A De-NOx process using high voltage discharge in gases

• Autorzy: Wroński A.
• Języki publikacji: EN

Abstrakty

EN

Chemical processes induced by energetic electrons in nonequilibrium low temperature plasma applied to remove NOx from flue gas have been studied. Plasma has been generated by HV feeder (25kV, 30 - 300 Hz) or by the pulse system. Gas mixtures imitating flue gases have been obtained by mixing individual components (gas flow rate 10 - 200 dcm exp.3/h). The influence of discharge power and gas composition on the efficiency of NOx decomposition process has been studied. It is possible to obtain over 90% degree of NO decomposition at big values of discharge power. The presence of O2 and CO2 in flue gases reduces the process efficiency even by 50%. The most important additive that makes this process more effective is water vapour.

Słowa kluczowe

EN

nitrogen oxides; non-equilibrium plasma; electrical discharge; flue gas

• Wydawca: West Pomeranian University of Technology. Publishing House
• Czasopismo: Polish Journal of Chemical Technology
• Rocznik: 2001
• Tom: Vol. 3, nr 4
• Strony: 37--39
• Opis fizyczny: Bibliogr. 8 poz., tab., wykr.

Twórcy

autor

Wroński A.

• Politechnika Lubelska, ul. Nadbystrzycka 40, 20-618 Lublin, Poland

Bibliografia

• (1) Masuda S., Non-Thermal Plasma Techniques for Pollution Control, NATO ASI, Seri G, Edited by B. Penetrante and S. Schulthiers, 1993, v. 34B, 131 - 138.
• (2) Visvathan K., J. Ind. Chem. Soc., 1952, 25, 307.
• (3) Pollo I., Dissertation, Politechnika Slaska, Gliwice, Poland, 1960.
• (4) Penetrante B., Non-Thermal Plasma Techniques for Pollution Control, NATO ASI Seri G, 1993, v. 34B, 65 - 90.
• (5) Klein M., Brannston D., Lins G., Romheld M., Seebock R., Proc. 11th Conf. On Gas Discharges and Their Applications, Tokyo, Japan, 1995 vol. II, 414 - 417.
• (6) Dors M., Mizeraczyk J., Polish J. of Appl. Chem., 1998, XLII, 2, 129 - 134.
• (7) Ryo O., Tetsuji O., Proc. The First Pol-Jap. Hakone Group Symp., Sopot, Poland, 2000, 81 - 84.
• (8) Gallimberti I., Pure and Appl.Chem., 1988, 60, 663 - 674.