Simple signal path technique for matching circuit in packaged semiconductor diode laser

• Autorzy: Han J. H.
• Języki publikacji: EN

Abstrakty

EN

Improvement in frequency bandwidth of a packaged diode laser is investigated by the circuit impedance matching. To overcome the structural limitation of the electronic package for high frequencies, employing conventional lumped element impedance matching technique in conjunction with the manipulation of signal path of the package connections showed significant enhancement for 3-dB bandwidth to more than 6 GHz.

Słowa kluczowe

EN

bandwidth; frequency response; circuit modeling; diode laser; device packaging

• Wydawca: Stowarzyszenie Elektryków Polskich ; Polska Akademia Nauk ; Wojskowa Akademia Techniczna im. Jarosława Dąbrowskiego
• Czasopismo: Opto-Electronics Review
• Rocznik: 2008
• Tom: Vol. 16, No. 2
• Strony: 185--188
• Opis fizyczny: Bibliogr. 9 poz., rys.

Twórcy

autor

Han J. H.

• Department of Electrical and Computer Engineering, Johns Hopkins University, 105 Barton Hall, 3400 N. Charles, St. Baltimore, MD 21218, USA,

Bibliografia

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