73] Poate J.M., Mayer J.W. (ed.): Laser Annealing of Semiconductors, Acad. Press, New York, 1982
• [74] Prokhorov A.M., Pustovoy V.I. (ed.): Laser Methods of Surface Treatment and Modification SPIE Proc. vol. 2498, Bellingham, 1995
• [75] Prokhorov A.M., Konov V.I., Ursu I., Mihailescu I.N.: Laser heating of metals, Wyd. Adam Hilger, Bristol, Philadelphia, New York, 1991
• [76] Przybyłowicz К.: Podstawy teoretyczne metaloznawstwa, WNT, Warszawa, 1999
• [77] Quarles G.J., Woodall M.A., (ed.): Solid State Lasers IV, SPIE Proc. vol. 1864, Bellingham, 1993
• [78] Ready J.F.: Effect of high -power laser radiation, Acad. Press, New York-London, 1971
• [79] Ready J.F.: Industrial Aplications of Lasers, 2nd ed., Academic Press, New York-London, 1997
• [80] Ream S.L., Dausinger F., Fujioka T. (ed.): ICALEO'90: laser materials processing, SPIE Proc. vol. 1601, Bellingham, 1991
• [81] Renner D., (ed.): Laser Diode Technology and Applications, SPIE Proc. vol. 1850, 1993
• [82] Rossiter P.L.: The electrical resistivity of metals and alloys, Cambridge University Press, (1987)
• [83] Rykalin N.N., Ugłow A.A., Kokora A.N.: Łaziemaja obrabotka materiałów, Maszinostrojenie, Moskwa 1975
• [84] Safranek W.H.: The properties of electrodeposited metals and alloys, Am. Electropl. Finish. Soc., Orlando, 1986
• [85] Schroeder K.: CRC handbook of electrical resistivities of binary metallic alloys, CRC Press, Boca Raton, 1983
• [86] Smith, J. H., Karam, J.-M. (ed): Micromachining and Microfabrication Process Technology V, SPIE Proc. vol. 3874, Bellingham, 1999
• [87] Steen W.: Laser materials processing, Springer Verlag, 1996
• [88] Stelmach M.F.: Laziery w tiechnołogii, Energia, Moskwa, 1975
• [89] Średniawa В.: Mechanika kwantowa, PWN W-wa, 1972
• [90] Waseda Y.: The Structure of Non-Crystaline Materials: Liquids and Amorphous Solids, Me Graw-Hill, 1980
• [91] White C.W., Peercy P.S. (ed.): Laser and Electron Beam Processing of Materials, Akademie Press, New York - London, 1980
• [92] Wiejko W. P.: Łaziemaja obrabotka plenocznych elementów, Maszinostrojenie, Leningrad, 1986
• [93] Witteman W.J., Ochkin V.N. (ed.): Gas Lasers - Recent Developments and Future Prospects, Proc. of NATO ARW Series 3-10, Kluwer Academic Publishers, 1996
• [94] Zallen R.: Fizyka ciał amorficznych, PWN, W-wa,1994
• [95] Ziman J.M.: Principles of Theory of Solids, Cambridge University, Cambridge, 1972
• [96] Żyborski J., Lipski T., Czucha J.: Zabezpieczenia diod i tyrystorów, WNT, 1985
• [97] Abboud J.H., West D.R.F.: Microstructure of titanium injected with SiC particles by laser processing, J.of Mater. Sci.Lett., vol.10, 1991, pp.1149-1152
• [98] Abboud J.H., West D.R.F.: Processing aspects of laser surface alloying of titanium with aluminium, Mater.Sci.Technol. vol.7 (4), 1991, pp.353-356
• [99] Abdullah H.A., Chatwin C.R., Kapadia P.D.: Magnetisation anomalies in laser welded magnetic materials, Proc of ICALEO'95, Laser Institut of America, 1995, pp.932-941
• [100] Adachi A., Murakami K., Hirota J., Hoshinouchi S.: Fluxless soldering with laser for assembly of TCP, Proc. ICALEO '95, vol.80, Laser Institute of America, 1995, pp.35-41
• [101] Afonso C.N., Serna R., Ballesteros J.M., Petford-Long A.K., Doole R.C.: Synthesis by pulsed laser deposition of metallic nanoclaster embedded on an amorphous host, Applied Surface Science vol,127-129,(l-4), 1998,pp.339-343
• [102] Alavi M., Lorenz M., Buttgenbach S.: Microstructure and composition of laser soldered joints: investigation of intermetallic layers by high sensitive surface analyses, Interconnection Technology in Electronics, DVS-Berichte, B.129, DVS-Verlag GmbH, Düsseldorf, 1990, pp.232-234
• [103] Alk B., Batting R., Anthamatren O.: “Laser welding for fiber pigtailing with long-term stability and submicron accuracy”, Opt. Eng., vol. 34, No. 9, 1995, pp. 2675-2682
• [104] Almeida A., Vilar R.: Laser alloying: a tool to produce improved Al-Mo surface alloys, Proc.of ICALEO’96 (Sec.A), Laser Institute of America, 1996, pp.123-132
• [105] Amamou A., Gautier F., Loegel B.: Transport properties, giant moments and nearly magnetic impurities in some nickel alloys near the magnetic transition, J.Phys. F: Metal Phys., Vol.5, July 1975, pp.1342-1358
• [106] Andrews P.V., West M.B., Robeson C.R.: The effect of grain boundaries on the electrical resistivity of polycrystaline copper and aluminium, Phil. Mag., vol. 19, 1969, pp. 887-898
• [107] Aniščenko L.M., Gusev I.T., Čiżov W.N.: Zavisimost koefficenta teploprovodnosti i udelnovo elektrosoprotivlenia poristovo molibdena ot temperatury, Fizika i Chimija Obrabotki Materialov, 6,1970, 120-125
• [108] Antoni F., Fogarassy E., Fuchs C., Prévôt B., Stoquert J.P.: Sii_xGex thin films deposited by the pulsed excimer laser ablation technique, Applied Surface Science vol.86,(1-4) 1995, pp.175-179
• [109] Arutjunian P.W., Baranov W.Yu., Bolshov L.A., Vitiukov W.W., Evstratov E.W., Kiselev W.N. Kovalevic A.M., Podolski B.S., Stepanov Yu.Yu.: Perenos legirujuscevo elementa w rasplavie pri obluceni metalov Nd-lazierom w gazowych sredach, Poverchnost. Fiz.,chim. mech., N o5,1988, pp.129-136
• [110] Astafieva L.G., Prishivalko A.P., Leiko S.T.: Nagrev metalliceskich czastic laziemym izluceniem, Fizika i Chimia Obrab. Mat., Nr.2,1991, pp.64-69
• [111] Auerbach A.: Cooper conductors by reduction of cooper (I) complex in host polymer, Appl. Phys. Lett. 47,7, (1985), pp. 669-671
• [112] Auerbach A.: On depositing conductors from solution with a laser, J.Electrochem.Soc., vol.132, (1985), pp. 130-132
• [113] Azdasht G., Zakel E., Reichl H.: Implementation of low power diode laser for soldering by FPC (Fibre Push Connection) method, Soldering & Surface Mount Technology, vol. 8 (22), 1996, pp.51-54
• [114] Aus M.J., Szpunar B., Erb U., El-Sherik A.M., Palumbo G., Aust K.T.: Electrical resistivity of bulk nanocrystaline nickel, J. Appl. Phys., vol. 75, no.7,1994, pp.3632-3634
• [115] Backes G., Gasser A., Kreutz E.W., Ollier B., Rozsnoki M., Wissenbach К.: Surface melting of AlSilOMg with CO2 laser radiation, Proc. of SPIE vol.1276, 1990, pp.402-410
• [116] Bali K., Szorenyi T., Brook M.R., Shafeev G.A.: High speed laser writing of gold lines from organic solutions, Appl. Surf.Sci. 69 (1993), pp. 75-78
• [117] Bamberger M., Kaplan W.D., Medres B., Shepeleva L.: Calculation of process parameters for laser alloying and cladding, J.of Laser Appl., Laser Institute of America, vol.lO(l), 1998, pp.29-33
• [118] Baranov M.S., Kondratiev W.A., Uglov A.A.: Kinetika obrazovanija sojedinienia provoloki pri svarkie łucom impulsnovo łaziera, Fiz. i Chim. Obr. Mater., nr 5, 1972, str.11-14
• [119] Basiński Z.S., Dugdale J.S., Howie A.: The electrical resistivity of dislocations, Phil. Mag., 8, 1963, pp. 1989-1997
• [120] Baum T. H., Comita P.B., Kodas T.T.: Laser-induced deposition for thin-film circuit repair, SPIE Proceedings Vol. 1598, Bellingham, 1991, pp. 122-131
• [121] Becker G.: Mass soldering, Soldering & Surface Mount Technology, vol. 8 (3), 1996, pp.1-13; vol. 9 (2), 1997, pp.23-30
• [122] Becker R., Sepold G.: Nachbehandlung von Spritzschichten durch Hochleistungslaser, Metalloberfiache, vol.41(7), 1987, pp.329-332
• [123] Bergmann H.W., Bartl N., Mayerhofer R.: Micromachining with copper vapor lasers, Proc. SPIE vol. 2789, 1996, pp.333-344
• [124] Bergmann H.W., Schubert E., Schmajtko K.J., Dembowski J.: Modification of surface films on metalic substrates by excimer laser radiation, Thin Solid Films, 174 (1989), pp.33-38
• [125] Bernier M.-H., Izquierdo R., Meunier M.: Laser processing of palladium for selective cooper plating, SPIE Proceedings Vol. 2045, Bellingham, 1994, pp.330-337
• [126] Bernstein J. B., Zhang W., and Nicholas С. H.: Laser Formed Metallic Connections, IEEE Trans. Comp. Pkg. Manufact. Technol., vol.21, No.2, 1998, pp. 194-198
• [127] Bernstein J.B., Colella B.D.: Laser-formed metallic connections employing a lateral link structure, IEEE Trans. Comp. Pkg. Manufact. Technol., vol.18, No.3, 1995, pp. 690-692
• [128] Bloomstein T.H., Horn M.W., Rothschild M., Kunz R.R., Palmacci S.T., Goodman R.B.: Lithography with 157nm lasers, J.of Vacuum Sci.&Technology B: Microelectronics and Nanometer Structures, vol.15, (6) 1997, pp. 2112-2116
• [129] Bloomstein T.H., Rothschild M., Kunz R.R., Hardy D.E., Goodman R.B., Palmacci S.T.: Critical issues in 157 nm lithography, J.of Vacuum Sci.&TechnologyB: Microelectronics and Nanometer Structures, vol. 16, (6) 1998, pp. 3154-3157
• [130] Bloomstein T.M., Ehrlich D.J.: Laser-chemical three-dimensional writing for microelectromechanics and application to standard-cell microfluiddics, J. of Vacuum Sci.&Technology B: Microelectronics and Nanometer Structures, vol. 10, (6) 1992, pp. 2671-2674
• [131] Bocvar N.R., Lygsova E.W., Popov W.I., Sasov A.M.: Polucenije rezistivnych plenocnych materialov na osnovie miedi, Fizika i chimija obrabotki materialov, nr 3, 1984, 87-89
• [132] Bohandy J., Kim B.F., Adrian F.J., Jette A.N.: Metal deposition at 532 nm using a laser transfer technique, J.Appl. Phys., vol.63, (4), 1988, pp. 1158-1162
• [133] Boher P., Stehle J.L., Piel J.P, Fogarassy E.: Fabrication of SiGe and SiGeC epitaxial layers by ion implantation and excimer laser annealing, AIP Conference Proceedings, vol.449, 1998, pp.315-319
• [134] Boughaba S., Auvert G.: Growth kinetics of micron-size nickel lines produced by laserassisted decomposition of nickel tetracarbonyl, J. Appl. Physics, vol.73, (12), 1993, pp.8590-8600
• [135] Bradley C.C, Faber T.E., Wilson E.G., Ziman J.M.: A Theory of the Electrical Properties of Liquid Metals. I: The Polyvalent Metals, Phil. Mag., (7), 1962, pp. 865-887
• [136] Brandner M., Seibold G., Chang C., Dausinger F., Hiigel H.: Soldering with solid state and diode lasers: Energy coupling, temperature rise, process window, J. of Laser Applications, vol.12 (5), 2000, pp. 194-199
• [137] Brown R.A.: A dislocation model of grain boundary resistivity, J. Phys. F: Metal Phys., vol.7, No8, 1977, pp. 1477-1488
• [138] Brown R.A.: Electrical resistivity of dislocations in metals, J. Phys. F: Metal Phys., vol.7, N o7,1977, pp. 1283-1295
• [139] Brown R.A.: Scatering theory for crystal dislocations, J. Phys. F: Metal Phys., vol.7, 1977, pp. 1269-1281
• [140] Brown R.A.: Scaterring phaseshifts and resonances for line defects, J. Phys. F: Metal Phys., vol 8, No5, 1978, pp. 825-843
• [141] Bruggeman R.C.: Dielektrizitatskonstanten und Leitfahigkeiten der Mischkôrper aus isotropen Substanzen, Ann. Phys., 24, 1935, 636-679
• [142] Bruk M.R., Morozova E.A., Shafeev G.A.: Laziemo-stimulirovannoie chimiceskoe osazdenie nikielevych plenok, Fizika i chimia obrabotki materialov, nr 3,1991, 85-89
• [143] Bunkin F.V., Dmitriyev A.K., Lukyanchuk B.S., Shafeev G.A., Szorenyi T.: Thermodiffusional instability and potential distribution in laser-heated absorbing electrolytes, Appl. Phys. A 40, 1986, pp. 159-162
• [144] Bunkin F.V., Grandberg K.I., Lukyanchuk 6.S., Perevalova E.G., Shafeev G.A.: Laziemoje osazdenie metalla iz trifenylfosfmovych kompleksov odnovalentnovo zolota, Kvantovaja elektronika, 1.13, nr 7, 1986, 1321-1322
• [145] Bunkin F.V., Kirichenko N.A., Lukyanchuk B.S.: Termochimiceskaja bistabilnosf i chimiceskije fazovyje perechody, stimulirovannyje laziemym izluceniem, Kvantovaja elektronika, t.ll, nr 6, 1984,1183-1198
• [146] Bylica A., Adamiak S.: Laser hardening of iron-base alloys, Proc.of SPIE, vol. 3187, 1996, pp.65-75
• [147] Chabicovski R., Nicolics J., Musiejovsky L.: Investigation of laser soldering process for interconnection of thin film sensors with sputtered multilayer metallizations, Journal of Vacuum Sci.&Technology A: Vacuum, Surfaces, and Films, vol.11, (4) 1993, pp. 1464- 1469
• [148] Chada S., Herrmann A., Laub W., Foumelle R.A., Shanggauan D., Achari A.: Microstructual investigation of Sn-Ag and Sn-Pb-Ag solder joints, Soldering & Surface Mount Technology, vol. 9 (7), 1997, pp.9-13,21
• [149] Chada S., Laub W., Foumelle R.A., Shanggauan D.: An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates, J. Electron. Mater.v.28, No.ll, 1999, pp.1194-1202
• [150] Chande T., Mazumder J.: Composition control in laser surface alloying, Met. Trans. B., vol.l4B, 1983, pp.181-190
• [151] Chapman G.H.: Laser application to IC defect correction, Proc. SPIE, v. 3274, ’98, pp. 79- 89
• [152] Chan C.L., Mazumder J., Chen M.M.: Effect of surface tension gradient driven convection in laser melt pool: Three-dimensional perturbational model, J.Appl.Phys. vol.64(ll), 1988, pp.6166-6181
• [153] Chetty N., Weinert M., Rahman T. S., Davenport J.W.: Vacancies and impurities in aluminium and magnesium, Physical Review B, vol. 52, No.9, 1998, pp.6313-6326
• [154] Chou T.C., Link L.: Solid state interdiffusion in Ni-Mo diffusion couples at high temperatures, Scripta Materialia, vol.34, No.5, 1996, pp.831-838
• [155] Cho J.S.H., Kang H-К., Wong S.S., Shacham-Diamand Y.: Electroless Cu for VLSI, Mat. Res. Soc. Bulletin, vol.XVIII, No.6,1993, pp.31-38
• [156] Choi W.K., Lee H.M.: Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate, J. Electron. Mater.v.29, No.10, 2000, pp.1207-1213
• [157] Clinton J.R., Tyler E.H., Luo H.L.: Electric and magnetic properties of Au-Ni alloys, J.Phys. F: Metal Phys., vol.4,1974, pp.1162-1169
• [158] Coquery G., Lallemand R., Wagner D., Gibard P.:” Reliability of the 400A IGBT modules for traction convertors contribution on the power thermal fatigue influence”, Proc. EPE’95, Sevilla 1995, pp.1060-1065.
• [159] Cossarutto L„ Chaoui N„ Millon E„ Muller J.F., Lambert J., Alnot M.: Ce02 thin films on Si (100) obtained by pulsed laser deposition, Applied Surface Science vol. 126,(3-4), 1998,pp.352-355
• [160] Crisci R.J., Draper C.W.: Cavitation erosion of laser-surface-melted self-quenched Fe-Al. bronze, Appl. Optics, vol.21 (10), 1982, pp.1730-1731
• [161] D'Alesio L., Teghil R., Santagata A., Marotta V., Ferro D., De Maria G.: Thin films of FeV deposited by pulsed laser ablation, Surface & Coatings Technology, vol.80, 1996, pp.221-223
• [162] Dargel-Sulir L., Jankowski H.: Structure of thin Mo-Ni films, Thin Solid Films, vol. 141 (1986), pp. 129-135
• [163] Dahotre N.B., McCay D.T., McCay M.H.: Laser processing of SiC-alloy metal matrix composite, J.Appl.Phys. vol.65(12), 1989, pp.5072-5077
• [164] Das S., Beaman J.J., Wohlert M., Bourell D.L.: Direct laser freeform fabrication of high performance metal components, Rapid Prototyping Journal, vol.4, no.3, 1998, pp.l 12-117
• [165] Datta M., Romankiw L.T., Vigliotti D.R., von Gutfeld R.J.: Jet and laser-jet electrochemical micromachining of nickel and steel, J. Electrochem.Soc., vol.136, No.8, (1989), pp.2251-2256
• [166] Dekker J.P., Lodder A.: Theory for the electromigration wind force in dilute alloys, Physical Review B, vol. 56, No.19,1997, pp.12167-12177
• [167] Dickmann K.: Einfluss des Lasertrennes auf die ferromagnetischen Eigenschaften silizierter Stahlbleche, Laser und Optpelektronik, vol.21(3), 1989, pp.l24-131
• [168] Dimesso L., Hahn H.: Structure and magnetoresistance effect in granular Ag-Ni alloys prepared by gas flow condensation technique, J.Appl. Phys., vol.84 (2), 1998, pp.953-957
• [169] Domański R.: Promieniowanie laserowe - oddziaływanie na ciało stałe, WNT W-wa, 1990
• [170] Dom L., Lee K.-L., Handke H.: Nd:YAG-laser cutting of amorphous alloys, DVSBerichte, B.163, DSV-Verlag 1994, pp.447-455
• [171] Drake J., Meyer F.G.: Laser!ôten an SMT-Leiterplaten eines Computerherstellers, Feinwerktechnik & Messtechnik, 94 (1986), s. 356-358
• [172] Draper C.W., Franey J.P., Gibson J.M., Graedel T.E., Jacobson D.C., Kammlot G.W., Poate J.M.: Microstructure and behavior of laser-mixed Cr/Ni films on Cu alloys, J.of Mater..Research, vol.2(l), 1987, pp.35-45
• [173] Draper C.W.: Laser preparation of metal surfaces for telecommunication needs, in Proc. of NATO ASI (Laser surface treatment of metals), Martinus Nijhoff Oublishers, 1986
• [174] Dreirach O., Evans R., Güntherodt H-J., KUnzi H-U.: A simple muffin tin model for the electrical resistivity of liquid noble and transition metals and their alloys, J.Phys. F: Metal Phys., vol.2, July 1972, pp. 709-725
• [175] Dubnyakov V.N.: Surface hardening of copper alloys with laser radiation, Metal Science and Heat Treatment, vol.29, no.9-10, Sept.-Oct. 1987, pp.699-703
• [176] Dulnev G.N.: Pierenos tepla ćerez tvierdyje dispersnyje sistemy, Inżyniemo-Technićeskij Żumal, vol. IX, 3, 1965, 399-404
• [177] Dutta Majumdar J., Manna I.: Laser surface alloying of copper with chromium. I. Microstructural evolution, Materials Science and Engineering 1999, A268, p.216-226; Laser surface alloying of copper with chromium. II. Improvement in mechanical properties, Materials Science and Engineering (1999), A268, p.227-235
• [178] Emmel A., Schubert E., Bamikel J., Stiele H.J, Bergmann H.W.: Improved corrosion resistance of excimer laser treated satinless steel, Proc.of SPIE, vol.2207,’94, pp.612-622
• [179] Eremenko A.A., Kozlova E.K., Portnyagin A.I., Romancenko A.N., Filippov A.E.: Wlijanie opticeskovo izlucenia na proces chimiceskovo nikielirovania, Kvantovaja elektronika, t.ll, nr 8, 1984, 1677-1679
• [180] Esrom H., Zhang J.-Y., Kogelschatz U., Pedraza A.J.: New aproach of a laser-induced forward transfer for deposition of patterned thin metal films, Appl. Surf. Sci. vol.86,1/4, 1995, pp. 202-207
• [181] Evoy S., Izquierdo R., Bernier M.-H., Meunier M., Sacher E.: Diode laser-assisted pyrolysis of organometallic films for the fabrication of metallic conductors on polyimide, IEEE Trans. Comp. Pkg., Manufact. Technol., vol.18, No.4, 1995, pp. 697-703
• [182] Faber T.E., Ziman J.M.: A Theory of the Electrical Properties of Liquid Metals. I: The Resistivity of Binary Alloys, Phil. Mag., (11), 1965, pp. 153-173
• [183] Felton L.E., Selsley A.D., Ficalora P.J.: Intermetallic structure of laser reflowed Cu/Pb-Sn solder joints, Applied Physics Letters, vol. 54 (21), 1989, pp.2074-2075
• [184] Fisanick G. J., Gross M. E., Hopkins J. B., Fennell M. D., Schnoes K. J., Katzir A.: Laserinitiated microchemistry in thin films: Development of new types of periodic structure, J. Appl. Phys. vol. 57, 4, (1985), pp. 1139-1142
• [185] Fogarassy E., Fuchs C„ Slaoui A., de Unamuna S., Stoquert J.-P., Marine W., Lang B.: Synthesis of silicon-based dielectric films by excimer laser ablation, Proc. SPIE, v. 2045, 1993, pp. 148-159
• [186] Frear D.R., Vianco P.T.: Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys, Metallurgical & Materials Transactions A, vol. 25A, no.7, 1994, pp. 1509-23
• [187] Frederikse H.P.R., Fields R.J., Feldman A.: Thermal and electrical properties of cooper-tin and nickel-tin intermetallics, J. Appl. Phys. vol.72, No.7, 1992, pp.2879-1882
• [188] Frerichs H., Strieker J., Wesner D. A., Kreutz E. W.: Laser-induced surface modification and metallization of polymers. Applied Surface Science, vol.86, 1995, pp.405-410)
• [189] Gaffet E., Pelletier J.M., Bonnet-Jobez S.: Laser surface alloying of Ni film on Al-based alloy, Appl.Surf.Sci., vol.43,1989, pp.248-255
• [190] Gagliano F.P., Lumley R., Watkins L.: Laser in industry, Proc. of the IEEE, vol.57 (2), 1969
• [191] Gasser A., Hoffmann D., Jansen F., Kreutz E.W., Lugscheider E., Wissenbach K.: Remelting of surface coatings on steel by CO2 laser radiation, Surface and Coatings Technology, 45 (1991), pp.409-416
• [192] Gasser A., Kreutz E.W., Wissenbach K.: Beam guiding and shaping for surface processing with laser radiation, Proc of SPIE, vol. 1276, 1990, pp. 361-374
• [193] Gelchinski M.H., Romankiw L.T., Vigliotti D.R., von Gutfeld R.J.: Electrochemical and metallurgical aspects of laser-enhanced jet plating of gold, J. Electrochem.Soc., vol.132, N0.11,(1985), pp.2575-2581
• [194] Gengel G., Butcher B.: Lasers in electronic substrate production, Proc. of ICALEO'95, Laser Institute of America, pp. 6-14
• [195] Geretovszky Z., Szorenyi T., Bali K., Kelemen L., Geretovszky Zs.: Kinetic model for scanning laser-induced deposition from the liquid phase, Appl. Surf. Sci. vol.86, 1/4, 1995, pp. 494-499
• [196] Ghaisas S., Chaudhari S.M., Kanetkar S.M., Ghaisas S.V.: Pulsed-laser-induced reactive alloying of Fe-W system under benzene, J.of Appl.phys., vol. 64,(9), 1988, pp.4782-4748
• [197] Gladush G.G., Krasickaia L.S., Levcenko E.B., Cemiakov A.L.: Termokapilamaja konvekcja w zidkosti pod dejstviem moscnovo laziemovo izlucenia, Kvantovaja Elektronika, vol.9(4), 1982, pp.660-667
• [198] Glasmacher M., Pucher H.-J., Geiger M.: Improvement of the reliabity of laser beam microwelding as interconnection technique, Proc. SPIE, v. 2703,1996, pp. 411-420
• [199] Glynn T.J., Flanagan A.J., Redfem R.M.: Reflow soldering of fine-pitch devices using a Nd:YAG laser, Proc. SPIE, v. 1598, 1991, pp. 200-205
• [200] Gnedovets A.G., Portnov O.M., Smurov I., Flamant G.: Kinetic model of mass transfer through gas-liquid interface in laser surface alloying, Appl.Surf. Sci., vol.109/110, 1997, pp. 143-149
• [201] Gofuku E., Ogama T., Takasago H.: Surface-modified Ru02-based thick film resistors using Nd:YAG laser, J. Appl. Physics, vol.66, (12), 1989, pp.6126-6131
• [202] Golonka L.: Cermetowe rezystory grubowarstwowe, Prace Naukowe ITE Polit. Wrocławskiej, seria Monografie nrl5 (40), Wrocław 1991 (praca habilitacyjna)
• [203] Gorbunov A.A., Friedlein R., Bauer H.-D., Golden N.S., Scharfenberg R., Fink J., Pompe W.: Synthesis of single - wall carbon nanotubes by laser ablation, Proc. SPIE, vol. 3688, 1998, pp. 335-338
• [204] Gorbunov A.A., Tselev A., Pompe W.: Cross-beam pulsed laser depositon of ultrathin multilayer metal films, Proc. SPIE, vol. 3688, 1998, pp. 351-358
• [205] Górka A.: Selected aspect of diffusion initiated by laser beam, Proc.of SPIE, vol. 2202, 1994, pp.525-531
• [206] Gosh G.: Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Pd metallizations, J. Electron. Mater.v.28, No.ll, 1999, pp.1238-1250
• [207] Grabski M.W.: Struktura granic ziam w metalach, Wyd. Śląsk, 1969
• [208] Granqvist C.G., Hunderi O.: Conductivity of inhomogeneous materials: Effective medium theory with dipole-dipole interaction, Physical Review B, vol.18, 4, 1978
• [209] Greenstein M.: Optical absorption aspects of laser soldering for hogh density interconnects, Applied Optics, vol.28, No.21, pp.4595-4603
• [210] Gremaud M., Allen D.R., Rappaz M., Perepezko J.H.: The development of nucléation controlled microstructures during laser treatment of Al-Si alloys, Acta mater, vol. 44, No.7, 1996, 2669-2681
• [211] Gremaud M., Carrard M., Kurz W.: The microstructure of rapidly solidified Al-Fe alloys subjected to laser surface treatment, Acta metali, mater., vol.38, No.12, 1990, pp. 2587- 2599
• [212] Gremaud M., Wagniere J.-D., Zryd A., Kurz W.: Laser metal forming: process fundamentals, Surface Engineering, Vol. 12(3), 1996, pp.251-259
• [213] Gross M.E., Appelbaum A., Gallagher K.J.: Laser direct-write metallization in thin palladium acetate films, J.Appl. Phys. vol.61, 4, (1986), pp. 1628-1632
• [214] Gross M.E., Appelbaum A., Schnoes K.J.: A chemical and mechanistic view of reaction profiles in laser direct write metallization in metallo-organic films. Gold., J.Appl. Phys. vol.60, 2. (1986), pp. 529-533
• [215] Gupta A., Chen J.: High-conductance customized copper interconnections produced by laser seeding and selective electrodeposition, Appl. Phys.Lett. 56, 25, (1990), pp.2516- 2518
• [216] Gupta A., Jagannathan R.: Laser writing of cooper lines from metalorganic films, Appl. Phys. Lett., vol.51, 26, 1987, pp. 2254-2256
• [217] Gurusamy R., Mohammed M., Molian P.A.: Finite element simulation of laser scribed electrical steel for core loss reduction, Proc. of ICALEO'96, Laser Institute of America, pp. 133-142
• [218] Gurusamy R., Molian P.A.: Diode laser scribing of non-oriented 3 wt% Si-steel for core loss reduction, J. of Laser Applications, 9, (1997), pp. 147-153
• [219] Gusev V.E., Kozlova E.K., Portnyagin A.I.: O roli termogradientnych javlenii w lasemoj elektrochimii, Kvantovaja elektronika, 14, Nr 2 (1987), 323-327
• [220] Haferkamp H, Ebsen H., Schmidt H.: Surface treatment of copper-based alloys with pulsed solid-state lasers, ECLAT 94, DVS-Berichte 163 (1994) 427-434
• [221] Haferkamp H., Marquering M., Ebsen H.: Alloying of copper surfaces with a pulsed Nd:YAG laser, Proc. of SPIE, vol.2207, 1994, pp.690-704
• [222] Harish C.M., Kumar V., Prabhakar A.: Direct writing of copper film patterns by laserinduced decomposition of copper acetate, J. Electrochem.Soc., vol.135, No.ll, (1988), pp.2903-2904
• [223] Harris P.G., Chaggar K.S.: The role of intermetallic compounds in lead-free soldering, Soldering & Surface Mount Technology, vol. 10 (3), 1998, pp.38-52
• [224] Hartmann M., Bergmann H.W., Kupfer R.: Experimental investigations in laser microsoldering, Proc. SPIE, vol. 1598, 1991, pp. 175-185
• [225] Hayward J.D.: Development of laser bonding as manufacturing process for inner lead bonding, Proc. SPIE, v. 1598, 1991, pp. 164-174
• [226] He X., Mordike B.L., Pirch N., Kreutz E.W.: Model for calculation of concentration distribution in laser alloyed pool, ECLAT 94, DVS-Berichte 163 (1994) pp.260-265
• [227] Hehenkamp Th., Berger W., Kluin J.-E., Liidecke Ch., Wolff J.: Equilibrium vacancy concentrations in copper investigated with the absolute technique, Phys. Rev.B, vol.45(5), 1992, pp. 1998-2003
• [228] Heringhaus F.: Quantitative analysis of the influence of the microstructure on strenght, resistivity, and magnetoresistance of eutectic silver-copper, Shaker Verlag, Aachen, 1998 (Dissertation)
• [229] Hierl S., Geiger M.: Simultaneous laser soldering for SMDs on 3D-MIDs. Conf. Proc. of Surface Mount Tech. Assoc. 1999, pp.440-445
• [230] Hirose A., Kobayashi K.F.: Surface alloying of copper with chromium by CO2 laser, Materials Science and Engineering (1994), A174, p.199-206
• [231] Hirsch T.J., Miracky R.F., Lin C.: Selective-area electroless copper plating on polyimide employing laser patterning of catalytic film, Appl. Phys. Lett. 57, (13), 1990, pp. 1357- 1359
• [232] Hoffmann P„ Lecohier B., Goldoni S., Van den Berg H.: Fast laser writing of cooper and iridium lines from thin solid surface layers of metaloganic compounds, Appl. Surf. Sci. 43 (1989), pp. 54-60
• [233] Homeff P., Treusch H.-G., Beyer E., Herziger G., Knoedler D., Moeller W.: Temperaturgeregeltes Lasermikrolôten, DVS-Berichte B.129, 1990, pp.62-65
• [234] Hoving W.: Laser applications in consumer electronics, Aachener Colloquium fiir Lasertechnik'98, F-ILT Aachen, 1998
• [235] Huber E., von Allmen M.: State of Si and Sn in glassy Au alloys, Phys. Rev. B, vol.31(6), 1985, pp.3338-3342
• [236] Hui I.K., Law H.W.: An alternative approach for analysis of intermetallic compounds in SMT solder joints, Soldering & Surface Mount Technology, vol. 12 (1), 2000, pp.23-31
• [237] Husmann A., Gottmann J., Klotzbücher T., Kreutz E. W.: Pulsed laser deposition of ceramic thin films using different laser sources, Surface and Coatings Technology vol. 100/101, 1998, pp.411-414
• [238] Ignatiev M., Dupuy C., Sola X., Thevenet E., Smurov I.Yu., Covelli L.: Laser and electron beam alloying of A1 with Fe and Sn, Appl.Surf.Sci.,vol. 109/110,’97,pp.137-
• [239] Ivanov L.I., Masliev S.A., Pimenov W.N., Januśkiević W.A.: Kristalizacja splavov aluminij-mied’ pri vozdiejstvi impulsnovo laziemovo izlucenia, Fizika i Chimia Obrab. Mater., Nr.2, 1988, pp.65-70
• [240] Jakovlev E.B.: Amorfizacja iz rasplava pri laziemom vozdiejstvi, Izv.Akad. Nauk СССР Ser Fiz.,vo.55(7), 1991, pp.1362-1364
• [241] Jandeleit J., Horn A., Weichenhain R., Kreutz E. W., Poprawę R.: Fundamental investigations of micromachining by nano- and picosecond laser radiation, Applied Surface Science, 127-129, 1998, pp.885-891
• [242] Jang S.: Packaging of photonic devices using laser welding, Proc. SPIE , vol. 2610, 1996, pp. 138-149
• [243] Jaschek R., Konrad P., Mayerhofer R., Bergmann H.W., Bickel P., Kowalewicz R., Kuttenberger A., Christiansen J.: Contribution to the beam plasma material interactions during material processing with TEA C02 laser radiation, Proc.of SPIE, vol.2502, 1995, pp.724-731
• [244] Jerominek H., Pin J.: Laser-assisted deposition and etching of refractive and diffractive optical elements, Proc. SPIE v. 2045,1993, pp. 194-204
• [245] Jost N., Haddenhorst H.: Laserglazing of aluminium-based alloys, J. Mater. Sci. Lett., vol. 10, 1991, pp.913-916
• [246] Juarez-Islas J.A., Perez R., Albarran L.A., Rivera V., Martinez L.: Development of highstrength, high-conductivity copper alloys by rapid solidification, J. Mater. Sci. Let., vol. 11,1992, pp.1104-1106
• [247] Jubber M., Wilson J.I.B., Davidson J.L., Femie P.A., John P.: Laser writing of high-purity gold lines, Appl. Phys. Lett., vol.55,14,1989, pp. 1477-1479
• [248] Kang S.K., Rai R.S., Purushothaman S.: Interfacial reactions during soldering with leadtin eutectic and lead (PB)-free, tin-rich solders, J. Electron. Mater.v.25, No.7, 1996, pp.1113-1120
• [249] Kar A., Mazumder J.: Model for nonequilibrium partitioning during rapid solidification of binary concentrated solutions, Acta metali, mater., vol.40, No.8, 1992, pp.1873-1881
• [250] Kaufmann E.N., Wallace R.J.: Crystallization and nucléation phenomena in cw surface melted alloys, Proc of the NATO ASI, Martinus Nijhoff Publishers, 1986,pp.93-110
• [251] Kaul S.N., Kettler W., Rosenberg M.: Evidence for magnetic contribution to the electrical resistivity in amorphous FegoB2o-xCx alloys, Phys. Rev. (B), vol.33, 1986, pp.4987-4997
• [252] Kaveh M., Wiser N.: Deviations from Matthiessen's rule for the electrical resistivity of dislocations, J. Phys. F: Metal Phys., vol 16, 1986, pp. 795-802
• [253] Kelly J., Nagarathnam K., Mazumder J.: Laser cladding of cast aluminum-silicon alloys for improved dry sliding wear resistance, J.of Laser Applications, vol.10,1998, pp.45-54
• [254] Kim H.K., Liou Н.К., Tu K.N.: Three-dimensional morphology of very rough interface formed in the soldering reaction between eutectic SnPb and Cu, Applied Physics Letters, vol. 66 (18), 1995, pp.2337-2339
• [255] Kim P.G., Jang J.W., Lee T.Y., Tu K.N.: Interfacial reaction and wetting behavior in eutectic SnPb solder on NiTi thin films and Ni foils, J. Appl. Phys. vol.86, No. 12, 1999, pp.6746-6751
• [256] Kim P.G., Jang J.W., Tu K.N., Frear D.R.: Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation, J. Appl. Phys. vol.86, No.3, 1999, pp. 1266-1271
• [257] Kirchmeim R., Kaeber U.: Atomistic and computer modeling of metallization failure of integrated circuits by electromigration, J. Appl. Phys., 70, No.l, 1991, pp. 172-181
• [258] Kirichenko N., Khavin Y., Arnold N.: Instabilities in direct writing due to non-uniform cross section of stripes, Appl. Surf. Sci. vol.93, (1996), pp. 359-372
• [259] Kirkpatrick S.: Percolation and conduction, Review of Modern Physics, vol. 45, 4, 1973, pp. 574-588
• [260] Klein Wassink R.-J: Weichloten in der Elektronik, Eugen G. Leuze Verlag, Bad Saulgau, 1991
• [261] Koch J., Mazumder J.: Rapid prototyping by laser cladding, Proc. of ICALEO’93, Laser Institute of America, 1993, pp.556-565
• [262] Komorek Z., Bojar Z.: Struktura i naprężenia własne w warstwie powierzchniowej odlewniczego stopu niklu po przetopieniu laserowym, „Krzepnięcie metali i stopów”, PAN- Komisja Odlewnictwa z.27, (1996), pp.141-150
• [263] Kostrubiec F., Leszczyński J., Pawlak R., Wysznacki A.: Podstawowe właściwości mikropołączeń elektrycznych drutów i folii (Ni, kowar, AL, Au) wykonanych metodą spawania laserowego, Z.Nauk. PŁ ser. Elektryka, z.59, 1978, str.77-87
• [264] Kostrubiec F., Lisik Z., Pawlak R., Jakubowska K., Korbicki A.: New laser technology for wire bonding in power devices, Microelectronics Journal, vol.32, (2001), pp.543-546
• [265] Kostrubiec F., Pawlak R., Raczyński T., Walczak M. : "Changes of Electrical Conductivity by Laser Alloying with Foreign Elements" - Proc. of the Int. Symp. on High Power Lasers and Laser Applications V, Conference on Novel Application, SPIE vol. 2207, pp.784-787
• [266] Kostrubiec F., Pawlak R., Raczyński T., Walczak M.: Laser alloying of the metal surface with foreign elements, Proc. of the 4th Conf. on Surface Physics, Univ. of Lodz, 1989
• [267] Kostrubiec F.: Distribution of concentration of gold in the process of laser alloying of the nickel surface layer, J.Mater. Sci., vol.26,no.22, 1991, pp.6044-8
• [268] Kostrubiec F., Pawlak R., Raczyński T.: "A change in the resistivity of the nickel surface layer alloyed with gold using a laser "-Surface and Related Phenomena, 1992, p.l 10-112.
• [269] Kostrubiec F., Pawlak R., Raczyński T.: Disintegration in the electric arc of the tungsten surface subject to laser radiation, Proc. of 2nd Conf. on Surface Physics, Technical University of Wroclaw, 1987
• [270] Kostrubiec F., Pawlak R., Walczak M.: „Domieszkowanie warstw wierzchnich metali dla potrzeb elektrotechniki i elektroniki”, Mat. Konf. „V Sympozjum Techniki Laserowej”, Szczecin 1996
• [271] Kostrubiec F., Pawlak R., Walczak M.: The Structure and Electrical Properties of LaserModified Surface Layers of Selected Metals, Proc. SPIE vol.3188, Bellingham, '97, pp.35-46
• [272] Kostrubiec F., Pawlak R., Walczak M.: The macrostructure of the surface layer of wolfram after the effect of the laser beam on the surfaces. Proc. of Conf. on Surface Physics, University of Lodz, 1986
• [273] Kostrubiec F., Pawlak R.: Changes of macrostructure of tungsten under the influence of surface laser irradiation, J. Mater. Sci. Let., vol.6, 1987, pp. 1295-1297
• [274] Kostrubiec F., Pawlak R.: Laser alloying of the surface layer of molybdenum with gold and nickel, Proc. of the 5th Conf. on Surface Physics, University of Lodz, 1990
• [275] Kostrubiec F., Pawlak R.: Zmiana makrostruktury wolframu i molibdenu w następstwie impulsowej obróbki laserowej, Materiały II Sympozjum Techniki Laserowej, Wyd. Polit. Szczecińskiej, 1989
• [276] Kostrubiec F., Pawlak R.: Laser technologies of production of electric current conducting layers, Proc. SPIE vol.4238, Bellingham, 2000, pp. 199-208
• [277] Kostrubiec F., Pawlak R.: Zmiany właściwości makroskopowych powierzchni i warstwy przypowierzchniowej molibdenu pod wpływem promieniowania laserowego, Materiały III Sympozjum “Pola sprzężone i ich zastosowania”, Wyd.WAT 1756/87
• [278] Kostrubiec F., Pawlak R.: Problemy technologiczne realizacji połączeń laserowych odprowadzeń od struktur półprzewodnikowych w modułach tranzystorów mocy, Prace Nauk. Inst.Podstaw Elektrotechniki i Elektrotechnologii Polit. Wrocł., seria : Konferencje nr 12, Postępy w elektrotechnologii IV, 2000, s. 157-165
• [279] Kostrubiec F.: Czas oddziaływania skoncentrowanej wiązki laserowej z powierzchnią metali w procesie wytwarzania mikropołączeń elektrycznych, Z.Nauk. PŁ ser. Elektryka, z.68, 1980, str.77-88
• [280] Kovacs I., Nagy E., Feltham P.: Resistivity changes in silver due to plastic deformation, Phil. Mag., 9, 1964, pp. 797-801
• [281] Kovsh I.B., Mikhailovskii A. Ja., Safonov E.W.: Snizenie magnitnych potier w elektrotechniceskoj stali pośle obrabotki impulsnym Nd:YAG lazierom, Fizika i chimia obrabotki materialov, nr 4, 1991, 155-157
• [282] Kozlova E.K., Portnyagin A.I., Romanchenko A.N.: Wozniknovenie uporiadocnenych obrazovanii pri wozdieistvi opticeskovo izlucenia na galvaniceskii proces, Kvantovaja elektronika, t.ll, Nr 6 (1984), 1280-1282
• [283] Krasuski B.: Automat do produkcji bezpieczników typu Btdu 1000V, Mat. II Konf. „Postępy w elektrotechnologii”, Polit. Wrocł., 1996
• [284] Kreutz E. W., Pfleging W., Jandeleit J., Urbasch G.: Dry etching and micromachining of precision silicon component, Proc.of SPIE. vol. 2879,1996, pp.37-44
• [285] Kreutz E. W.: Pulsed laser deposition of ceramics - fundamentals and applications, Applied Surface Science vol.127-129, (1998) pp.606-613
• [286] Kurz W., Trivedi R.: Solidification microstructures: recent developments and future directions, Acta metali, mater., vol.38, No.l, 1990, pp.1-17
• [287] Kusiński J.: Modification of structure and properties of materials by laser surface processing, Proc.of SPIE, vol.3187, 1997, pp.2-14
• [288] Kusy A.: Chains of conducting particles that determine the resistivity of thick resistive films, Thin Solid Films, 43, 1977, pp. 243-250
• [289] Kusy A.: Struktura, mechanizm przewodnictwa oraz szumy typu 1/f rezystywnych warstw grubych, Wyd. Politechniki Rzeszowskiej, Rozprawy nr 22, 1979 (praca habilitacyjna)
• [290] Kusy.A., Mleczko K., Stadler A.W., Wilczyński G.: Właściwości transportu elektrycznego warstw RuOj - szkło, Mat. Konf. Matel-95, Polit. Łódzka, 1995
• [291] Kuzma M., Wisz G., Sheregii E., Gorbach T.Ya., Smertenko P.S., "Svechnikov S.V., Ciach R., Rakowska A.: PLD of HgCdTe on two kinds of Si substrate, Applied Surface Science vol.138-139, (1-4), 1999, pp. 465-470
• [292] Landauer R.: Electrical conductivity in inhomogeneous media, in American Institute of Physics 40 th Conf. Proc., 1978, pp. 2-43
• [293] Landauer R.: The electrical resistance of binary metallic mixtures, Journal of Appl. Physics, vol. 23, 7,1952, p. 779-784
• [294] Lau K.H., Man H.C.: Multi-spot excimer laser soldering for fine pitch SMD, Proc. ICALEO '96, vol.80, Laser Institute of America, 1996, pp.132-139
• [295] Lea C.: A scientific guide to surface mount technology, Electrochem. Publ. Ltd., Ayr, Scotland, 1988
• [296] Lea C.: Laser soldering-production and microstructural benefits for SMT, Soldering & Surface Mount Technology, No.2, June 1989, pp. 13-21
• [297] Ledermann P.G., Johnson G.W., Ritter M.B.: Laser-formed structures to facilitate TAB bonding, SPIE Proceedings Vol. 1598, Bellingham, 1991, pp.160-163
• [298] Lee H.J., Park D., Moon J.T., Lee Y.H., Shin D.H., Kim Y.S.: Characteristic of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering, J. Electron. Mater.v.29, No.10, 2000, pp.1153-1159
• [299] Leong K.H., Geyer H.K., Sabo K.R., Sanders P.G.: Treshold laser beam irradiances for melting and welding, J.of Laser Applicastions, vol. 9(5), 1997, pp.227-231
• [300] Levin A.A.: High-speed high-efficiency 500W cw CO2 laser hermetization of metal frames of microelectronics devices, Proc. SPIE, v. 2703,1996, pp.202-205
• [301] Li L., Steen W.M., Modem P., Spencer J.T.: Laser removal of surface and embedded contaminations on/in building structures, Proc.of SPIE, vol. 2246, 1994, pp.84-95
• [302] Li L., Steen W.M.: Sensing, modeling, and closed loop control of powder feedrate for laser surface modification, Proc. of ICALEO’93, Laser Institute of Amerika, 1993, pp.965-964
• [303] Libenson M.N.: Projavlenie effektov samoorganizacji pri vozdiejstvi na materiały skanirujemovo lasiemovo izlucenia, Izv. Akad. Nauk RSRR, 8,1997, pp.1491-1496
• [304] Lin Q., Sheppard K.G., Datta M., Romankiw L.T.: Laser-enhanced electrodeposition of lead-tin solder, J. Electrochem.Soc., vol.139, (1992), pp.L62-L63
• [305] Lindner H., Bergmann H.W., Endres Th.: Remelting and alloying of Al-Si alloys, Proc. of ECLAT’90, 1990, pp.661-670
• [306] Lipski T.: Recent development in distribution fuses, Proc. of 5th Int. Symp. on „Short - Circuit Currents In Power Systems”, Warszawa 1992
• [307] Lipski T. Bezpieczniki niskonapięciowe, WNT 1968
• [308] Liu J.B., Li Z.C., Liu B.X., Kresse G., Hafner J.: Stability of nonequilibrium phase in an immiscible Ag-Ni system studied by ab initio calculations and ion-beam mixing experiment, Phys. Rev. B, vol.63, no.13, 2001, pp.132204/1-4
• [309] Liu Z., Watkins K.G., Steen W.M., Vilar R., Ferreira M.G.: Dual wavelength laser beam alloying of aluminium alloy for enhanced corrosion resistance, J. of Laser Appl., Laser Institute of America, vol. 9 (4), 1997, pp. 197-204
• [310] Liu Z., Woelmer H., Watkins K.G., Steen W.M.: Aluminum surface alloying with mixed excimer laser and CO2 laser beams, Proc of SPIE, vol.2246, 1994, pp. 74-83
• [311] Loosen P.: Advanced concepts of using diode lasers in materials processing, Proc. SPIE, v. 2703 (LASER’97), 1997, Bellingham, pp. 480-485
• [312] Lou Q., Ning D., Dong J., Wei Y.: Increase of electrical conductivity of solid C60 films by excimer laser radiation, Proc. of SPIE, vol.2703,1996, pp.534-540
• [313] Lowndes D. H., Rouleau C. M., Thundat T., Duscher G., Kenik E.A., Pennycook S.J.: Silicon and zinc telluride nanoparticles synthesized by pulsed laser ablation: size distributions and nanoscale structure, App. Surf. Sci. vol.127-129, 1998, pp.355-361
• [314] Lugscheider E., Bolender H., Hochmut K., Gasser A., Wissenbach K., Bitterlich R., Pirch N.: One-step-powder cladding of oxide ceramics on metal substrates with C02-laser radiation, ECLAT 94, DVS-Berichte 163 (1994) 213-218
• [315] Lumpp J.K., Allen S.D.: Excimer laser machining and metallization of vias in aluminium nitride, IEEE Trans. Comp. Pkg. Manufact. Technol.B, vol.20, No.3, 1997, pp. 241-246
• [316] Major B., Ciach R., Ebner R., Jeglitsch F., Kriszt B., Rabitsch K.: Laser microstructure modification by remelting and alloying of aluminium alloys and steels, Physica Status Solidi, 141, 1994, pp.15-30
• [317] Manninen M., Hautojarvi P., Nieminen R.M.: Residual resistivity of vacancies in simple metals, Phys. Lett., vol.63A, No.l, pp.60-62
• [318] Manninen M., Nieminen R.M.: Electronic structure of vacancies and vacancy clusters in simple metals, J. Phys. F: Metal Phys., vol 8, N oll, 1978, pp. 2243-2260
• [319] Martin J.P.: Unique symbol for marking and tracking very small semiconductor products, Proc. SPIE, vol. 1598, 1991, pp.206-220
• [320] Matteazi P., Miani F., Smurov I.Yu., Lashin A.M.: Modelling of structural transformation in laser glazing of metallic materials, Proc. of ECLAT’90, 1990, pp.927-938
• [321] Maxwell J.C.: A Treatise on Electricity and Magnetism, 2 nd ed., vol.l, Oxford: Clarendon Press, 1881
• [322] Mazumder J.: Overview of melt dynamics in laser processing, Optical Engineering, vol. 30(8), 1991, pp.1208-1219
• [323] Mei Z., Sunwoo A.J., Morris J.W.: Analysis of low-temperature intermetallic growth in cooper-tin diffusion couples, Met. Trans. А-Physical Metallurgy & Materials Science, vol.23A, No.3, 1992, pp.857-864
• [324] Mei Yu., Tyler E.H., Luo H.L.: Electrical resistivity of Au-Ni alloys, Physical Review B, vol. 26, No.8, 1982, pp.4299-4304
• [325] Metzger D., Reichl H.: Laser direct writing of gold to repair defective lines in thin-film metallizations, Appl. Surf.Sci. 69 (1993), pp. 69-74
• [326] Meunier M., Izquierdo R., Tabbal M., Evoy S., Desjardins P., Bernier M-H., Bertomeu J., Elyaagoubi N., Suys M., Sacher E., Yelon A.: Laser induced deposition of tungsten and copper, Materials Science and Engineering, vol. B45,1997, pp. 200-207
• [327] Miric A.Z., Grusd A.: Lead-free alloys, Soldering & Surface Mount Technology, vol.10 (1), 1998, pp. 19-25;
• [328] Morgan G.J., Howson M.A., Śaub К.: A generalised kinetic equation for electrons in disordered solids, J.Phys. F: Metal Phys., vol.15, July 1985, pp. 2157-2170
• [329] Morris M.A., Morris D.G.: Microstructures and mechanical properties of rapidly solidified Cu-Cr alloys, Acta metali. Vol. 35, (1988), No. 10, pp.2511-2522
• [330] Mridha S., Baker T.N.: Composite layer formation on Ti-6A1-4V surfaces by laser treatment using preplaced SiC powder, Surface Engineering, vol. 13(3), 1997, pp.233-237
• [331] Mrowec S.: Podstawy teorii utleniania metali i stopów, WNT Warszawa, 1964
• [332] Müller H.G., Buschick K„ Schuler S., Paredes A.: Laser direct writing of copper on various thin-film substrate materials, Appl.Surf.Sci. 46, (1990), pp. 143-147
• [333] Muller H.G.: YAG laser direct writing of copper from coper formate films, Appl.Phys.Lett. 56,10, 1990, pp. 904-906
• [334] Mundy J.N.: Electrical resistivity-temperature scale of tungsten, Philos. Mag. A, vol.46(2), 1982, pp.345-349
• [335] Nabarro F.R.N.: Theory of Crystal Dislocations, Oxford University Press, 1967
• [336] Nakahara S., Kamata T., Yoneda N., Hisada S., Fujita T.: Microsoldering using a YAG laser: on leed-free solder, Proc. SPIE, v. 4088, 2000, Bellingham, pp. 276-279
• [337] Nakamura M., Hirose K., Nozawa T., Matsuo M.: Domain refinement of grain-oriented silicon steel by laser irradiation., IEEE Trans. Magnetics MAG-23, 1987, pp. 3074-3076
• [338] Nanai L., Hevesi I., Bunkin F.V., Luk'yanchuk B.S., Brook M.R., Shafeev G.A., Jelski D.A., Wu Z.C., George T.: Laser-induced metal deposition on semiconductors from liquid electrolytes, Appl. Phys. Lett. 54 (8), 1991, pp. 736-738
• [339] Nicolics L, Hobler G.: Numerical analysis of transient temperature distributions during laser soldering, Int. J. Comput. & Math, in Electr. & Electron Eng., vol.13, no.4, 1994, p.845-860
• [340] Nicolics J.: Einsatz eines Lasers zum FeinstdrahtlOten, DVS-Berichte B.129, DVS-Verlag GmbH, Düsseldorf, 1990, pp. 190-193
• [341] Nishitani S., Moriyasu M.: Formation of non-magnetic region in ferromagnetic stainless steel, Proc. ICALEO '95, vol.80, Laser Institute of America, 1995, pp.60-68
• [342] Odolevskij V.I.: Rascet obobSćennoj provodimosti heterogennych sistem, Żumal Technićeskoj Fiziki, vol. XXI, 6, 1951, 667-677
• [343] Onishi M., Fujibuchi H.: Reaction-diffusion in the Cu-Sn system, Trans. Japan Inst Metali., vol. 16, No.9, (1975), pp.539-547
• [344] Oleinikov P.P., Kotshetova T.N., Rastrusin Yu.B.: Elektro- i tieploprovodnost splavov w sistemie Ni-Mo, Tieplofiz. Wys. Temp., t.20, No.1,1982, s. 59-62
• [345] Oleszak D., Portnoy V.K., Matyja H.: Phase transformations in nanocrystaline mechanically alloyed Ni-Mo powders, Nanostructured Materials, vol.12, no.5-8, 1999, pp.621-624
• [346] Onizuka K.: Computer experiment on a 3D site percolation model of porous materials - its connectivity and conductivity, J.of the Physic. Soc. Japan, vol. 39(2),1975, pp.527-535
• [347] Ortabasi U., Meier D.L., Easoz J.R., Schaefer R.D., Stepanova M.A., Ho W., Stokes J.A., Dummer R.S., Jafolla J.C., McKenna P.: Excimer micromachining for texturing silicon cells, Proc. of SPIE, vol. 2993, 1997, pp. 54-64
• [348] Ozegowski M, Meteva K., Metev S., Sepold G.: Pulsed laser deposition of multicomponent metal and oxide films, Applied Surface Science vol.138-139,(1-4), 1999, pp.68-74
• [349] Pan F., Liu B.X.: Ion-mixing-induced amorphization in an immiscible Au-Mo system with a small size difference, J. Phys.: Condens. Mater., vol. 8, 1996, pp. 383-388
• [350] Patri S., Gurusamy R., Molian P.A., Govindaraju M.: Magnetic domain refirement of silicon steel laminations by laser scribing. J. Mat. Sci., 31 (7), 1996, pp. 1693-1702
• [351] Paul B.K., Baskaran S.: Issues in fabricating manufacturing tooling using powder-based additive freeform fabrication, J. Mater. Proces.Technol., vol.61,1996, pp. 168-172
• [352] Pawlak R., Raczyński T., Walczak M.: "Badanie zmian własności mechanicznych metali domieszkowanych laserowo" - Mat. IV Sympozjum Techniki Laserowej , Świnoujście 26-03 IX 1993, pp. 213-215
• [353] Pawlak R., Raczyński T.: "Selected properties of surface layers of metals alloyed with pulsed laser", Materials Science and Engineering A168, (1993), pp. 67 - 70.
• [354] Pawlak R., Raczyński T.: Technological aspects of modification of macroscopic properties of the infusible metal surface layer with laser radiation energy, Proc. of the 3rd Conf. on Surface Physics, University of Lodz, 1988
• [355] Pawlak R., Raczyński T.: Wierzchnie warstwy metali domieszkowane za pomocą lasera impulsowego, Materiały III Sympozjum Techniki Laserowej, Wyd. Polit. Szczecińskiej, 1990
• [356] Pawlak R., Smolny A.: „Technological Problems of Laser Welding of Probes for the Measurement of Dynamic Rows”, Proc. SPIE vol.3188, Bellingham, 1997
• [357] Pawlak R., Smolny A.: „Mikrosondy do pomiarów przepływów dynamicznych spawane laserem impulsowym”, Mat. Konf. „V Sympozjum Techniki Laserowej”, Wyd. Polit. Szczecińskiej, 1996, str.
• [358] Pawlak R., Walczak M.: Stresses in Laser Alloyed Surfaces of High-Melting Metals, Proc. SPIE, vol. 3188, Bellingham, 1997
• [359] Pawlak R.: Warstwowe stopy oporowe wytwarzane w procesie domieszkowania laserowego, Mat. II Konf. „Postępy w elektrotechnologii”, Wyd. Polit. Wrocł., 1996
• [360] Pawlak R.: A laser pulse focused with spherical and cylindrical optical system in laser treatment of surface layer of metals, Proceedings of SPIE - „Laser Technology IV” - ed. W. Woliński, Z. Jankiewicz, vol. 2202, 1994, pp. 601-603
• [361] Pawlak R.: Własności wybranych warstw wierzchnich metali domieszkowanych laserowo, VIII Krajowa Szkoła Optoeletroniki "Laserowe Technologie Obróbki Materiałów", 6-9. 06.1994, Gdańsk - Wyspa Sobieszewska, str.271-281
• [362] Pawlak R.: O domieszkowaniu laserowym jako metodzie modyfikacji właściwości warstwy wierzchniej materiałów przewodzących, Mat. konf.: "Nowe materiały i technologie w elektrotechnice MATEL'95, Łódź-Dobieszków, 7-9.06.95
• [363] Pawlak R.: Optimization of conditions of laser alloying of silver surface layer, Proceedings of SPIE („Laser Technology IV”), vol. 2202, 1994, pp.544-546
• [364] Pawlak R.: Struktura laserowo domieszkowanych warstw wierzchnich metali trudnotopliwych, Mat. Konf. II Sympozjum n.t. "Wpływ obróbki laserowej na strukturę i właściwości materiałów”, Krasiczyn 1994, str.31-38
• [365] Pawlak R.: Ferromagnetic Laser-Welded Fe78Sii3B9 and Co7 i.5Fe2 .5Si9Mn2MoiBi4 Amorphous Foils, Proc. SPIE vol. 3188, Bellingham, 1997
• [366] Pawlak R Struktura i własności laserowo domieszkowanych stopów rezystywnych Cu - Ni oraz Ni - Cr, Krzepnięcie metali i stopów, Komisja Odlewnictwa PAN, z.27 (1996)
• [367] Pawlak R., Gawroński Z., Gasser A., Wissenbach K.: Non-equilibrium solidification by laser surface alloying of molybdenum with nickel: Structure and properties of alloyed layers, Journal of Materials Science., vol.36, 2001, pp.3261-3271
• [368] Pawlak R.: Laserowe wytwarzanie połączeń drutowych w tranzystorach mocy, Mat. III Konf. „Postępy w elektrotechnologii”, Wyd. Polit. Wrocł., 1998
• [369] Pawlak R.: Mikroobszary rezystywne na cienkich drutach i foliach wytwarzane laserem - właściwości i perspektywy zastosowania, Mat. III Konf. „Postępy w elektrotechnologii”, Wyd. Polit. Wrocł., 1998
• [370] Pawlak R.: Structure and properties of resistive micro-areas made using a pulsed and continous laser beam, Proc. SPIE vol.4238, Bellingham, 2000, pp.214-218
• [371] Pawlak R., Kawczyński R.: Metody oceny właściwości elektrycznych laserowych połączeń w przyrządach mocy, Prace Nauk.Inst.Podstaw Elektrotechniki i Elektrotechnologii Polit. Wrocł., seria: Konferencje nr 12, Postępy w elektrotechnologii IV, 2000, s. 167-171
• [372] Pelosin V., Hillairet J., Rodmacq В.: The dynamics of interface relaxation and destratification in AgNi multilayers, J. Phys.: Condens. Mater., vol.6, No.6, 1994, pp.1099-1112
• [373] Pelletier J.M., Renaud L., Fouquet F.: Solidification microstructures induced by laser surface alloying: influence of the substrate, Materials Science and Engineering, A134,(1991), pp.1283-1287
• [374] Peng C., Cheng L., Mansuripur M.: Experimental and theoretical investigations of laserinduced crystallization and amorphisation in phase-change optical recording media, J.Appl.Phys., vol.82(9), 1997, pp.4183-4191
• [375] Pfeiffer I., Hock S.: EinfluB einer Laser-Bestrahlung auf die Eigenschaften von CuLegierungen, Z. Metallkunde, Bd.72, H.l, 1981, s.36-42
• [376] Pfleging W., Vôrckel A., Duddek H., Wesner D. A., Kreutz E. W.: Excimer-laser patterning of copper in LDE (laser dry etching), Applied Surface Sci., vol. 109/110, 1997, pp. 194-200
• [377] Philips H.M., Wahl S., Sauerbrey R.: Submicron electrically conducting wires produced in polyimide by ultraviolet laser irradiation, App. Physics Lett., vol.62, (20), 1993, pp.2572-2574
• [378] Pilkington G., Meyrick G.: Microstructural changes in aged vapour-quenched Mo-Au alloys, Journal of Materials Science, vol.9, 1974, pp.2015-2024
• [379] Pirch N., Kreutz E.W., Molier L., Gasser A., Wissenbach K.: Melt dynamics in surface processing with laser radiation, Proc. of ECLAT’90, 1990, pp.65-80
• [380] Popovici D., Czeremuzkin G., Meunier M., Sacher E.: Laser-induced metal-organic chemical vapor deposition (MOCVD) of Cu (hfac) (TMVS) on amorphous Teflon AF1600: an XPS study of the interface, Applied Surface Science vol.126, (3-4), 1998, pp. 198-204
• [381] Postnikov V.S.: Electronic structure of the structural components of a surface layer obtained by laser alloying, Prooc. of SPIE, vol. 3688, 1999, pp.266-271
• [382] PreiBig K-U., Petring D., Herziger G.: High Speed Laser Cutting of Thin Metal Sheets, High Speed Laser Cutting of Thin Metal Sheets, Prooc. of SPIE, vol.2207,1994, pp.96- 110
• [383] Pucher H.-J., Fleckenstein M: Characterization and control of laser micro soldering process for solid solder deposits using pyrometry, Proc. SPIE, v._ 3509, '98, Bellingham, pp. 210-220
• [384] Pucher H.-J., Glasmacher M., Geiger M.: Laser beam soldering of fine-pitch technology packages with solid solder deposits, Proc. SPIE, v. 2703, 1996, Bellingham, pp. 310-321
• [385] Qiu T.Q., Longtin J.P., Tien C.L.: Characteristics of radiation absorption in metallic particles, J.of Heat Transfer, vol. 117(2), 1995, pp.340-345
• [386] Rabitsch K., Ebner R., Major B.: Boride laser alloying of М2 high speed steel, Scr. Metallurgica et Materialia, vol.30, 1994, pp.253-258
• [387] Radomski T., Ciszewski A.: Lutowanie, WNT, Warszawa, 1984
• [388] Rapp J., Beck M., Dausinger F., Hiigel H.: Fundamental approach to the laser weldability of aluminium- and copper-alloys, DVS vol.193, pp.313-319
• [389] Rasera R., Bernstein J.B.: Laser linking of metal interconnect: linking dynamics and failure analysis, IEEE Trans. Comp. Pkg., Manufact. Technol., vol.19, No.4, 1996, pp. 554-561
• [390] Raub Ch. J., Baumgârtner M., Khan H.R.: Laseruntersttitzte elektrolytische Abscheidung aus Goldelektrolyten, Metalloberflache 40 (9), (1986), 371-374
• [391] Reichenecker W.J.: Effect of solder thickness and joint overlap on the electrical resistance of soldered copper joints, Welding Research Suppl., Oct. 1981, pp.l99s-201s
• [392] Reisse G., Keiper B., Weissmantel S., Falkę U.: Pulsed laser deposition and modification of diamondlike carbon films, Applied Surface Science vol. 127-129, 1998, pp.500-506
• [393] Richter R., Wolf M., Goedsche F.: On the Spin Disorder Resistivity of Amorphous Ferromagnets, phys. stat. sol. (b), vol.95,1979, pp. 473-482
• [394] Rider J.G., Foxon C.T.B.: An experimental determination of the electrical resistivity of dislocations in copper, Phil. Mag., 16, 1967, pp. 1133-1138
• [395] Rieker C. Morris D.G.: Heterogeneous nucléation during rapid solidification by laser surface melting, Acta metali, mater., vol.38, No.6,1990, pp. 1037-1043
• [396] Roemer G.-W., Meijer J.: Analytical model describing the relationship between laser power, beam velocity, and melt pool depth in the case of laser remelting, realloying, and redispersing, Proc.of SPIE, vol.3097, 1997, pp.507-516
• [397] Ruschau G.R., Yoshikawa S., Newnham R.E.: Resistivities of conductive composites, J. Appl. Phys., vol. 72 (3), 1992, pp. 953-959
• [398] Russell E.: Photonic soldering: a new technology for rework and repair, Circuits Assembly, vol.l 1, no.6, 2000, pp.44-48
• [399] Rymaszewski J., Pawlak R., Lebioda M., Tomczyk M.: Komputerowe systemy pomiarowe w badaniach właściwości materiałów, Zesz. Nauk. Polit. Łódzkiej s. Elektryka, z.98, 2001, pp.419-428
• [400] Rytz-Froidevaux Y., Salathe R.P., Gilgen H.H.: Laser generated microstructures, Appl. Phys. A 37,1985, pp. 121-138
• [401] Ryu Y.R., Zhu S., Han S.W., White H.W., Miceli P.F., Chandrasekhar H.R.: ZnSe and ZnO film growth by pulsed-laser deposition, Applied Surface Science vol.127-129, 1998, pp.496-499
• [402] Sakai T., Okamato S., Iikawa T., Sato T., Henmi Z.: A new laser hermetic sealing technique for microwave amplifier, IEEE Trans. Comp., Hyb. Manuf. Tech.., vol. 10, 1987, pp.433-436
• [403] Sasaki S.: Tribological properties of coating films synthesised by laser assisted plasma spraying, Surface Engineering vol. 13(3), 1997, pp.238-242
• [404] Sausa R.C., Gupta A., White J.R.: Laser decomposition of platinum metallo-organic films for electroless copper plating, J. Electrochem.Soc., vol.134, No.l 1, (1985), pp.2707-2713
• [405] Scarisbrick R.M.: Electrically conducting mixtures, Journal of Physics D: Appl. Physics, vol. 6,1973, pp. 2098-2110
• [406] Schaefer M., Foumelle R.A., Liang J.: Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control, J. Electron. Mater.v.27, N o.ll, 1998, pp.1167-1176
• [407] Schey B., Biegel W., Kuhn M., Klarmann R., Stritzker B.: Pulsed laser deposition of YBCO thin films on 7 x 20 cm2 substrates, Applied Surface Science vol.127-129, 1998, pp.540-543
• [408] Schmakov A.M., Ivshina N.N.: Struktura i svoistva kompozitov pri laziemom modificirowani plazmiennych pokrytij na poroskovych materiałach, Fizika i Chimia Obr.Mater., Nr5, 1992, pp.90-100
• [409] Schneider R.: Laseranwendungen in der Automobilelektronik, Aechener Coll, fiir Lasertechnik, F-ILT Aachen, 1998
• [410] Schrott A.G., Braren B., O'Sullivan E.J.M., Saraf R.F., Bailey P., Roldan J.: Laserassisted seeding for electroless plating on polyimide surfaces, J. Electrochem. Soc., vol. 142, No3, 1995, pp.944-949
• [411] Schubert E., Rosiwal S., Bergmann H.W.: Investigation on excimer-laser-treated Cu/Cr contact material, Proc. of SPIE, vol.1503,1991, pp.299-309
• [412] Schüßler A.: Microstructure and properties of laser processed composite layers, Proc. of ECLAT’90, 1990, pp.287-296
• [413] Seleznev M.L., Denisov S.U., Afanasiev I.B., Privivkov A.U.: Microstructure behavior of some cast aluminum alloys as a result of double and multipass laser treatment, Proc. of SPIE, vol.1627, 1992, pp.182-191
• [414] Semerad E., Musiejowsky L., Nicolics J.: Laser soldering of surface-mounted devices for high-reliability applications, J. of Materials Science, vol.28, no.18, 1993, pp.5065-9
• [415] Senkara J., Windyga A.: Podstawy teorii procesów spajania, Wyd. Polit. Warszawskiej, 1990
• [416] Shacham-Diamand Y., Dubin V.M.: Copper electroless deposition technology for ultralarge-scale integration, Microelectronic Engineering, vol.33, no. 1-4, Jan. 1997, pp.47-58
• [417] Shafeev G.A., Pimenov S.M., Loubnin E.N.: Laser-assisted selective metallisation of diamonds by electroless Ni and Cu plating, Appl. Surf. Sci. vol.86,1/4, 1995, pp.392-397
• [418] Shafeev G.A., Themlin J.-M., Bellard L., Marine W., Cros A.: Enhanced adherence of area-selective electroless metal plating on insulators, J. Vac. Sci. Techn.,(A), vol.14, 2, 1996, pp.319-326
• [419] Shatzkes M., Huang Y.: Characteristic length and time in electromigration, J. Appl. Phys., 74, N o.ll, 1993, pp. 6609-6614
• [420] Shen W.P., Kwok H.S.: Crystalline phases of II-VI compound semiconductors grown by pulsed laser deposition, Appl. Phys. Lett., vol.65, (17), 1994, pp.2162-2164
• [421] Shirk M.D., Molian P.A.: A review of ultrashort pulsed laser ablation of materials, J. of Laser Application, 10, (1998), pp.18-28
• [422] Shubnii G.Y., Zherikhin A.N., Prokopov E.V., Tskhovrebov A.M., Zherikhina L.N., Voronov V.V.: Pulsed laser deposition of quantum-sized bismuth films, Proc. SPIE, vol. 3688, 1998, pp. 330-334
• [423] Simmons R.O., Balluffi R.W.: Measurements of equilibrium vacancy concentrations in aluminum, Phys. Rev., vol. 117(1), 1960, pp.52-61
• [424] Singh J.: Laser beam and photon-assisted processes for surface treatments, in Proc. of NATO ASI Series E 290, Kluwer Academic Publishers, 1995. pp.347-406
• [425] Smith D.P.H., Anderson J.C.: Theory of electrical conduction in particulate systems, Phil. Mag. B, vol. 43. 1981, pp. 797-828
• [426] Smolny A., Blaszczak J., Pawlak R.: „Three dimensional flow field measurements in multistage turbomachinery using a computer aided system”, Proc. SPIE vol.3054, Bellingham, 1997
• [427] Smurov I., Covelli L., Tagirov K., Aksevov L.: Pulse laser alloying energy spatial distribution vs. concentration fields of alloyed elements. Proc. ECLAT’92, 1992, pp.235- 240
• [428] So A.C.K., Chan Y.C., Lai J.K.L.: Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints, IEEE Transactions on Comp. Pack. Manuf. Technology-Part B, v.20, No.2, 1997, pp.161-166
• [429] Sokolov B.K.: Laser treatment of electrical steels and other magnetic materials. Proc. SPIE, v. 2045, 1993, pp. 91-98
• [430] Sokołowski W.: Diagnostik des laserinduzierten Plasmas beim Schweissen mit CO2 - Lasem, RWTH Aachen, 1991 (Dissertation)
• [431] Song K.M., Seung G.K., Nam H., Lee H.T., Park S.S.: Laser weldability analysis of highspeed optical transmission device packaging, IEEE Trans. Comp., Pack., and Manufact. Technol.- B, vol. 19, No. 4, Nov. 1996
• [432] Soszek P.: Two novel additive processes to manufacture circuit boards: direct laser writing and direct electrostatic transfer and deposition, IEEE Trans. Comp. Hyb. Manufact. Technol., vol. 12, No.2,1989, pp. 267-272
• [433] Spark IJ.: The recovery of the electrical resistivity of nickel after plastic deformation, Acta Metallurgica, vol.15, (3), 1967, pp. 424-427
• [434] Stem G.: Absorptivity of cw CO2 , CO and YAG laser beams by diffrent metallic alloys, Proceed. ECLAT90, 1, (1990), p.25-35
• [435] Stritzker B.: Laser annealing and laser quenching: production of superconducting alloys, Proc of the NATO ASI, Martinus Nijhoff Publishers, 1986, pp.319-331
• [436] Subramanian R., Sircar S., Mazumder J.: Laser cladding of zirconium on magnesium for improved corrosion properties, J. Mater. Sci. vol. 26, 1991, pp.951-956
• [437] Sudhir G.S., Fujii H., Wong W.S., Kisielowski C., Newman N., Dieker C., LilientalWeber Z., Rubin M.D., Weber E.R.: Pulsed laser deposition of aluminium nitride and gallium nitride thin films, Applied Surface Science vol.127-129,1998, pp.471-476
• [438] Sugioka K., Toyoda K., Jyumonji M., Takai H.: Laser-induced surface doping of semiconductors, Proc. SPIE, vol. 2703, 1996, pp.478-489
• [439] Sum R., Lang H.P., Giintherodt H.-J.: Pulsed laser deposition and nanometer scale characterization of YBa2Cu3 0 7 . 5 thin films by scanning probe mathods, Applied Surface Science vol.86, (1-4) 1995, pp.140-143
• [440] Swenson E.J.: Laser processing in the microelectronic industry, Proc. of ICALEO'95, Laser Institute of America, pp. 1-5
• [441] Swihart J.C., Butler W.H., Stocks G.M., Nicholson D.M., Ward R.C.: First-principles calculation of residual electrical resistivity of random alloys, Phys. Review Letters, vol.57, no.9,1986, pp.1181-84
• [442] Talwar S., Verma G., Weiner K.H., Gelatos C.: Laser thermal processing for shallow junction and silicide formation, Proc. of SPIE vol. 3506,1998, pp. 74-81
• [443] Tenwick M.J., Davies H.A.: Enhanced strength in high conductivity copper alloys, Materials Science and Engineering 1988, A98, p.543-546
• [444] Ting C.H., Paunovic M.: Selective metal deposition for integrated circuit fabrication, J. Electrochem. Soc., Vol. 136, No.2, 1989, pp. 456-461
• [445] Tomlinson W.J., Bransden A.S.: Laser surface alloying grey iron with Cr, N1, Co, and Co-Cr coatings, Surface Engineering, vol. 6(4), 1990, pp.281-286
• [446] Toyoda K., Sugioka K., Takeuchi S.: High-contrast selective deposition of metal thin films and their properties as semiconductor contacts, Proc. SPIE, v. 2207, 1994, pp.34-41
• [447] Trzaska M.: Analiza zjawisk w procesie spiekania rezystancyjnego prętów wolframowych, Ofic. Wyd. Politechniki Warszawskiej, Prace Naukowe - Inżynieria Materiałowa z.2, 1995 (praca habilitacyjna)
• [448] Tsaur B.Y., Maenpaa M.: Characteristic of ion-induced supersaturated Au-Ni alloy films, J.Appl. Phys., vol.52 (3), 1981, pp.728-736
• [449] Tsaur B.Y., Mayer J.W.: Supersaturated metastable Ag-Ni solid solutions formed by ion beam mixing, Appl. Phys. Lett., vol.37 (4), 1980, pp.389-392
• [450] Tyler E.H., Clinton J.R., Luo H.L.: Electrical resistivity of metastable Ag-Ni alloys, Solid State Commun., vol.13, No.9,1973, pp.1409-1411
• [451] Uglov A.A., Sagdeninov O.G.: О rascetie plavlenija i zatwerdywania metalla pri impulsnom vozdiejstvi koncentrirowannych potokov energii, Fiz. i Chim. Obr. Mater., 5, 1991, pp.36-40
• [452] Uglov A.A., Smurov I.Yu., Tagirov K.I., Lashin A.M., Guskov A.G.: Termokapilamyj massoperenos pri laziemom legirovanii metallov, Fiz. i Chim. Obr. Mat., nr 6, 1988, 24- 29
• [453] Uray L.: Anisotropic electrical resistivity of grain boundaries in tungsten wires, J. Mater. Sci. Let., vol. 10, (1991), pp. 1409-1411
• [454] Valk В., Batting R., Anthamatren О.: Laser welding for fiber pigtailing with long-term stability and submicron accuracy, Opt. Eng., vol. 34, No. 9, 1995, pp. 2675-2682
• [455] Van Dijk M.H., Bant P., Vermij L.: Laser soldering of pigtails on fuses, Proc. SPIE, v. 1022, 1989, Bellingham, pp. 43-47
• [456] Van Ingen R.P., Fastenau R.H.J., Mittemeijer E.J.: Laser ablation deposition of Cu-Ni and Ag -Ni films: Nonconservation of alloy composition and film microstructure, J. Appl. Phys., vol.76, No.3, 1994, pp.1871-1883
• [457] Varotsos P., Eftaxis K.: High-temperature vacancy concentration in Cu, Phys. Rev.B, vol.40 (14), 1989, pp.9963-9964
• [458] Velicko O.A., Garascuk W.P., Moravski W.E.: Anwendung des Laser-ImpulsschweiBens zur Montage integrierter Schaltkreise auf Leiterplatten, Avtomaticeskaja Svarka, vol.25(8), 1972
• [459] Vest R.W.: A model for sheet resistivity of Ru02 thick film resistors, IEEE Trans, on Components Hybrids, and Manufacturing Technology, vol. 14, 2, 1991
• [460] Vijayalakshmi S., George M.A., Sturmann J., Grebel H.: Pulsed-laser deposition of Si nanoclusters, Applied Surface Science vol.127-129, (1-4) 1998, pp. 378-382
• [461] von Gutfeld R.J., Vigliotti D.R, Acosta R.E.: Copper exchange plating on palladium and its relation to circiuts repair, Appl. Phys. Lett. 59 (26), 1991, pp.3490-3492
• [462] von Gutfeld R.J., Vigliotti D.R.: High-speed electroplating of copper using the laser-jet technique, Appl. Phys. Lett. 46 (10), 1985, pp.1003-1005
• [463] von Gutfeld R.J., Vigliotti D.R: Laser-enhanced patterning using photothermal effects: maskless plating and etching, J. Opt. Soc Am. B: Opt. Phys., vol.4, (2), 1987, pp. 272-280
• [464] Vook F.L., Bimbaum H.K., Blewitt T.H.: Report to the American Physical Society by the study group on physics problems relating to energy technologies: Radiation effects on materials, Review of Modem Physics, vol. 47, Suppl.No.3, 1975
• [465] Walczak M., Pawlak R., Raczyński T.: A study on changes in mechanical properties of laser-doped metals - Proceedings of SPIE - (Laser Technology IV, ed. W. Woliński, Z. Jankiewicz), vol. 2202, 1994
• [466] Walczak M., Sęk J.: Modelling the dynamics of thermocapillary motion in a laser fusion - the utilization of the FIDAP pack, Proc.of SPIE, vol. 3187, 1997, pp.84-88
• [467] Wang K., Liu J., Han D.: Microstructure and properties of laser remelted cobalt based and nickel based plasma sprayed coatings, Surface Engineering, vol. 12, (3), 1996, pp.235-238
• [468] Wassick T.A.: Laser processes for repair of thin film wiring, SPIE Proceedings vol. 1598, Bellingham, 1991, pp.141-148
• [469] Watts B.R.: Calculation of electrical resistivity produced by dislocations in various metals, J. Phys. F: Metal Phys., vol 18, 1988, pp. 1197-1209
• [470] Watts B.R.: The contribution of long-range strain field of dislocations in metals to their electrical resistivity, J. Phys. F: Metal Phys., vol 18, 1988, pp. 1183-1195
• [471] Wehner M., Legewie F., Theisen B., Beyer E.: Direct writing of gold and cooper lines from solutions, Appl. Surf. Sci., 106, 1996, pp. 406-411
• [472] Wehner M., Pflüger S., Jansen F., Kruck T., Lupp F.: Deposition of gold on polyimide from solution, Appl. Surf. Sci., 86,1/4,1995, pp.504-508
• [473] Wei M.-K., Popp A., Lang A., Schutte K., Bergmann H.W.: Excimer-laser-assisted deposition of diamondlike carbon hard coatings, Proc.of SPIE vol.3097,1997, pp.486-498
• [474] Weinman L.S., Kim C , Tucker T.R., Metzbower E.A.: Characteristics of laser surface melted aluminium alloys, Appl.Optics vol. 17(6), 1978, pp.906-910
• [475] Weisheit, R. Galun, R. Haude: Laserrandschichtbehandlung von Aluminium- und Magnesiumwerkstoffen, Metali 6 (1994) 455-460
• [476] Wesling P.: TAB inner-lead bond process characterization for single-point laser bonding, IEEE Transactions on Comp. Pack.Manuf. Tech. Part A, v.17, March 1994,pp. 142-148
• [477] Wesner D. A., Mertin M., Lupp F., Kreutz E. W.: Cleaning of copper traces on circuit boards with excimer laser radiation, Applied Surface Science, 1996, pp.479-483
• [478] Westendorp J.F.M., Koelewijn W., van Sark W.G., Saric F.W., van der Pers N.M., Keijser Th.H.: Laser alloying of Cu and Cr, J. of Mater. Research, vol. 1(5), 1986, pp.652-660
• [479] Witherell C.E., Ramos T.J.: Laser brazing, Welding Res. Suppl., Oct. 1980, pp.267s-277s
• [480] Wójcicki M., Pryputniewicz R.: Laser microwelding of small diameter wire to a contact., Proc. of ICALEO'96, Laser Institute of America, pp. 84-93
• [481] Wolny A., Stokes A.D., Kacprzak В., High- voltage fuse behaviour with varistor commutation, IEE Proc.-Gener. Transm. Distrib., Vol. 141, No.l, Jan. 1994,pp.33-37
• [482] Xie J., Kar A., Rothenflue J.A., Latham W.P.: Temperature - dependent absorptivity and cutting capability of C 02, Nd:YAG and chemical oxygen-iodine lasers, J. of Laser Applications, 9, (1997), pp. 77-85
• [483] Xie J., Kar A.: Mathematic modeling of melting during laser materials processing, J.of Appl.Phys., vol.81(7), 1997, pp.3015-3022
• [484] Yao Y.D., Chen Y.Y., Tzeng S.J., Chuang T.H.: Electrical resistivity, magnetization, and grain boundary precipitates in Ni-Sn alloys, phys. stat. sol.(a)121,213,(1990), pp.213-218
• [485] Zeng K., Kivilahti J.K.: Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems, J. Electron. Mater., v.30, No.l, 2000, pp.35-44
• [486] Zhang J., Sugioka K., Wada S., Tashiro H., Toyoda K., Midorikawa K.: Precise microfabrication of wide band gap semiconductors (SiC and GaN) by VUV-UV multiwavelength laser ablation, Applied Surface Science vol. 127-129, 1998, pp.793-799
• [487] Zhang Z.J., Liu B.X.: Solid-state reaction to syntesize Ni-Mo metastable alloys, J.Appl. Phys., vol.76, No.6, 1994, pp.3351-3356
• [488] Zhong M., Liu W., Ren J., Yao K., Zhang W., Zhao H., Zhang H.: Experimental research on mechanism of cw laser glazing on Fe-C-Si-B alloy, Proc. of ICALEO’96 Sec.A, Laser Institute of America, 1996, pp.57-66
• [489] Ziegele H., Scheibe H.J., Schultrich B.: DLC and metalic nanometer multilayers deposited by laser-arc, Surface & Coatings Technology, vol. 97, 1-3,1997, pp.385-390
• [490] Ziman J.M.: A Theory of the Electrical Properties of Liquid Metals. I: The Monovalent Metals, Phil. Mag., (6), 1961, pp. 1013-1034
• [491] Zimnicki J., Wendler B., Pawlak R.: Laserowe utwardzanie powierzchni tytanu z wykorzystaniem syntezy TiC, Inżynieria Materiałowa, nr 6, 2000, s. 490-493
• [492] Zouari I., Lapicque F., Calvo M., Cabrera M.: Zinc electrodeposition assisted by a pulsed YAG laser beam: effects of hydrodynamic conditions, J. Electrochem.Soc., vol.139, No.8, (1992), pp.2163-2170
• [493] Zubchenko V.S., Kulish N.P., Petrenko P.V., Repetsky S.P.: Calculation of contribution of short-range order and static distortions to the residual electrical resistivity in Cu-Al alloys by the method of pseudopotentials, Ukr. Fiz. Żum., t.25, No.4, 1980, pp.541-545