Electronic package characterisation using thermal structure functions

• Autorzy: Banaszczyk J. , Janicki M. , Vermeersch B. , De Mey G. , Napieralski A.
• Języki publikacji: EN

Abstrakty

EN

This paper presents an overview of advanced thermal analysis methods. The measured heating or cooling curves allow the derivation of time constant spectra, structure functions and complex thermal impedances. These characteristics contain a lot of information on the device, and can be used to investigate the internal structure of the electronic package. The entire methodology is illustrated based on the example of two silicon carbide power diodes. These diodes provided by different manufacturers have the same ratings and package type but one of the diodes exhibits oscillatory behaviour when used in a power converter. The presented results of thermal tests and analyses confirmed that there exist between the two devices important differences in their internal structures, possibly indicating the presence of some imperfections in the die attach or the wire bonds.

Słowa kluczowe

EN

thermal structure functions; electronic package properties; network identification by deconvolution; thermal impendance

PL

budowa funkcji termicznych; właściwości elektronicznej obudowy; identyfikacja sieci

• Wydawca: Polish Academy of Sciences, Committee of Electronics and Telecommunication
• Czasopismo: Electronics and Telecommunications Quarterly
• Rocznik: 2007
• Tom: Vol. 53, No 4
• Strony: 389--398
• Opis fizyczny: Bibliogr. 8 poz., wykr.

Twórcy

autor

Banaszczyk J.

autor

Janicki M.

autor

Vermeersch B.

autor

De Mey G.

autor

Napieralski A.

• Department of Electronics and Information Systems, University of Ghent, Saint Pietersnieuwstraat 41, 9000 Ghent, Belgium

Bibliografia

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• 2. V. Szekely: On representation of infinite-length distributed RC one-ports. IEEE Trans. on Circuits and Systems 1991, vol. 38, pp. 711-719.
• 3. M. Rencz, V. Szekely, A. Poppe, G. Farkas, B. Courtois: New methods and supporting tools for the thermal transient testing of packages. Intl. Conference on Advances in Packaging APACK (Singapore). Dec. 2001, pp 407-411.
• 4. P. Kawka: Thermal impedance measurements and dynamic modelling of electronic packages. PhD Thesis, Universiteit Gent, Ghent, Belgium, 2005.
• 5. J. Banaszczyk: Thermal impedance measurements of electronic packages. MSc Thesis, Politechnika Lodzka, Lodz, Poland, 2006.
• 6. B. Vermeersch, G. De Mey: Thermal impedance plot of microscaled devices. Microelectronics Reliability 2006, vol. 46, pp. 174-177.
• 7. F. N. Masana: Correction to thermal impedance measurements under non-equilibrium conditions. XIV Int. Conference on Mixed Design of Integrated Circuits and Systems MIXDES (Poland). Jun. 2007, pp 369-374.
• 8. P. Szabo, O. Steffens, M. Lenz, G. Farkas: Transient junction-to-case thermal resistance: measurement methodology of high accuracy and high repeatability. IEEE Trans. Components and Packaging Technologies 2005, vol. 28, no. 4, pp. 630-636.