Bonding technologies for 3D-packaging

• Autorzy: Wolter K. J. , Meier K. , Saettler P. , Panchenko I. , Froemmig M.

Warianty tytułu

PL

Technologie bondingu dla opakowań trójwymiarowych

• Języki publikacji: EN

Abstrakty

EN

Electronics System Integration by System in Package improves the performance, reduces the size, power and cost of electronic systems. Three dimensional Systems in Package are a new way for integrating functional blocks in vertical structures. This implementation leads to shorter signal and power interconnects and this results in lower propagation delay and power consumption. The paper will introduce the 3D-integration technologies and present bonding technologies for Package-on-Package (PoP) and Die-to-Wafer 3D-technologies. Results of our research group on "Highly Reliable 3D-Microsystems" in the field of reliable solder interconnections, through-silicon-via (TSV) technologies, self-alignment approaches for die stacking, die-to-die bonding by Cu/Sn solid-liquid-interdiffusion (SLID) technology and the application of Ag-nanowire arrays for anisotropic conductive adhesives will be demonstrated.

PL

Technologia Integracji Systemów Elektroniki przez metodę System w Pakiecie poprawia wydajność, zmniejsza wielkość, moc i koszt systemów elektronicznych. Trójwymiarowe Systemy w Pakiecie to nowy sposób na zintegrowanie funkcjonalnych bloków w struktury pionowe. Implementacja ta prowadzi do krótszego sygnału i mocy połączeń, a to prowadzi do zmniejszenia opóźnienia propagacji i zużycia energii. W tym artykule przedstawione zostanie wprowadzenie do tematu integracji technologii 3D i bondingu dla technologii 3D typu Package-on-Package (PoP) oraz Die-to-Wafer. Omówione zostaną wyniki dotyczące "Wysoce Niezawodnych Mikrosystemów 3D" w zakresie wiarygodnego lutowania połączeń, technologii przelotek wewnętrz krzemu (TSV), samowyrównywania stosu, bondingu die-to-die poprzez interdyfuzje Cu/Sn (SLID) oraz zastosowanie srebrnych nanorurek dla anizotropowo przewodzących klejów.

Słowa kluczowe

EN

3D integration; TSV; self-alignment; Cu/Sn bonding; nanowire

PL

integracja 3D; przelotki wewnętrz krzemu; samowyrównywanie; bondowanie Cu/Sn; nanorurki

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Elektronika : konstrukcje, technologie, zastosowania
• Rocznik: 2012
• Tom: Vol. 53, nr 4
• Strony: 9--14
• Opis fizyczny: Bibliogr. 30 poz., il., rys.

Twórcy

autor

Wolter K. J.

autor

Meier K.

autor

Saettler P.

autor

Panchenko I.

autor

Froemmig M.

• Matthias Graf Technische Universitat Dresden, Electronics Packaging Laboratory, Dresden, Germany

Bibliografia

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