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Light induced silver and copper plating on silver screen-printed contacts of silicon solar cells

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EN
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EN
In this paper we present the results of solar cell’s screen printed contacts thickening by light induced plating (LIP) of Cu and Ag. Light-induced and light-assisted plating techniques are compared. Plating bath current versus illumination intensity, the potentials of metallic anode, front and back surfaces of the solar cell were measured and analyzed for all possible plating modes. The current-voltage behaviour of cells under illumination in a plating bath for the cases of electrically insulated and non-insulated back-surface of a cell is analyzed and discussed. Finally, the exact values of current/voltage/illumination intensity for optimal depositions and a general recipe for their determination for different plating materials are given. The quality of deposited layers, state of contact-line and anti-reflective coating surface were controlled after plating by cross-section and planar-view SEM observations. The electrical properties of plated contacts and their effect on overall efficiency of solar cell were investigated by measuring contact-line resistance and dark- and light I-V solar cell measurements. The absence of short-circuits was verified by imaging with an infra-red camera.
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Bibliografia
  • [1] A. Mette, C. Schetter, D. Wissen, S. Lust, S.W. Glunz, and G. Willeke, “Increasing the efficiency of screen-printed silicon solar cells by light-induced silver plating”, Proc. 12th Eur. Photovoltaic Solar Energy Conf., 1056-1059 (2006).
  • [2] L.F. Durkee, “Method of plating by means of light”, US Patent No 4144139, Solarex Corporation, USA, 1979.
  • [3] L.A. Grenon, “Electroplating method”, US Patent No 4251327, Motorola, USA, 1980.
  • [4] G.R. Allardyce, K. Bass, and J. Rasch, “Light assisted electro plating process”, European Patent Application EP 1865563 A2, Rohm and Haas Electronic Materials, USA, 2007.
  • [5] C. Boulord, A. Kaminski, B. Canut, S. Cardinal, and M. Lemiti, “Electrical and structural characterization of electroless nickel-phosphorus contacts for silicon solar cell metallization”, J. Electrochem. Soc. 157, H742-H745 (2010)
  • [6] C. Boulord, A. Kaminski, Y. Veschetti, and M. Lemiti, “Comparison of different electrochemical deposits for contact metallization of silicon solar cells”, Mater. Sci. Eng. B165, 53–56 (2009).
  • [7] A. Mette, “New concepts for the front side metallization of industrial silicon solar cells”, PhD Dissertation, Albert-Ludwigs-Universitat, Freiburg, 2007.
  • [8] J. Bartsch, V. Radtke, C. Schetter, and S.W. Glunz, “Electrochemical methods to analyse the light-induced plating process”, J. Appl. Electrochem. 40, 757-765 (2010).
  • [9] A.J. Bard, R. Parsons, and R.J. Jordan, Standard Potentials in Aqueous Solutions, CRC Press, New York, 1985.
  • [10] P. Atkins, Physical Chemistry, 6th ed., W.H. Freeman and Company, New York, 2007.
  • [11] P. Vanysek, “Electrochemical series”, in Handbook of Chemistry and Physics, 88th edition, p. 5.72, 2007.
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Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BWAD-0022-0027
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