The influence of abrasive machine on temperature during one side lapping

• Autorzy: Molenda J. , Charchalis A.
• Języki publikacji: EN

Abstrakty

EN

Lapping process is characterized by its low speed, low pressure, and low materiał removal. It 's carried out by applying loose abrasive grains between work and lap surfaces, and causing a relative motion between them resulting in afinish of multi-directional lay. The grains activities in the working gap cause temperature rise of lap plate. In their work Bulsara and others studied the heat generated during lapping and polishing. They developed a moving heat source model to estimate the maximum and average temperature rise of abrasive-workpiece contacts. The heat generated at this contact was taken as aproduct of the friction force and the relative sliding velocity between abrasive and work surface. The model verification showed that real lap plate temperature rise was different from calculated. This work presents the results of lapping plate temperature rise research. The investigation has been conducted to check the influence of lapping machine on temperature rise. It was made during flat lapping with use of ABRALAP 380 lapping machine and thermographic camera V-20 II produced by VIGO System SA. The lapping machine executory system consists of three conditioning rings. Lapping plate temperature was measured during machine's work without, with one, two and three rings. Results of the measurements showed that even when lapping machine was working without load i.e. without rings, there was observed lap plate temperature rise. This wasn't taken into consideration in mentioned model and there is necessity to develop more comprehensive one.

Słowa kluczowe

EN

one side lapping; temperature rise model; executory system temperature; thermal imaging measurements; lapping parameters; lapping machine executory system

• Wydawca: Łukasiewicz Research Network - Institute of Aviation ; European Science Society of Powertrain and Transport KONES Poland ; Wydawnictwo Instytutu Technicznego Wojsk Lotniczych
• Czasopismo: Journal of KONES
• Rocznik: 2010
• Tom: Vol. 17, No. 2
• Strony: 357--362
• Opis fizyczny: Bibliogr. 10 poz., rys.

Twórcy

autor

Molenda J.

autor

Charchalis A.

• Gdynia Maritime University, Faculty of Marine Engineering Morska Street 81-87, 81-225 Gdynia, Poland tel.:[phone], fax [phone],

Bibliografia

• [1] Bulsara, V. H., Ahn, Y., Chandrasekar, S., Farris, T. N., Polishing and lapping temperatures, Journal of Tribology, Vol. 119, 1997.
• [2] Horng, J. H., Jeng, Y. R., Chen, C. L., A model for temperature rise of polishing process considering effects of polishing pad and abrasive, Transictions of ASME, Vol. 126, 2004.
• [3] Kukiełka, L., Podstawy badań inżynierskich, Wydawnictwa Naukowe PWN, Warszawa 2002.
• [4] Marinescu, I. D., Uhlmann, E., Doi, T. K., Handbook of lapping and polishing, CRC Press, Boca Raton, London, New York 2007.
• [5] Molenda, J., Barylski, A., Analiza modelu matematycznego opisującego wzrost temperatury podczas docierania jednostronnego powierzchni płaskich, Journal of KONES Powertrain and Transport, Vol. 16, No. 4, 2009.
• [6] www.engis.com
• [7] www.kemet.co.uk
• [8] www.lapmaster.com
• [9] www.peter-wolters.com
• [10] www.stahli.com