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Projekt DENIDIA: program Marie Curie w celu uzyskanie doskonałości w zastosowaniach naukowych i przemysłowych przy wykorzystaniu tomografii procesowej dla bezinwazyjnych systemów diagnostycznych
Języki publikacji
Abstrakty
This paper summarizes the 4-year FP6 Marie Curie Transfer of Knowledge project, in terms of recruitment/secondment strategy, scientific organization and achievements related to tomography. Emphasis is placed on the interaction between different research areas that has been thought in order to increase the level of expertise of the Computer Engineering Department in the field of tomography, both concerning hardware and software applications.
W artykule przedstawiono podsumowanie Transferu Wiedzy dokonanego w ramach projektu Marie Curie ToK 6PR trwającego 4 lata. W okresie tym rekrutacja badaczy przyjeżdżających oraz oddelegowanie naukowców Katedry Informatyki Stosowanej do Zagranicznych Instytucji Partnerskich pozwoliło zwiększyć potencjał naukowy pracowników Katedry w zakresie tomografii procesowej. Nacisk na interdyscyplinarność badań naukowych prowadzonych w Katedrze, podniósł poziom wiedzy pracowników w Katedrze Informatyki Stosowanej w dziedzinie tomografii dotyczącej zarówno sprzętu, jak i oprogramowania.
Słowa kluczowe
Rocznik
Tom
Strony
45--53
Opis fizyczny
Bibliogr. 25 poz.
Twórcy
autor
autor
- Faculty of Electrical, Electronic, Computer and Control Engineering, Technical University of Łódź
Bibliografia
- [1] Grudzień K., Romanowski A., Williams R.A.: Application of a Bayesian approach to the tomographic analysis of hopper fow. Particle and Particle System Characteriaztion. Vol. 22, No. 4, 2006, pp. 246-253.
- [2] Loser T., Wajman R., Mewes D.: Electrical capacitance tomography: Image reconstruction along electrical field lines. Measurement Science and Technology. Vol. 12, No. 8, 2001, pp. 1083-1091.
- [3] Mosorov V. : A method of transit time measurement using twin-plane electrical tomography. Measurement Science and Technology. Vol. 17, No. 4, 2006, pp. 753-760.
- [4] Mosorov V., Sankowski D., Mazurkiewicz L., Dyakowski T.: The 'best-correlated pixels' method for solid mass flow measurements using electrical capacitance tomography. Measurement Science and Technology. Vol. 13, No. 12, 2002, pp. 1810-1814.
- [5] Wajman R., Banasiak R., Mazurkiewicz L., Dyakowski T., Sankowski D.: Spatial imaging with 3D capacitance measurements. Measurement Science and Technology. Vol. 17, No. 8, 2006, pp. 2113-2118.;
- [6] Tan K., Babout L., Janaszewski M.: Public engagement in science -Education through the use of 3D technology applied in tomography. Elektryka. Vol. 1078, No. 121, 2010.
- [7] Wajman R., Nowakowski J., Styra D.: Improvement of electrical capacitance tomograph hardware. Elektryka. Vol. 1078, No. 121, 2010.
- [8] Brandisky K., Sankowski D., Banasiak R.: Optimization of ECT Sensor Using Genetic Algorithm. Elektryka. Vol. 1078, No. 121, 2010.
- [9] He Y. B., Wajman R., Banasiak R., Xu M., Sankowski D.: Design of TCP/IP Based Flexible Three Dimensional Electrical Capacitance Tomography. Proc. 3rd International Workshop on Process Tomography (IWPT-3). Tokyo, Japan, 2009.
- [10] Sankowski D., Nowakowski J., Hammer E., Babout L., Banasiak R., Chaniecki Z., Grudzien K., Janaszewski M., Mosorow W., Romanowski A., Wajman R.: A method and a device for measuring component fractions in a multi-phase flow. 2010, No. EP10461526.5.
- [11] Styra D., Babout L., Sankowski D.: Stray Capacitance Compensation for Non - Stray immune ECT systems. Proc. 6th World Congress On Industrial Process Tomography (WCIPT6). Beijing, China, 2010, p. 826.
- [12] Liu Z., Babout L., Banasiak B., Sankowski D.: Design of a new sensor to improve accuracy of ECT images. Elektryka. Vol. 214, 2009, pp. 93-97.
- [13] Liu Z., Babout L., Banasiak R., Sankowski D.: Effectiveness of Rotatable Sensor to Improve Image Accuracy of ECT System. Flow Measurement and Instrumentation. Vol. 21, No. 3, 2010, pp. 219-227.
- [14] Babout L., Banasiak R., Liu Z., Wajman R.: Feasibility study of dense phase flow using rotatable ECT sensor. Proc. 6th World Congress On Industrial Process Tomography (WCIPT6). Beijing, China, 2010, p. 834.
- [15] Banasiak R., Wajman R., Sankowski D., Soleimani M.: Three-dimensional nonlinear inversion of electrical capacitance tomography data using a complete sensor model. Progress in Electromagnetics Research. Vol.100, 2010, pp.219-234.
- [16] Banasiak R., Soleimani M.: Shape based reconstruction of experimentaldata in 3D electrical capacitance tomography. NDT and E International. Vol. 43, No. 3, 2010, pp. 241-249.
- [17] Banasiak R., Wajman R., Soleimani M. : An efficient nodal Jacobian method for 3D electrical capacitance tomography image reconstruction. Insight: Non-Destructive Testing and Condition Monitoring. Vol. 51, No. 1, 2009, pp. 36-38.
- [18] Banasiak R., Wajman R., Betiuk J., Soleimani M.: Feasibility study of dielectric permittivity inspection using a 3D capacitance CT method. NDT and E International. Vol. 42, No. 4, 2009, pp. 316-322.
- [19] Soleimani M., Mitchell C. N., Banasiak R., Wajman R., Adler A.: Four-Dimensional electrical capacitance tomography imaging using experimental data. Progress in Electromagnetics Research. Vol. 90, 2009, pp. 171-186.
- [20] Grudzień K., Romanowski A., Chaniecki Z., Niedostatkiewicz M., Sankowski D.: Description of the silo flow and bulk solid pulsation detection using ECT. Flow Measurement and Instrumentation. Vol. 21, No. 3, 2010, pp. 198-206.
- [21] Grudzień K., Niedostatkiewicz M., Adrien J., Maire E., Sankowski D.: Quantitative description of the bulk solid concentration changes based on X-ray continuous radiation. Proc. World Congress on Industrial Process Tomography (WCIPT6). Beijing, China, 2010.
- [22] Janaszewski M., Couprie M., Babout L.: Hole filling in 3D volumetric objects. Pattern Recognition. Vol. 43, No. 10, 2010, pp. 3548-3559.
- [23] Janaszewski M., Couprie M., Babout L.: Geometric Approach to Hole Segmentation and Hole Closing in 3D Volumetric Objects. Proc. 14th Iberoamerican Congress on Pattern Recognition. Guadalajara, Mexico, 2009, p. 245.
- [24] Babout L., Janaszewski M., Bakavos D., McDonald S. A., Prangnell P.B., Marrow T.J., Withers P.J.: 3D inspection of fabrication and degradation processes from X-ray (micro) tomography images using a hole closing algorithm. Proc. IEEE International Conference on Imaging Systems and Techniques (1ST). Thessaloniki, Greece, 2010, p. 337.
- [25] Kornev A., Babout L., Janaszewski M., Talbot H.: Outer Surface Reconstruction for 3D Fractured Objects. Proc. International Conference on Computer Vision and Graphics (ICCVG 2010). Warsaw, Poland, 2010, p. 57.
Typ dokumentu
Bibliografia
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bwmeta1.element.baztech-article-LOD1-0029-0032