Photoimageable thick-film microwave structures up to 18 GHz

• Autorzy: Dziurdzia B. , Magoński Z. , Nowak S. , Cież M. , Gregorczyk W. , Niemyjski W.
• Języki publikacji: EN

Abstrakty

EN

The increasing interest in new wireless applications is creating demand for low cost, high performance microwave hybrid circuits. Offering the inherent advantages of thick-film technology such as low manufacturing costs and feasibility for mass production, recent improvements in thick film materials and processing techniques broadens the frequency range where ceramic thick-film circuits can be used and allow current thick-film technology to reach beyond its previous limitations and enter the domain reserved in the past for thin film technology. This paper discusses the advanced thick-film technique called photoimageable thick-film technology that uses photosensitive conductor and dielectric pastes and photoimaging as a method of patterning for manufacturing microwave hybrids operating in the frequency range up to 18 GHz.

• Wydawca: Institute of Electron Technology
• Czasopismo: Electron Technology : Internet Journal
• Rocznik: 2004
• Tom: Vol. 36, nr 1
• Strony: 1--10
• Opis fizyczny: Bibliogr. 9 poz., fot., rys., tab., wykr.

Twórcy

autor

Dziurdzia B.

• Academy of Mining and Metallurgy, AGH, al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Magoński Z.

• Academy of Mining and Metallurgy, AGH, al. Mickiewicza 30, 30-059 Kraków, Poland

autor

Nowak S.

• Institute of Electron Technology, Department in Kraków, ul. Zabłocie 39, 30-701 Kraków, Poland

autor

Cież M.

• Institute of Electron Technology, Department in Kraków, ul. Zabłocie 39, 30-701 Kraków, Poland

autor

Gregorczyk W.

• Telecommunications Research Institute, il. Poligonowa 30, 04-051 Warszawa, Poland

autor

Niemyjski W.

• Microwave Systems Poland, ul. Budowlanych 48, 80-298 Gdańsk, Poland

Bibliografia

• 1. DuPont Data Sheets: www.dupont.com/mcm/
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• 3. P. Barnwell, Ceramic Circuitry - A Technology for the Future, 38th IMAPS Nordic Conf., Oslo, Norway, 2001, 8488.
• 4. Z. Tian, Ch. Free, C. Aitchison, P. Barnwell, J. Wood, Multi-Layer Thick-Film Microwave Components and Measurement, Microelectron. Int. 2003, 20, 1, 7-20.
• 5. B. Dziurdzia, Z. Magoński, M. Cież, W. Gregorczyk, Thick-Film Photoimageable Conductor and Dielectric in Microwave Circuits, 48 Int. Wissenschaft Kolloq. Technische Universität Ilmenau, Germany, 22-25.09.2003.
• 6. J. Crute, L. Davis, Loss Characteristics of High Ɛγ Microstrip Lines Fabricated by an Etchable Thick-Film on Ceramic MCM Technology, IEEE Tran., on Adv. Packag., 2002, 25, 3, 393-396.
• 7. B. Dziurdzia, S. Nowak, Z. Magoński, M. Cież, W. Gregorczyk, W. Niemyjski, On the Design and Fabrication of Photoimageable Thick-Film Multilayer Filters and Couplers, 27S Int. Conf. a. Exhib. IMAPS-Poland 2003, Podlesice, 16-19.09.2003, 143-149.
• 8. B. Dziurdzia, Z. Magoński, M. Cież, W. Gregorczyk, Photoimageable Dielectric-Processing, Properties, Compatibility with Conventional Thick-Film Conductors, 26th Int. Conf. a. Exhib. IMAPS-Poland 2002, 25-27.09.2002, Warszawa, Poland, 134-141.
• 9. W. Marczewski, Niemyjski W., The Overlapped Microstrip Lines for MICs and MMICs, 14th Europ. Microwave Conf., Liege, Belgium, Sept. 1984.