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Experimental study of power IGBT technologies at large range temperature

Wybrane pełne teksty z tego czasopisma
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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Aeronautical power electronics applications impose high power density handling and device operation temperatures. SiC technology not being mature enough, the temperature limits of silicon devices must be pushed in order to increase current ranges and the amount of switched power. Device ageing is accelerated and there exist the risk of catastrophic failure by thermal runaway. In order to design correctly high temperature power systems, knowing the IGBT characteristics at extended temperature ranges (-55*C, +175*C) becomes essential. The present work describes an experimental setup and test procedure conceived to experiment with different available IGBT technologies at temperatures above the limits rated by manufacturers. The aim is to generate experimental data for the creation of accurate models with large temperature scale. This will ease prototyping for future development of IGBT modules in aircraft.
Rocznik
Strony
513--532
Opis fizyczny
Bibliogr. 13 poz., il., wykr.
Twórcy
autor
autor
autor
autor
autor
  • Laas-CNRS Laboratory, University of Toulouse, France 7 Avenue du Colonel Roche - 31077 Toulouse Cedex 4, jlfocksu@laas.fr
Bibliografia
  • 1. M. Rahimo, D. Shneider, R. Schnell, S. Eicher, U. Schlapbach: HiPak Modules with SPT+ technology rated up to 3.6 kA. PCIM06', Nürnberg (Germany).
  • 2. M. Bassler, P. Kanschat, F. Urnbach, C. Schaeffer: 1200V IGBT4 - High Power - a new technology generation with optimized characteristics for high current modules. PCIM06', Nürnberg (Germany).
  • 3. M. Avram, G. Brezeanu, A. Avram, O. Neagoe, M. Brezeanu, C. Iliescu, C. Codreanu, C. Voitincu: Contributions to development of high power sic-igbt. Semiconductor Conference, Vol. 2., 3-5 oct. 2005, pp. 365-368.
  • 4. K. Sheng, B. W. Williams, S. J. Finney: Maximum operating junction temperature of PT and NPT IGBTs. Electronics Letters, Vol. 34 No. 23., 12th November 1998, pp. 2276-2277.
  • 5. K. Sheng, S. J. Finney, B. W. Williams: Thermal Stability of IGBT High-Frequency Operation. IEEE Transactions on Industrial Electronics, vol. 47, no. 1, february 2000.
  • 6. F. Calmon, S. Lefebvre, J. P. Chante, D. Ligot, B. Reymond: Thermal behaviour of pt and npt IGBT. Power Electronics and Variable-Speed Drives, Conference Publication No 399, pp. 26-28 October 1994.
  • 7. S. Azzopardi, C. Jamet, J.-M. Vinassa, C. Zardini: emphSwitching Performances Comparison of 1200V Punch-Through and Non Punch-Through IGBTs under Hard-Switching at High Temperature. Conf. Rec. of IEEE-PESC, June 1998, pp. 1201-1207.
  • 8. G. Busatto, C. Abbate, B. Cascone, R. Manzo, L. Fratelli, G. Giannini, F. Iannuzzo, F. Velardi: Characterisation of high-voltage IGBT modules at high temperature and high currents. PESD, Volume 2, 17-20 Nov. 2003, pp. 1391-1396.
  • 9. S. Azzopardi, A. Kawamura, H. Iwamoto: Characterization of 1200V Trench IGBT Using Local Lifetime Control for Clamped Inductive Load under Extensive Measurements without Freewheeling Diode Reverse Recovery Influence. Power Electronics Congress, VII IEEE International Volume Issue, 2000, pp. 249-256.
  • 10. S. Azzopardi, A. Kawamura, H. Iwamoto: Soft-Switching Turn-off Characterization at High Temperature of 1200V Trench IGBT Using Local Lifetime Control. Proceedings of 2001 International Symposium on Power Semiconductor Devices & ICs, Osaka, 2001, pp. 319-322.
  • 11. S. Azzopardi, A. Benmansour, M. Ishiko, E. Woigard: Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectronics Reliability, no. 45, 2005, pp. 1700-1705.
  • 12. E. Santi et al.: Temperature Effects on Trench-Gate Punch-Through IGBTs. IEEE Transactions on Industry Applications, vol. 40, no 2, March-April 2004, pp. 472-482.
  • 13. J. M. Guichon et al. Busbar Design: How to Spare Nanohenries? 41st IAS Annual Meeting, Conference Record of the 2006 IEEE, vol. 4, Oct. 2006, pp. 1865-1869.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BWAD-0013-0027
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