Heat Conduction in Grinding

• Autorzy: De Payrebrune K. M. , Kuhnert M. , Kroger M.
• Języki publikacji: EN

Abstrakty

EN

Grinding is used as finishing process to increase surface quality but also as main manufacturing operation to generate workpiece geometries. Within the contact area of workpiece and grinding wheel the material removal takes place by irregular abrasive grain engagements. The sliding movement of the grinding wheel and the tangential force component lead to rising temperatures within the workpiece. Due to that, burning or structural changes of the material can occur. This decreases the quality of the manufactured workpiece. To find stable process parameters with high efficiency, models are needed to predict the heat distribution. In this work especially the heat conduction of simple grinding processes are analyzed and predicted by an analytical solution. Temperature measurements at special points and measurements of the heat distribution are used to verify the calculations.

Słowa kluczowe

EN

grinding; process machine interaction; heat conduction; analytical solution

• Wydawca: Oficyna Wydawnicza Politechniki Warszawskiej
• Czasopismo: Machine Dynamics Research
• Rocznik: 2011
• Tom: Vol. 35, No. 4
• Strony: 92--104
• Opis fizyczny: Bibliogr. 19 poz., il., wykr.

Twórcy

autor

De Payrebrune K. M.

autor

Kuhnert M.

autor

Kroger M.

• University of Technology Bergakademie Freiberg. Institute for Machine Elements, Design and Manufacturing,

Bibliografia

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