Modeling and optimization of thermo-mechanical behavior of power semiconductor diodes

• Autorzy: Fedasyuk D. , Makar V.
• Języki publikacji: EN

Abstrakty

EN

Thermal stresses in microelectronics are produced by the mismatch between the thermo-mechanical properties of different components in devices. This paper presents a numerical model which allows to predict and optimize a thermo-mechanical behavior of power semiconductor devices at the earlier phase of the product development processes. It is very important to provide reliability, to reduce a number of expensive physical experiments and to obtain optimal design. As the demonstrator, an soldered power semiconductor diode has been considered to show the robustness and capability of the proposed approach for transient temperature and thermal stresses characterization.

Słowa kluczowe

EN

semiconductor diodes

PL

dioda półprzewodnikowa

• Wydawca: Katedra Mikroelektroniki i Technik Informatycznych Politechniki Łódzkiej
• Czasopismo: Mikroelektronika i Informatyka : prace naukowe
• Rocznik: 2004
• Tom: Z. nr 4
• Strony: 49--54
• Opis fizyczny: Bibliogr. 6 poz., wykr.

Twórcy

autor

Fedasyuk D.

• Lviv Polytechnic National University. Institute of Computer Science and Information Technologies. CAD Department, 12St. Bandera str., Lviv, Ukraine, 79013
• Department of microelectronics and information system, Technical University of Lodz, Poland

autor

Makar V.

• Department of microelectronics and information system, Technical University of Lodz, Poland

Bibliografia

• [1] Z. Khatir and S. Lefebvre, “Thermal analysis of high power IGBT modules”, IEEE International Symposium on Power Semiconductor Devices & ICs, pp.271-274, 2000.
• [2] G.Q. Zhang, J. Bisschop and P. Maessen, “Virtual Thermo- Mechanical Prototyping of Microelectronics Products-Towards Optimized Designing in Reliability”, Advancing Microelectronics, Vol. 28, № 1 , 2001.
• [3] C.E. Hanna, S. Michaelides, P. Palaniappan, D. Baldwin and S. Sitaraman, “Numerical and Experimental Study of the Evolution of Stresses in Flip Chip Assemblies During Assembly and Thermal Cycling”, Proceedings of the 49-th Electronic Components & Technology Conference, pp. 1001-1009, San Diego, CA, 1999.
• [4] Kovalenko A.D. Thermoelasticity. - Kiev: Vishcha Shcola, 1975 [in Russian].
• [5] Sobol I.M., Statnikov R.B. The choice of the optimal parameters in the problems with many criterions. - M.: Nauka, 1981.- 65 p.
• [6] Grigorenko V.P., Dermengy P.G., Kuzmin V.A., Mnatsakanov T.T. Simulation and added design of power semiconductor devices.-M.: Energoatomizdat, 1988,- 280 p.