Temperature field in tho-layer fins immersed in boiling water

• Autorzy: Pastuszko R.
• Języki publikacji: EN

Abstrakty

EN

The steady, two-dimensional temperature field for a two-layer fin, composed of copper core and porous covering, filled with boiling water was calculated. Simplified one-dimensional model was also presented. Fin parameters were: height - 10 mm, thickness - 3 mm, porosity - 60%, capillary-porous structure (CPS) layer thickness - 0.6 mm. The modified finite difference method was described. The heat transfer coefficient was assumed to vary with a power-law-type formula. Temperature distribution in the fin vertical section was determined experimentally with a thermovision camera. A reasonable degree of congruence was found to exist between the theoretical and the experimental results.

Słowa kluczowe

EN

two-layer fins; porous structure; nucleate boiling

• Wydawca: Wydawnictwo Instytutu Maszyn Przepływowych PAN
• Czasopismo: Transactions of the Institute of Fluid-Flow Machinery
• Rocznik: 2003
• Tom: nr 112
• Strony: 103--118
• Opis fizyczny: Bibliogr. 6 poz., rys., tab.

Twórcy

autor

Pastuszko R.

• Kielce University of Technilogy, Chair of Thermodynamics and Fluid Mechanics, Kielce, Poland,

Bibliografia

• [1] Pastuszko R.: Analysis of Boiling Heat Transfer on Finned Surfaces with Capillary-Porous Couering,Ph,D. thesis, Kielce Univ. of Technology, 1999. (in Polish)
• [2] Kern D. Q., Kraus A. D.: Ertended Surface Heat Transfer McGraw-Hill 1972.
• [3] Sunden B. and Heggs P. J. (Eds.):, Recent Aduances in Analysis of Heat Transfer for Fin Type Surfaces, WIT Press, 2000.
• [4] Chung B. T. F., Iyer J. R.: Optimum design of longitudinal rectangular fine and cylindrical spines with variable heat transfer cofficient, Heat Transfer Engineering, Vol. 14(1993), 3L-42.
• [5] Liaw S. P., Yeh R. H., Fins with Temperature Dependent Surface Heat Fluz- I Single Heat Transfer Mode,Int. J. Heat Mass Transfer, Vol. 37(1994)-1509-1515.
• [6] Ketkar S. P.: Numerical Thermal Analysis, ASME Press, New York 1999.