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Tytuł artykułu

Influence of electrolyte on a composition and size of copper compound particles

Wybrane pełne teksty z tego czasopisma
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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Purpose: The aim of this paper was to investigate an effect of the applied electrolyte on a composition and morphology of synthesised particles, which consist of copper compounds. Design/methodology/approach: We present electrochemical investigations of copper in organic solutions of LiClO4 and LiCl, which are unhydrous or contained 3% of water. The SEM with EDX investigations determined morphology and composition as well as estimated a size of the obtained copper-salts or copper oxide particles. Findings: A type of anion and an addition of a very small quantity of water have a substantial influence on a composition and morphology of the anodic dissolution products. In unhydrous solution and in solution containing LiClO4 copper-salts were obtained. In alcohol solution of LiCl containing 3% of water copper oxide particles were obtained. Research limitations/implications: In some cases the chemical composition of the produced nanoparticles could not have been determined because of fast decomposition of the product. In the future, it is plannned to analyse an effect of the potential on a synthesis. Practical implications: Synthesis of various nanoparticles is presented in the paper, what may have practical applications. Originality/value: The paper proposes a new electrochemical method, which leads to a synthesis of copper oxide particles.
Rocznik
Strony
609--612
Opis fizyczny
Bibliogr. 15 poz., il., wykr.
Twórcy
autor
autor
autor
  • Department of Chemistry and Metal Corrosion, AGH-University of Science and Technology, ul. Reymonta 23, 30-059 Kraków, Poland, mariast@agh.edu.pl
Bibliografia
  • [1] S. Magaino, Corrosion rate of copper rotating-disc-electrode in simulated acid rain, Electrochimica Acta 42 (1997) 377-382.
  • [2] Y. Feng, W. K. Teo, K. S. Siow, K. L. Tan, A. K. Hsieh, The corrosion behaviour of copper in neutral tap water. Part I: Corrosion mechanisms, Corrosion Science 38 (1996) 369-385.
  • [3] Y. Feng, W. K. Teo, K. S. Siow, A. K. Hsieh, The corrosion behaviour of copper in neutral tap water. Part II: Determination of corrosion rates, Corrosion Science 38 (1996) 387-395.
  • [4] A. G. Brolo, M. L. A. Temperini, S. M. L. Agostinho, Copper dissolution in bromide medium in the absence and presence of hexamethylenetetramine (HMTA), Electrochimica Acta 44 (1998) 559-571.
  • [5] J. Klunker, W. Schäfer, Anodic behavior of copper in acetonitrile: the influence of carbon dioxide and dimethylamine, Journal of Electroanalytical Chemistry 466 (1999) 107-116.
  • [6] A. P. Purdy, D. Godbey, L. Buckley, The dissolution of copper in common solvents used for low dielectric polymers, Thin Solid Films 308-309 (1997) 486-489.
  • [7] T. R. L. C. Paixao, D. Corbo, M. Bertotti, Amperometric determination of ethanol in beverages at copper electrodes in alkaline medium, Analytica Chimica Acta 472 (2002) 123-131.
  • [8] B. Stypuła, J. Banaś, M. Starowicz, H. Krawiec, A. Bernasik, A. Janas, Production of nanoparticles of copper compounds by anodic dissolution of copper in organic solvents, Journal of Applied Electrochemistry 36 (2006) 1407-1414.
  • [9] J. P. Stobrawa, Z. M. Rdzawski, Dispersion-strengthened nanocrystalline copper, Journal of Achievements in Materials and Manufacturing Engineering 24/2 (2007) 35-42.
  • [10] J. P. Stobrawa, Z. M. Rdzawski, W. J. Głuchowski, Microstructure and properties of nanocrystalline copper-yttria microcomposites, Journal of Achievements in Materials and Manufacturing Engineering 24/2 (2007) 83-86.
  • [11] B. Ziębowicz, D. Szewiczek, L. A. Dobrzański, Manufacturing technology of the composite materials: nanocrystalline material-polymer type, Journal of Achievements in Materials and Manufacturing Engineering, 14 (2006) 37-42.
  • [12] M. Greger, R. Kocich, L. Čížek, L. A. Dobrzański, M. Widomska, B. Kuřetowá, A. Silbernagel, The structure and properties of chosen metals after ECAP, Journal of Achievements in Materials and Manufacturing Engineering, 18 (2006) 103-106.
  • [13] B. Ziębowicz, L. A. Dobrzański, Application of nanostructural materials in manufacturing of soft magnetic composite materials Fe73.5Cu1Nb3Si13.5B9-PEHD type, Journal of Achievements in Materials and Manufacturing Engineering 24 (2007) 91-94.
  • [14] S. A. Vorobyova, A. I. Lesnikovich, V. V. Muchinskii, Interphase synthesis and some characteristics of stable colloidal solution of CuO in octane, Colloids and Surfaces A: Physicochemical and Engineering Aspects, 150 (1999) 297-300.
  • [15] M. Aslam, G. Gopakumar, T. L. Shoba, I. S. Mulla, K. Vijayamohanan, S. K. Kulkarni, J. Urban, W. Vogel, Formation of Cu and Cu2O Nanoparticles by Variation of the Surface Ligand: Preparation, Structure, and Insulatingto-Metallic Transition, Journal of Colloid and Interface Science 255 (2002) 79-90.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BWAN-0002-0008
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