Laser soldered packaging hermeticity measurement using metallic conductor resistance

• Autorzy: Seigneur F. , Maeder T. , Jacot J.
• Języki publikacji: EN

Abstrakty

EN

Packaging is the las step of the manufacturing processes of microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the two parts of the package using a laser diode. The advantage of the laser soldered joint are its hermeticity to water and air in regard to glue and plastics, as well as the possibility to heat only the soldered joint, without affecting its contents. This work presents results of this packaging process, together with a method used to measure the hermeticity based on the oxidation of a heated metal conductor such as tungsten. The resistance of the conductor, which is encapsulated inside the package, increases as oxygen and water diffuse through the seal, which provides a convenient semi-quantitative measurement.

Słowa kluczowe

EN

packaging process; laser soldered; laser diode; oxidation of a heated metal; resistance of the conductor

• Wydawca: Institute of Electron Technology
• Czasopismo: Electron Technology : Internet Journal
• Rocznik: 2005/2006
• Tom: Vol. 37/38, nr 8
• Strony: 1--5
• Opis fizyczny: Bibliogr. 8 poz., rys., wykr.

Twórcy

autor

Seigneur F.

• Ecole Polytechnique Fédérale de Lausanne, IPR, LPM, 1015 Lausanne Switzerland

autor

Maeder T.

• Ecole Polytechnique Fédérale de Lausanne, IPR, LPM, 1015 Lausanne Switzerland

autor

Jacot J.

• Ecole Polytechnique Fédérale de Lausanne, IPR, LPM, 1015 Lausanne Switzerland

Bibliografia

• 1. F. SEIGNEUR, Laser Sealed Packaging for Microsystems, IPAS, Bad Hofgastein, 2006.
• 2. D. VEYRIE et al., FTIR Spectroscopy for the Hermeticity Assessment of Micro-Cavities, Microelectron. Reliab, 2005, 45, (9-11), 1764-1769.
• 3. F. SEIGNEUR, Polymerisation de colle epoxy par laser, [in] Actes de la premiere journee sur la modelisation et l'analyse dimensionnelle - organized by EPFL, 2005, 17-20.
• 4. A. JOURDAIN, Hermeticity Investigation of Sealed 0-Level Packages Based on the Damping Characteristics of the MEMS Device, EMPC, 2005.
• 5. W. G. MOFATT (Ed.), The Handbook of Binary Phase Diagrams, General Electric, USA, 1982.
• 6. D. R. SPARKS, S. MASSOUD ANSARI, N. NADJAFI, Chip-Level Vacuum Packaging of Micromachines Using NanoGetters, IEEE Trans, on Advanced Packaging, 2003, 26 (3), 277-282.
• 7. R. RAMESHAM, Getters for Reliable Hermetic Packages, Jet Propulsion Laboratory Publ., USA, D-17920, 1999.
• 8. C. BOFFITO, B. FERRARIO, P.DELLA PORTA, L. ROSAI, A Nonevaporable Low Temperature Activatable Getter Material, J. Vacuum Sci. & Technol. 1981, 18 (3), 1117-1120.