Fototoacoustic measurements of the thermal properties of the electrically conducting glues used in the assembly of hybrid circuits

• Autorzy: Maliński M. , Bychto L.
• Języki publikacji: EN

Abstrakty

EN

In this paper the results of the photoacoustic measurements of the electrically conducting i are presented and discussed. The aim of this work was to estimate the value of the conductivity .thermal diffusivity and thermal diffusivity of the thick glue layers and : the results with the corresponding values of other typical solders and silicon. As the electrically conducting glue the unary paste EKO Solder AX201 with the silver powder filling was used and examined..

• Wydawca: Silesian Division of Polish Acoustical Society
• Czasopismo: Molecular and Quantum Acoustics
• Rocznik: 1998
• Tom: Vol. 19
• Strony: 169--177
• Opis fizyczny: Bibliogr. 12 poz., rys.

Twórcy

autor

Maliński M.

autor

Bychto L.

• Institute of Electronics. Technical University of Koszalin. .17 Partyzantów Str. 75-411 Koszalin Poland