Scanning acoustic microscopy for non-destructive tests of electronic components

• Autorzy: Sutor A. , Winkler G. , Bischoff G.
• Języki publikacji: EN

Abstrakty

EN

Scanning acoustic microscopy (SAM) is an attractive tool in the non-destructive inspection of printed circuit boards, thick film, thin layers and microelectronic packages. For example it permits to detect subsurface delaminations, cracks and pores (air bubbles) for different materials: metals, plastics, ceramics or composites. The examples of different electronic components and circuits observed in SONOSCAN D-9000 ultrasonic microscope with frequencies of transducers between 10 Mhz and MHz and 230 MHz are presented in this paper.

Słowa kluczowe

EN

scanning acoustic microscopy; printed circuit boards; thick film; thin layers; microelectronic packages

• Wydawca: Institute of Electron Technology
• Czasopismo: Electron Technology : Internet Journal
• Rocznik: 2005/2006
• Tom: Vol. 37/38, nr 7
• Strony: 1--4
• Opis fizyczny: Bibliogr. 8 poz., il.

Twórcy

autor

Sutor A.

• Technical University of Ilmenau, Electronics Technology Group, Ilmenau P. O. Box 10 05 65, D-98694 Ilmenau, Germany

autor

Winkler G.

• Technical University of Ilmenau, Electronics Technology Group, Ilmenau P. O. Box 10 05 65, D-98694 Ilmenau, Germany

autor

Bischoff G.

• Technical University of Ilmenau, Electronics Technology Group, Ilmenau P. O. Box 10 05 65, D-98694 Ilmenau, Germany

Bibliografia

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• 5. SONOSCAN Inc: www.sonoscan.com
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