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Materiały grubowarstwowe dla technologii hybrydowych : stan obecny i perspektywy rozwoju

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Warianty tytułu
EN
Thick film materials for hybrid microelectronics : state of art and prospects
Języki publikacji
PL
Abstrakty
PL
Przedstawiono przegląd materiałów grubowarstwowych oraz ich zastosowań w mikroelektronice hybrydowej. Na tym tle pokazano najnowsze osiągnięcia w opracowywaniu technologii materiałów grubowarstwowych w Instytucie Technologii Materiałów Elektronicznych. Omówiono również kierunki rozwoju i czynniki stymulujące postęp w dziedzinie materiałów grubowarstwowych.
EN
An overview of thick film materials and their applications have been presented. The newest achievements of technology of elaborated thick film pastes in Institute of Electronic Materials technology have been shown. Also factors stimulating developments of thick film materials have been discussed.
Rocznik
Strony
11--16
Opis fizyczny
Bibliogr. 47 poz., il., tab.
Twórcy
  • Instytut Technologii Materiałów Elektronicznych, Warszawa
Bibliografia
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  • [3] Tededinnik M., Malanga D., Sabo C: Extending Gold Thick Film Technology trough. Material and Process Development, Proc. of 33 rd Int. Symp. on Microel., Boston 2000, Sept. 20-22, pp. 340-345.
  • [4] Chai L: New Wire Bondable Gold Thick Film Conductors, for LTCC Applications. Proc. of 33 rd Int. Symp. On Microel., Boston 2000, Sept. 20-22, pp. 702-705.
  • [5] Lopez C, et al.: Wire Bonding of Gold Conductors for LTCC Applications. Proc. of 2002 Int. Symp. On Microelectronics, Denver Sept. 4-6, 2002, pp. 21-26
  • [6] Shen-Li Fu, Chi-Shiung Hsi.: Characterisation of Ruthenia Resistors Embeded In Low Temperature Co-fired Ceramic Substartes. Proc. Proc. of 34rd Int. Symp. on Microel., Baltimore 2001, Oct. 9-11, ss. 190-194.
  • [7] Ching-Jui Ting, et al.: Interactions between Ruthenia-based Resistors and Cordierite-Glass In Low Temperature Co-fired Ceramics. J. Am. Ceram. Soc., vol. 83, no 12, Dec. 2000, pp. 2945-2953.
  • [8] Pin Yang, et al.: Processing, Microstructure and Electrical Properties of Buried resistors in Low Temperature Co-fired Ceramics. J. Applied Physics, vol.89, no 7, April 2001, pp. 4175-41-42.
  • [9] Corbett S., Strole J., Johnston K., Swenson E., Lu W.: Direct-Write Laser Exposure of Photosensitive Conductive Inks Using Shaped-Beam Optics. International Journal of Applied Ceramic Technology 2 (5), 390-400.
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  • [11] Jakubowska M., et al.: Światłoczułe pasty srebrowe dp mikroukładów grubowarstwowych o podwyższonej gęstości upakowania, Materiały KKE, Darłówko 11-13 czerwca 2007, ss. 321-326.
  • [12] Jakubowska M, et al.: Stabilność bezołowiowych połączeń lutowanych w grubowarstwowych układach hybrydowych. Materiały z Krajowej Konferencji Elektroniki, Darłówko, 12-14 czerwca, 2006, ss. 234-239.
  • [13] Źródło Johnson Matthey Base Prices, http://www.platinum.mat-they.com/prices/index.php
  • [14] Johnson, R.W., Evans, J.L. Jacobsen, P., Thompson, J.R., Chris-topher, M.: The changing automotive environment: high-temper-ature electronics, Electronics Packaging Manufacturing, IEEE Transactions on, vol. 27, pp. 164-176.
  • [15] Hormadaly J.: Cadmium-free and lead-free thick film conductor composition. US Patent 5439852, Aug 8, 1995.
  • [16] Wang Y., Ollivier P.: Thick film conductor paste compositions for LTCC tape European Patent EP1534053.
  • [17] Belavic D., et al.: An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology, a Case Study. Electronics Systemintegration Technology Conference, 2006. 1st, vol. 2, pp. 690-695.
  • [18] Kinzel E. C., et al.: Laser sintering of thick-film conductors for microelectronic applications, J. Appl. Phys. 101, 063106 (2007)
  • [19] Jakubowska M., et al.: Lead-Free Solder Joint In Microelectronic Thick Film Technology. Archieves of Metallurgy and Materials, vol. 51, 2006, issue 3 str. 407-412.
  • [20] Jakubowska M., Kiełbasiński K., Kalenik J., Kisiel R.: Mechanical strength of lead-free solder joints in thick film hybrid circuits. XXX International Conference of International Microelectronics and Packaging Society, Poland Chapter, Kraków, 24-27 September 2006, pp. 229-233.
  • [21] Młożniak A., Jakubowska M., Kiełbasiński K., Zwierkowska E.: Nowa generacja past rezystywnych nie zawierających ołowiu i kadmu spełniających dyrektywę RoHS. Materiały Elektroniczne, nr 4, 2006, ss. 5-18.
  • [22] Kiełbasiński K., Młożniak A., Jakubowska M.: The influence of contacs for lead free resistors. Proc. of 31 st International IM-APS Conference, Krasiczyn, Poland Chapter, 23-26 Sept. 2007, w druku.
  • [23] Hormadaly J.: New Lead-Free Thick Film Resistor. Proc. of 35th International Symposium on Microelectronics, Denver, September 4-6, 2002, pp. 543-545.
  • [24] Fukaya M, Nishigaki S., Higouchi C.: High Reliable and Lead (Pb) Free Thick Film Resistor Paste System for low Thermal Expansion LTCC Application. Proc. of 30 International Symposium on Microelectronics, Philadelphia, October 14-16, 1997, pp. 65-71.
  • [25] Fukaya M., Higouchi C.: Pb-Free Resistor for Pb-Free LTCC System. Proc. of 33rd International Symposium on Microelectronics, Boston, Sept. 20-22, 2000, p. 636-641
  • [26] Jiang J. C., Crosbie G. M., Tian W., Cameron K. K., Pan X. Q.: Transmission electron microscopy structure and platinum-like temperature coefficient of resistance in a ruthenate-based thick film resistor with copper oxide, Journal of Applied Physics - July 15, 2000 - vol. 88, Issue 2, pp. 1124-1128
  • [27] Shen-Li Fu, Chi-Schiung Hsi, Chun-Yueh Kang: Wei-Hao Chin Influences of Additives on the electrical Properties of Lead-free Thick Film Resistors. Proc. of 29m International Conference of IMAPS Poland Chapter, Koszalin-Darłówko, 19-21 Sept. 2005, pp. 19-24.
  • [28] Hormadaly J.: Cadmium-free and lead-free thick film paste composition, U.S. Patent 5,491,118 February 13, 1996.
  • [29] Rane S., Prudenziati M., Morten B.: Enviroment friendly perovskite ruthenate based thick film resistors, Material Letters 61 (2007), p. 595-599.
  • [30] Rane S., Prudenziati M., Morten B., Golonka L., Dziedzic A.: Structural and electrical properties of perovskite ruthenate-based lead-free thick film resistors on alumina and LTCC. Journal of Materials Science: Materials in Electronics 16 (2005), 687-691.
  • [31] Kshirsagar A., Rane S., Mulik U., Amalnerkar D.: Microstructure and electrical performance of eco-friendly thick film resistor compositions fired at different firing conditions. Materials Chemistry and Physics 101 (2007), pp. 492-498.
  • [32] Rane S., Prudenziati M., Morten B.: CaRuO3-based "Green" Thick Film Resistors. Journal of Active and Passive Electronic Devices, vol. 1, pp. 123-135.
  • [33] Busana M. G., Prudenziati M., Hormadaly J.: Microstructure development and electrical properties of RuO2-based lead-free thick film resistors. Journal of Materials Science: Materials in Electronics, (2006) 17: 951-962.
  • [34] Tanaka H., Igarashi K.: Resistor paste, resistor, and electronic device, US Patent 7,282,163, October 16, 2007
  • [35] Tanaka H., Igarashi K.: Thick-film resistor paste and thick-film resistor. EP1632961 A1, 08.03.2006, Bulletin 2006/10.
  • [36] Tanaka H., Igarashi K.: Glass composition for thick film resistor paste, thick film resistor paste, thick-film resistor, and electronic device. EP1632958A1, 08,03,2006 Bulletin 2006/10.
  • [37] Tanaka H., Igarashi K.: Thick film resistor, manufacturing method thereof, glass composition for thick film resistor and thick film resistor paste. EP1693858A1, 23,08,2006 Bulletin 2006/34.
  • [38] Tanaka H., Igarashi K.: Resistor paste, resistor, and electronic component. EP1647998A1, 19,04,2006, Bulletin 2006/16.
  • [39] www.ferro.com
  • [40] www.heraeus-th.com
  • [41] www.electroscience.com
  • [42] Dziurdzia B., Jakubowska M.: Photoimageabie Thick-Films in Microwaves. Advancing Microelectronics, vol. 29, no 2, March/April 2002, pp. 44-47.
  • [43] Dziurdzia B., Jakubowska M.: Nowoczesne techniki grubowarstwowe: Fotoformowanie warstw grubych. Elektronika, no 1, 2003, ss. 23-28.
  • [44] Rao I. C., et al.: Lead-free photoimageabie silver conductor paste formulation for high density electronic packaging. Materials Science and Engineering B 132 (2006) 215-221.
  • [45] Supriya A. Ketkar, et al.: Glass frit content—Property co-relation in thick films of photoimageabie silver conductor paste. Materials Science and Engineering B 132 (2006) 197-203.
  • [46] Ketkar S. A., et al.: Effect of glass content variation on properties of photoimageabie silver conductor paste. Materials Chemistry and Physics 96 (2006) 145-153.
  • [47] Jakubowska M., et al.: Proc. of31st International IMAPSConference. Krasiczyn, Poland Chapter, 23-26 Sept. 2007, w druku.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BWAH-0006-0001
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