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Tytuł artykułu

Liquid crystalline polymer networks based on a nematic epoxy resin with azoxy group

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Języki publikacji
EN
Abstrakty
EN
The paper presents research results on curing two recently synthesized liquid crystalline epoxy materials with selected amines. The process of cross-linking, the final product of curing, and the pure monomers were examined using polarizing optical microscopy (POM), differential scanning calorimetry (DSC), and dielectric spectroscopy (DS). Chemical structure of the products was confirmed using spectroscopic methods. The authors attempted to demonstrate how selection of curing conditions (such as the amine used as curing agent, the curing temperature or preparation of the surface in contact with the sample) influences optical properties of the cured product.
Słowa kluczowe
Twórcy
autor
autor
autor
  • Institute of Physics, Technical University of Łódź, 219 Wólczyńska Str., 90-924 Łódź, Poland, magdaw@p.lodz.pl
Bibliografia
  • [1] A. M. Donald and A. H. Windle, Liquid Crystalline Polymers, University Press, Cambridge, 1992.
  • [2] D. Ribera, A. Serra, and A. Mantecón: Dimeric liquid-crystalline epoxyimine monomers: influence of dipolar moments on mesomorphic behaviour and the formation of liquid-crystalline thermosets. J. Polym. Sci. Pol. Chem. 41, 1465-1477, 2003.
  • [3] P. Castell, A. Serra, and M. Galiŕ: New liquid-crystalline thermosets from liquid-crystalline bisazomethynic epoxy resins with naphthylene disruptors in the central core. J. Polym. Sci. Pol. Chem. 41, 1536-1544, 2003.
  • [4] M. Akatsuka and Y. Takezawa: Study of high thermal conductive epoxy resins containing controlled high-order structures. J. Appl. Polym. Sci. 89, 2464-2467, 2003.
  • [5] D. Ribera, A. Serra, and A. Mantecón: Liquid-crystalline thermosets by the curing of dimeric liquid-crystalline epoxyimine monomers with 2,4-toluene diisocyanate. J. Polym. Sci. Pol. Chem. 41, 2521-2530, 2003.
  • [6] P. Castell, A. Serra, M. Galiŕ, M. Giamberini, and C. Carfagna: Anisotropic thermosets from liquid-crystalline azomethynic epoxy resins and primary aromatic diamines. J. Polym. Sci. Pol. Chem. 41, 1-12, 2003.
  • [7] M. Harada, N. Akamatsu, M. Ochi, and M. Tobita: Investigation of the fracture mechanism properties of liquid-crystalline epoxy networks arranged by a magnetic field. J. Polym. Sci. Pol. Phys. 44, 1406-1412, 2006.
  • [8] M. Harada, M. Ochi, M. Tobita, T. Kimura, T. Ishigaki, N. Shimoyama, and H. Aoki: Thermomechanical properties of liquid-crystalline epoxy networks arranged by a magnetic field. J. Polym. Sci. Pol. Phys. 42, 758-765, 2004.
  • [9] M. Harada, K. Sumitomo, Y. Nishimoto, and M. Ochi: Relationship between fracture toughness and domain size of liquid-crystalline epoxy resin having the polydomain structure. J. Polym. Sci. Pol. Phys. 47, 156-165, 2009.
  • [10] M. Harada, M. Ochi, M. Tobita, T. Kimura, T. Ishigaki, N. Shimoyama, and H. Aoki: Thermal-conductivity properties of liquid-crystalline epoxy resin cured under a magnetic field. J. Polym. Sci. Pol. Phys. 41, 1739-1743, 2003.
  • [11] D. Ribera, A. Mantecón, and A. Serra: Liquid crystalline thermosets from dimeric LC epoxy resins cured with primary and tertiary amines. Macromol. Symp. 199, 267-276, 2003.
  • [12] M. Ochi, D. Hori, Y. Watanabe, H. Takashima, and M. Harada: Bonding properties of epoxy resins containing two mesogenic groups. J. Appl. Polym. Sci. 92, 3721-3729, 2004.
  • [13] W. G. Kim, and J. Y. Lee: Cure properties of methacrylate-type prepolymer that include cyclohexane moiety. J. Appl. Polym. Sci. 92, 43-52, 2004.
  • [14] B. Mossety-Leszczak, M. Włodarska, H. Galina, and G. W. Bąk: Comparing liquid crystalline properties of two epoxy compounds based on the same azoxy group. Mol. Cryst. Liq. Cryst. 490, 52-66, 2008.
  • [15] P. Vanoppen, P. C. M. Grim, M. Rücker, S. de Feyter, G. Moessner, S. Valiyaveettil, K. Müllen, and F.C. de Schryver: Solvent codeposition and cis-trans izomerization of isophthalic acid derivatives studied by STM. J. Phys. Chem. 100, 19636-19641, 1996.
  • [16] S. D. Senturia and N. F. Sheppard: Dielectric analysis of thermoset cure. Adv. Polym. Sci. 80, 1-47, 1986.
  • [17] D. E. Kranbuehl, S. Delos, E. Yi, J. Mayer, T. Jarvie, W. Winfree, and T. Hou: Dynamic dielectric analysis. Nondestructive material evaluation and cure cycle monitoring. Polym. Eng. Sci. 26, 338-345, 1986.
  • [18] G. Williams, I. K. Smith, P. A. Holmes, and S. Varma: Real-time dielectric studies of polymerizing systems. J. Phys. Condens. Mat. 11, A57-A74, 1999.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BWAD-0016-0031
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