Trends in wettability studies df Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wertability of lead-free Sn-Zn and Sn-Bi-Sb alloys

• Autorzy: Bukat K. , Moser Z. , Gąsior W. , Sitek J. , Kościelski M. , Pstruś J.

Warianty tytułu

PL

Kierunki badań zwilżalności lutowi bezołowiowych. Badania podstawowe i aplikacyjne. Część II. Korelacje pomiędzy napięciem powierzchniowym, napięciem międzyfazowym i zwilżalnością stopów Sn-Zn i Sb-Zn-Bi-Sb

• Języki publikacji: EN

Abstrakty

EN

The surface tension of a mol ten alloy plays an important role in determining the wetting behavior of solders. The systematic measurements of surface tension by the maximum bubble pressure method, in Ar + H2 atmosphere, were performed at the Institute of Metallurgy and Materials Science, Polish Academy of Sciences in Kraków (IMIM PAS). In parallel, the surface tension and interfacial tension were measured by the Miyazaki method, using wetting balance techniąue, in air and in N2 atmospheres, at the Tele and Radio Research Institute (ITR) in Warsaw. Both of these methods were used for a comparative analysis of the Sn-Zn and Sn-Zn-Bi-Sb alloys manufactured by Institute of Non-Ferrous Metal in Gliwice (INMET INM). The authors would like to know how the addition of Bi and Sb elements to the eutectic Sn-Zn alloy influences the changes of the surface tension and wettability on copper substrate. It has been found that addition of Bi and Sb to the Sn-Zn alloy decreases surface tension. A morę evident decreasing tendency of surface tension was noted in wetting balance(meniscographic) measurements, especially of an interfacial tension measured in presence of a flux. The results of the surface tension from both methods are comparable. Strong interaction between Bi and Sb elements in the Sn-Zn-Bi-Sb alloys was demonstrated by variance analysis (ANOVA). The wettability results of investigated zinc alloys on Cu substrate were unexpected: the better wettability of eutectic Sn-Zn alloy than this modified by addition of Bi and Sb Sn-Zn was obtained. It appeared therefore that modified Sn-Zn-Bi-Sb solders were useless for soldering from technological point of view. So, the next wettability investigation will concentrate on new Sn-Zn-Bi alloy compositions with smali amount of Zn. The surface tension of this alloy is not known.

PL

Napięcie powierzchniowe ciekłych stopów odgrywa ważną rolę w zwilżalności lutowi. Systematyczne badania napięcia powierzchniowego za pomocą metody maksymalnego ciśnienia w pęcherzykach gazowych w atmosferze argonu z wodorem zostały przeprowadzone w Instytucie Metalurgii i Inżynierii Materiałowej Polskiej Akademii Nauk (IMIM PAN) w Krakowie. Równolegle prowadzono pomiary napięcia powierzchniowego i napięcia międzyfazowego za pomocą metody Miyazaki techniką meniskograficzną w powietrzu i w atmosferze azotu w instytucie Tele i Radiotechnicznym w Warszawie. Wyniki z obu instytutów zostały porównane dla stopów Sn-Zn i Sn-Zn-Bi-Sb wykonanych w Instytucie Metali Nieżelaznych w Gliwicach (INMET IMN). Celem tych badań było wykazanie w jakim stopniu dodatki Bi i Sb do eutektyki Sn-Zn wpływają na zmiany napięcia powierzchniowego i zwilżalności na podkładach z miedzi. Wykazano, że dodatki Bi i Sb do stopów Sn-Zn obniżają napięcie powierzchniowe. Znacznie wyraźniejszą tendencję obniżania napięcia powierzchniowego zanotowano w pomiarach meniskograficznych, a w szczególności w napięciu międzyfazowym z użyciem topnika. Wyniki napięcia powierzchniowego z obu metod są porównywalne.

Słowa kluczowe

EN

wettability of Pb-free solders; surface tension; surface layers; Sn-Zn alloys; Sn-Zn-Bi-Sb alloys

PL

zwilżalność lutowi bezołowiowych; napięcie powierzchniowe; napięcie międzyfazowe; stopy Sn-Zn; stopy Sn-Zn-Bi-Sb

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2008
• Tom: Vol. 53, iss. 4
• Strony: 1065--1074
• Opis fizyczny: Bibliogr. 28 poz., rys.,tab.

Twórcy

autor

Bukat K.

autor

Moser Z.

autor

Gąsior W.

autor

Sitek J.

autor

Kościelski M.

autor

Pstruś J.

• TELE AND RADIO RESEARCH INSTITUTE, 03-150 WARSZAWA, 11 RATUSZOWA STR., POLAND

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