Virtual prototyping for thermal management for advanced electronics packaging

• Autorzy: Przekwas A.
• Konferencja: Mixed Design of Integrated Circuits and Systems. 5 International Conference MIXDES' 98 (18-20.06.1998 ; Łódź, Poland)
• Języki publikacji: EN

Abstrakty

EN

Emerging mixed technology multi-chip packages integate several active and passive devices in a small footprint single substrate and are driven at ever increasing frequencies and operate at high power densities. Fabrication and design of these devices heavily relies on trial and error tests as no reliable mixed technology packaging CAD tools are currently avaible. This paper presents a new concept of Virtual Prototyping of electronics packaging and demonstrates it on the thermal management of microelectronic devices/packages/systems. Geometric modelling and solution adaptive grid generation is shown to play a pivotal role in rapid prototyping of advanced packages. A novel concept of multi-scale physical design is also presented and illustrated on concurrent electro-thermo-mechanical design of microelectronics at several levels spanning IC-level of a devices, die level, to package, board all the way up to entire system level design. The paper also expolores new ideas of multi-disciplinary design, so essential for mixed systems, involving both fabrication process (molding, curing, underfilling, reflow) and physical design (thermal, mechanical, electric, optical, electromagnetic,etc.).

• Wydawca: Institute of Electron Technology
• Czasopismo: Electron Technology
• Rocznik: 1999
• Tom: Vol. 32, No. 3
• Strony: 209--214
• Opis fizyczny: Bibliogr. 16 poz.

Twórcy

autor

Przekwas A.

• CFD Research Corporation, 215 Wynn Dr., Huntsville, Alabama, USA,