Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

• Autorzy: Zhang Y. , Wang S. , Ma S. , Hu Z. , Liu J. , Sitek J. , Janeczek K.

Warianty tytułu

PL

Analiza numeryczna transferu ciepła przez interfejs mikro-radiatora ze strukturami CNT

• Konferencja: 35th International Microelectronics and Packaging IMAPS - IEEE CPMT Poland Conference ; 21-24.09. 2011 ; Gdańsk Sobieszewo, Poland
• Języki publikacji: EN

Abstrakty

EN

Micro-cooling techniques provide a promising solution for the thermal management of electronics system with increasing microprocessor powers. Carbon nanotubes (CNTs) can be utilized in micro-coolers as basic materials to constitute the heat dissipation structures inside. The interfaces involved in the CNT-based micro-cooler include the one between the CNT and the coolant, and the CNT and the adhesive. The heat transfer through these interfaces plays an important role in the thermal performance of the micro-cooler. In this paper, numerical investigations on thermal resistance across interfaces between the CNT and other materials are carried out by molecular dynamics simulation (MDS), and various cases are studied.

PL

Technika mikrochłodzenia stanowi obiecujące rozwiązanie w zarządzaniu ciepłem systemów elektronicznych wraz ze wzrostem mocy mikroprocesorów. Nanorurki węglowe (CNTs) mogą być wykorzystane w mikroradiatorach, jako podstawowy material służący do tworzenia struktur rozpraszających ciepło w ich wnętrzu. Interfejsami w mikroradiatorach opartych na CNTs są obszary między CNT i substancją chłodzącą oraz między CNT i klejem. Transfer ciepla przez te interfejsy ma istotny wpływ na wydajność mikroradiatora. W artykule ukazano wyniki analiz numerycznych transferu ciepła przez interfejsy pomiędzy CNT i innymi materiałami przeprowadzone za pomocą symulacji dynamiki molekularnej (MDS) dla różnych przypadków.

Słowa kluczowe

EN

thermal management; CNT; MDS

PL

zarządzanie ciepłem; nanorurki węglowe (CNT); symulacja dynamiki molekularnej (MDS)

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Elektronika : konstrukcje, technologie, zastosowania
• Rocznik: 2012
• Tom: Vol. 53, nr 1
• Strony: 17--19
• Opis fizyczny: Bibliogr. 15 poz., rys.

Twórcy

autor

Zhang Y.

autor

Wang S.

autor

Ma S.

autor

Hu Z.

autor

Liu J.

autor

Sitek J.

autor

Janeczek K.

• Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, School of Mechatronics Engineering and Automation, Shanghai University, China

Bibliografia

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