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Free-space micro-optical modules: the missing link for photonic interconnects to sillicon chips

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The Second School of Photonics in Information Processing ; (7.11-11.11.2000 ; Stare Jabłonki , Poland)
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We report on design, fabrication, characterisation, and demonstration of scalable multi-channel free-space intercinection components with the potential for Tb/s cm² aggregate bit rate capacity over inter-chip interconnection distances. The demonstraton components are fabricated in a high quality optical plastic, PMMA, using an ion-based rapid prototyping technology that we call deep proton lithography. With the presently achieved Gigabit/s data rates for each of the individual 16channels with a BER smaller than 10⁻¹³ and with inter-channel cross-talk lower than -22 dB the module aims at optically interconnecting 2D opto-electronic VCSEL and receiver arrays, flip-chip mounted on CMOS circuitry. Furthermore, using ray-tracing software and radiometric simulation tools, we perform a sensitivity analysis for misalignment and fibrication errors on these plastic micro-optical modules and we study industrial fabrication and material issues related to the mass-replication of these components through injecton-molding techniques. Finally, we provide evidence that these components can be mass-fabricated in dedicated, highly-advanced optical plastics at low cost and with the required precision.
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  • Depertament of Applied Physics and Photonics & Cyclotron Department, Vrije Universiteit Brussel, 2 Pleinlaan Str., B-1050 Brussels, Belgium, hthienpo@rub.ac.be
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bwmeta1.element.baztech-article-BWA2-0005-0213
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